JPS62131550A - ヒ−トシンク着脱機構 - Google Patents

ヒ−トシンク着脱機構

Info

Publication number
JPS62131550A
JPS62131550A JP60273073A JP27307385A JPS62131550A JP S62131550 A JPS62131550 A JP S62131550A JP 60273073 A JP60273073 A JP 60273073A JP 27307385 A JP27307385 A JP 27307385A JP S62131550 A JPS62131550 A JP S62131550A
Authority
JP
Japan
Prior art keywords
heat sink
cooling mechanism
solder
heating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60273073A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0335832B2 (enExample
Inventor
Haruhiko Yamamoto
治彦 山本
Yukihisa Katsuyama
勝山　幸寿
Shunichi Kikuchi
俊一 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60273073A priority Critical patent/JPS62131550A/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Publication of JPS62131550A publication Critical patent/JPS62131550A/ja
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0335832B2 publication Critical patent/JPH0335832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60273073A 1985-10-04 1985-12-03 ヒ−トシンク着脱機構 Granted JPS62131550A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP60273073A JPS62131550A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱機構
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273073A JPS62131550A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱機構

Publications (2)

Publication Number Publication Date
JPS62131550A true JPS62131550A (ja) 1987-06-13
JPH0335832B2 JPH0335832B2 (enExample) 1991-05-29

Family

ID=17522766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273073A Granted JPS62131550A (ja) 1985-10-04 1985-12-03 ヒ−トシンク着脱機構

Country Status (1)

Country Link
JP (1) JPS62131550A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046498A (en) * 1997-06-30 2000-04-04 Nec Corporation Device having a heat sink for cooling an integrated circuit
EP3270496B1 (en) * 2015-03-10 2021-11-24 Mitsubishi Electric Corporation Power conversion device and refrigeration cycle device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046498A (en) * 1997-06-30 2000-04-04 Nec Corporation Device having a heat sink for cooling an integrated circuit
US6251709B1 (en) 1997-06-30 2001-06-26 Nec Corporation Method of manufacturing a cooling structure of a multichip module
EP3270496B1 (en) * 2015-03-10 2021-11-24 Mitsubishi Electric Corporation Power conversion device and refrigeration cycle device

Also Published As

Publication number Publication date
JPH0335832B2 (enExample) 1991-05-29

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