JPS62140437A - Pin grid array - Google Patents

Abstract

PURPOSE:To fit pins easily, and to mount the pins firmly to a substrate by projecting a plurality of the pins, tip sections thereof are insert-molded and fixed into the substrate, from the substrate. CONSTITUTION:A substrate 1 for mounting an electronic part chip is formed by a molded shape from a synthetic resin while a plurality of pins 2, 2..., tip sections thereof are insert-molded and fastened into the substrate 1, are projected from the substrate 1. The outer circumferences of the base sections of at least two pins 2 of a plurality of the pins 2, 2... are covered with positioning projecting sections 3 integrally protruded from the substrate 1. Consequently, the pins 2 are easily fixed firmly by insert molding, and the formation of collars for positioning to a mother board of the pins 2 is unnecessitated by the positioning projecting sections 3 integrally projected from the substrate 1. When a recessed section for mounting the chip is further shaped, the recessed section can be formed at the same time as the molding of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a pin grid array in an IC package or the like.

[Background technology] In response to the increase in the number of I10 elements and the shortening of lead lengths in semiconductor packages such as ICs, pin grid arrays (PG
A) has been devised. This pin grid 7-ray uses the entire back surface of the board to protrude a large number of pins, and the pins are attached to the device mounting board (motherboard).
By plugging into a socket or through-hole,
It can be attached to the motherboard. Ceramic has conventionally been mainly used as the material for the substrate, but in recent years, in response to lower prices, attempts have been made to use printed wiring boards obtained from resin laminates as the substrate.

That is, as shown in FIG. 2, the substrate 1 has a thickness of, for example, 1.
A circuit is formed on the surface of the substrate 1, and a pin hole 7 is drilled in the substrate 1, and a pin with a diameter of about 0.51 is formed. A large number of pins 2 are fixed in a protruding state from the substrate 1 by press-fitting the heads of the pins 2 into the bottle holes 7, thereby creating a pin grid array A.

However, in these cases, the process of machining the bottle hole 7 and press-fitting the bottle 2 into the bottle hole 7 is required in order to attach the pin 2. There is a problem in that there is a limit to the strength with which the bottle 2 can be press-fitted into the substrate 1 due to cracks, etc., and it is difficult to obtain sufficient pull-out strength of the bottle. Furthermore, when attaching the pin grid array A created as described above to the motherboard, it is necessary to form a predetermined space between the board 1 and the motherboard. At least two of the bottles 2 need to be provided with a collar 8 for positioning the dimensions for press-fitting into the bottle hole 7 of the board 1 and a collar 9 for positioning the dimensions for inserting the bins 2 into the motherboard. There was also a problem in the processing of the bottle 2 in order to provide an extra collar 9. Furthermore, in order to mount chips such as semiconductor chips, four cavities 10 are sometimes provided on the surface of the substrate 1, but when the substrate 1 is made of a printed wiring board, milling or other methods are used to form the recesses 10. It is necessary to perform counterbore processing, which requires time and effort, and there is also the problem that the bottom surface of the recess 10 has unevenness of the plus fiber that is the base material of the substrate 1, making it difficult to process the surface by plating or the like.

[Object of the Invention] The present invention has been made in view of the above points, and it has become possible to easily fix the bottle to the substrate and increase the pull-out strength. It is an object of the present invention to provide a bin grid array in which recesses can be easily formed.

[Disclosure of the Invention 1] However, the bin grid array according to the present invention includes a substrate 1 for mounting electronic component chips made of a synthetic resin molded product, and a plurality of plastic parts whose ends are insert-molded into the substrate 1 and fixed thereto. The book bottles 2, 2... are made to protrude from the substrate 1,
It is characterized in that a positioning protrusion 3 integrally projected from a substrate 1 is coated on the outer periphery of the base of at least two of the plurality of bottles 2.2, and is made of synthetic resin molding. By insert molding the product onto the substrate 1, the bottle 2 can be easily and firmly fixed.
The positioning protrusion 3 that projects integrally from the bottle 2 eliminates the need to provide a collar for positioning the bottle 2 to the motherboard, and in addition, if a recess for chip mounting is to be provided, it can be formed at the same time as the substrate 1 is molded. The above object has been achieved, and the present invention will now be described in detail with reference to Examples.

FIG. 1 shows an embodiment of the present invention, in which a substrate 1 is made as a molded product by injection molding of synthetic resin or the like.

