JPS62131529A - Face down bonding device - Google Patents

Abstract

PURPOSE:To enable the face down bonding process to be performed with high precision by a method wherein the positional deflection corrected by a rough movement correcting mechanism suing a first tool etc., a chip is held by a second tool, and the positional deflection is limited to the allowance within the range of pattern mathing procedures for high precision alignment. CONSTITUTION:A first tool 9 vacuum-adsorbing a chip 3 on a chip arrayal exclusive jig a first camera 14 detecting an electrode pattern on the main surface of chip 3 vacuum-adsorbed by the first tool 9 and a rough movement correcting mechanism turn-correcting a collet of the first tool 9 referring to the data detected by the first camera 14 are provided. Next, a second tool 10 holding the chip 3 finely aligned by the rough movement correcting mechanism to be shifted on an intermediate pocket, a second camera 15 detecting another electrode pattern on the main surface of chip 3 vacuum-adsorbed by the second tool 10 and a fine movement correcting mechanism turn-correcting another collet of the second tool referring to the data detected by the second camera 15 are also provided. In such a constitution, even if there is any positional deflection exceeding the allowance of pattern matching procedures, the rough and fine movement correcting mechanisms can correct the position of stem accurately with high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technology for superimposing and supplying objects to be mounted, and particularly to a technology that is effective when applied to face-down bonding technology in the manufacture of semiconductor devices.

[Background technology]

2. Description of the Related Art Face-down bonding technology is known as one of the mounting technologies for semiconductor elements (referred to as chips) in the manufacture of semiconductor devices. The positioning of the board and the knob in this face-down bonding involves temporarily positioning a half mirror above the board.
After placing the chip on the top surface (ia) and positioning the pattern on the top surface (main surface) of the board and the pattern on the bottom surface (main surface) of the chip using a half mirror, place the chip on the half mirror using a tool (bonding tool). ), and then move the half mirror and lower the bonding tool to position and fix the chip.
1970 special edition, published November 5, 1970, P11
5. ), or technology that uses two monitor televisions (ITV) to position the board pattern and chip pattern and then fixes the chip to the board (
For example, “Monthly Sem” published by Press Journal Co., Ltd.
1conductor World separate volume 34'f3u
yersGuide & Direc-toryJ 1978
Flip chip bonders introduced on page 197, published on October 20, 2015) are known.

However, in this technology, the position correction (correction) is performed on a support stand that supports the chip.
The inventors have found that a problem arises in that it is difficult to correct the positional deviation of the corrected chip when it pinks up.

That is, for example, in face-down bonding of a light-emitting diode with a dome-shaped structure, when this light-emitting diode tip (chip) is vacuum-sucked by a collet, since the suction part is dome-shaped, the collet is used to vacuum-suck it. No matter how much the state of the chip, such as the position of the chip, is corrected beforehand, when the chip is suctioned by the collet, the pattern is likely to shift due to eccentricity of the chip because the suction part is dome-shaped. In addition, it has been found that if the accuracy of the chip supply position is poor, the chip may be held in a state that greatly deviates from the tolerance of pattern matching between the substrate and the chip, which causes a decrease in the yield of face-down bonding.

[Purpose of the invention]

An object of the present invention is to provide a face-down bonding device with high bonding accuracy.

