JPS62134275U - - Google Patents
Info
- Publication number
- JPS62134275U JPS62134275U JP2260286U JP2260286U JPS62134275U JP S62134275 U JPS62134275 U JP S62134275U JP 2260286 U JP2260286 U JP 2260286U JP 2260286 U JP2260286 U JP 2260286U JP S62134275 U JPS62134275 U JP S62134275U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- soldering
- soldering surface
- circuit board
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 1
Description
第１図及び第２図は、この考案の一実施例を示
す要部斜視図、第３図はこの考案の他の実施例を
示す要部斜視図、第４図及び第５図はそれぞれこ
の考案のさらに他の実施例を示す要部平面図、第
６図及び第７図はこの考案の実施例であるパネル
ヒータを示す平面図及び要部断面図、第８図ない
し第１０図は従来の回路板装置を示し、第８図は
要部斜視図、第９図は要部断面図、第１０図はリ
ード線５に引張り力が加わつた時の要部断面図で
ある。
図において、１は絶縁基板、２は導電層、５は
リード線、１０は半田付面、１０ａは接続面、１
０ｂ，１０ｃは補強面、１１は半田部である。な
お、各図中同一符号は同一または相当部分を示す
ものとする。
Figures 1 and 2 are perspective views of essential parts showing one embodiment of this invention, Figure 3 is a perspective view of essential parts showing another embodiment of this invention, and Figures 4 and 5 are respectively views of this invention. FIGS. 6 and 7 are plan views and sectional views of main parts showing a panel heater according to another embodiment of the invention, and FIGS. 8 to 10 are views showing a conventional panel heater. 8 is a perspective view of the main part, FIG. 9 is a sectional view of the main part, and FIG. 10 is a sectional view of the main part when a tensile force is applied to the lead wire 5. In the figure, 1 is an insulating substrate, 2 is a conductive layer, 5 is a lead wire, 10 is a soldering surface, 10a is a connection surface, 1
0b and 10c are reinforcing surfaces, and 11 is a solder portion. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
面の両端から延在して互いに離隔対向する一対の
補強面とからなる半田付面を有する導電層、上記
絶縁基板面に沿い、かつ上記半田付面の両補強面
に挾まれて配設されるとともに、端部が上記半田
付面の接続面上に配設されるリード線、上記半田
付面の接続面上および補強面上に形成され、上記
リード線の端部を上記半田付面に固着させる半田
部を備えた回路板装置。 (2) 半田付面は導電層上に形成される絶縁層に
より形状が規制されていることを特徴とする実用
新案登録請求の範囲第１項記載の回路板装置。 (3) 半田付面は導電層の端部に位置し、半田付
面の形状と導電層の端部の形状とが一致している
ことを特徴とする実用新案登録請求の範囲第１項
記載の回路板装置。[Claims for Utility Model Registration] (1) A conductive layer provided on an insulating substrate and having a soldering surface consisting of a connecting surface and a pair of reinforcing surfaces extending from both ends of the connecting surface and facing each other at a distance; A lead wire that is disposed along the insulating substrate surface and sandwiched between both reinforcing surfaces of the soldering surface, and whose end portion is disposed on the connection surface of the soldering surface; A circuit board device comprising a solder portion formed on a connecting surface and a reinforcing surface for fixing an end of the lead wire to the soldering surface. (2) The circuit board device according to claim 1, wherein the shape of the soldering surface is regulated by an insulating layer formed on the conductive layer. (3) Claim 1 of the utility model registration claim characterized in that the soldering surface is located at the end of the conductive layer, and the shape of the soldering surface and the shape of the end of the conductive layer match. circuit board equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2260286U JPS62134275U (en) | 1986-02-18 | 1986-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2260286U JPS62134275U (en) | 1986-02-18 | 1986-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134275U true JPS62134275U (en) | 1987-08-24 |
Family
ID=30820141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2260286U Pending JPS62134275U (en) | 1986-02-18 | 1986-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134275U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716265B2 (en) * | 1972-11-29 | 1982-04-03 |
-
1986
- 1986-02-18 JP JP2260286U patent/JPS62134275U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5716265B2 (en) * | 1972-11-29 | 1982-04-03 |
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