Then, when forming the substrate 1 in this way, the head 1 of the bottle 2 is
The connecting terminal pin 2 is attached to the substrate 1 by insert molding the connecting terminal 1 into the substrate 1.

The synthetic resin constituting the substrate 1 may include thermosetting resins such as 7-ether, epoxy, silicone, polyimide, etc., and thermoplastic resins such as polyphenylene sulfide, polysal 7-one, and polyneethylsulfone sulfone. However, from the viewpoint of flexibility and mechanical strength, it is preferable to use these thermoplastic resins which have excellent heat resistance.

It is preferable that the bottle 2 is provided with irregularities on the outer periphery of its head 11 so that a high pull-out strength from the substrate 1 can be obtained due to the anchor effect, and by doing so, the bottle 2 can also be prevented from wobbling. Further, a large number of the bottles 2 are attached so as to protrude from the back surface of the board 1, and at least two of the bins 2 have positioning protrusions 3 integrally projecting from the board 1 on the outer periphery of the base. It is coated all around. These positioning protrusions 3 are formed at the same time when the substrate 1 is molded, and the protrusion dimensions from the back surface of the substrate 1 are set to be equal. When providing the positioning protrusions 3 in this manner, if ribs connecting the positioning protrusions 3 are integrally provided on the back surface of the substrate 3, the substrate 1 can be reinforced by these ribs.
This becomes possible because the substrate 1 is formed thin. Each bottle 2 is provided with a flange 8 for positioning and strength for attachment to the substrate 1, but in the case of a bottle 2 provided with a positioning protrusion 3, this flange 8 is placed in contact with the tip of the positioning protrusion 3. The forming height is set.

Then, a circuit is formed on the surface of the substrate 1 by a suitable means such as etching metal foil, this circuit is connected to each pin 2, and an electronic component chip 4 such as a semiconductor chip is mounted on the surface of the substrate 1 to perform an electronic circuit. A pin grid array A is completed by connecting the component chip 4 and each pin 2 via a circuit. In addition, when mounting the electronic component chip 4, a recess 10 for housing the electronic component chip 4 is provided.
is provided on the surface of the substrate 1 as necessary, but this recess 10
can be formed by providing a protrusion in the cavity of the mold when molding the substrate 1, and there is no need for the process of providing the four parts 10 later by counterboring, etc. Furthermore, there is no fear that unevenness will occur on the bottom surface of the recess 10.

In the pin grid array A formed in this way, devices are attached to the mounting board (motherboard) by inserting each pin 2 into a socket or through hole provided on the motherboard 12. The tip of the protruding positioning protrusion 3 abuts against the surface of the motherboard 12 via the collar 8, and this abutment allows a space to be formed between the substrate 1 and the motherboard 12 with a predetermined gap. In addition, when the positioning protrusion 3 comes into contact with the motherboard 12 in this way, the motherboard 12
The load applied between the pin 2 and the substrate 1 is supported by the positioning protrusion 3, and deformation of the pin 2 can also be prevented.

[Effects of the Invention] As described above, in the present invention, a substrate for mounting an electronic component chip is formed from a molded product of synthetic θ resin, and the ends of the molded product are inserted into the substrate and fixed. Since the pins protrude from the board, when molding the board with synthetic resin, the pins can be inserted into the board and fixed to the board, reducing the man-hours of drilling holes and press-fitting the pins. This allows the pin to be easily attached to the board without the need for a pin, and it also allows the pin to be firmly attached to the board without destabilizing the pull-out strength that occurs when the pin is press-fitted. When providing a recess for chip mounting, the recess can be formed at the same time as the substrate is molded, and there is no need for counterboring or other processing to form the four parts. In addition, since the positioning protrusion integrally protruding from the board is made to cover the outer periphery of the base of at least two of the plurality of pins, the positioning protrusion integrally protruding from the board provides a gap between the motherboard and the board. This eliminates the need to provide a collar for positioning the pin to the motherboard, and eliminates the need for time and effort in manufacturing the pin.

[Brief explanation of drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1 is a substrate, 2 is a pin, 3 is a positioning protrusion, and 4 is an electronic component chip.

Claims (1)

[Claims] (1) A board for mounting an electronic component chip is formed using a synthetic resin molded product, and the ends are insert-molded into the board to have multiple fixed pins protruding from the board, so that they protrude integrally from the board. 1. A pin grid array comprising a positioning protrusion covering the outer periphery of the base of at least two of the plurality of pins.