Another object of the present invention is to provide a highly productive face-down bonding apparatus capable of high-speed bonding.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the face-down bonding apparatus of the present invention includes a first tool that vacuum-chucks a chip on a jig exclusively for chimp alignment, and a first tool that detects an electrode pattern on the main surface of the chip that is vacuum-chucks by the first tool. The collet of the first tool is precisely positioned by the camera and the coarse movement correction mechanism, and is transferred onto the intermediate pocket. A second tool that holds the chip, a second camera that detects the electrode pattern on the main surface of the chip vacuum-adsorbed by the second tool, and rotational correction of the collet of the second tool based on the detection information of the second camera. Since the first tool has a fine movement correction mechanism (adjustment section), the first tool holds a chip in a normal state that is positioned and placed on a chip storage jig or the like and is supplied by the coarse movement correction mechanism. When holding, even if a deviation larger than the pattern matching tolerance occurs, the roughness
Since the correction mechanism has a large correction amount set in advance, the position can be corrected. As a result, the positional accuracy of the chip supplied onto the intermediate pocket by the coarse movement correction mechanism is high. Therefore, when the second tool holds a chip that has been accurately supplied onto the intermediate pocket, even if the chip deviates while being held, the deviation will be within the pattern matching tolerance of the fine movement correction mechanism. Fine movement correction mechanism can be performed reliably and with high precision. In addition, the face-down bonding device of the present invention detects the wiring layer pattern of the board fixed to the main surface of the stem, and corrects the position of the stem based on this detected information, so that the second tool can perform positioning with high precision. Since the held chip is bonded to the main surface of the substrate with high precision, an improvement in yield can be achieved. Furthermore, in the face-down bonding apparatus of the present invention, the tools of the coarse movement correction mechanism and the fine movement correction mechanism operate simultaneously in synchronization, so that the index time of the work is shortened and the work efficiency is improved.

〔Example〕

FIG. 1 is a schematic plan view showing essential parts of a face-down bonding apparatus according to an embodiment of the present invention, FIG. 2 is a schematic perspective view, and FIG. 3 is a schematic diagram showing a tool drive structure. FIG. 4 is a schematic diagram showing the support structure of the tool, FIG. 5 is a schematic diagram showing the chip loader section, FIG. 6 is a schematic diagram showing the intermediate pocket section, and FIG. 7 is a schematic diagram showing the bonding section. , FIG. 8 is a perspective view showing the chip, substrate, etc., and FIG. 9 is a perspective view of the semiconductor device with the chip fixed.

In this embodiment, as shown in FIG. 8, a light emitting diode element (chip) 3, which is an object to be mounted, is face-down on the upper surface (main surface) of a substrate 2 fixed to the main surface of a TO-shaped stem 1. An example of bonding is shown below. The chip 3 has a hemispherical (dome) shape at the top and a circular and horseshoe-shaped electrode 4.5 at the bottom, as shown by the broken line in FIG. 8. Further, on the main surface of the substrate 2, there is a wiring layer 67 having a portion corresponding to the electrodes 4 and 5.
is provided. When the chip 3 is positioned and placed on the substrate 2 and heated, the solder material such as Au-3n, which has been previously provided on the surface of the electrode 4.5, melts, as shown in FIG. Chip 3 is attached to substrate 2 so that
Face-down bonding is completed by fixing the wiring layer 6.7 to the wiring layer 6.7. Note that when the face-down bonding is completed, a portion of the wiring layers 6 and 7 comes off the chip 3, forming a region to which wires are connected.

Wires (not shown) are stretched between these exposed wirings N6 and 7 and the part 8 that is insulatively fixed through the stem 1, and a transparent glass is installed in the ceiling on the main surface side of the stem 1. A light emitting diode device is manufactured by attaching the cap to which the plate is attached in an airtight manner.

Next, the face-down bonding apparatus will be explained with reference to FIGS. 1 to 7.

The face down bonding equipment is shown in Figures 1 and 2.
As shown in the figure, the first tool 9 and the second tool IO each have a collet with a vacuum suction structure, and the first tool 9 is attached to the XY
Dedicated jig 1 for chip alignment attached to table 11
After the chip 3 on the chip 2 is vacuum-adsorbed and the position of the chip 3 held is corrected in the rotational direction, the chip 3 is transferred onto an intermediate pocket 13 made of transparent optical glass. Further, the second tool 10 vacuum-chucks the chip 3 on the intermediate pocket 13, corrects the position of the held chi knob 3 in the rotational direction, and transfers the chip 3 to the main surface of the stem 1 located at the bonding part. board 2 attached to
(see FIG. 8).

Further, the first tool 9 constitutes an adjustment section including members to be described later, and is capable of coarse movement correction. In other words, it is possible to correct deviations that exceed the pattern matching tolerance in high-precision positioning for face-down bonding. For this reason, although the coarse movement correction mechanism can only perform rough positioning, it is more accurate than when positioning the chip using a dedicated chip alignment jig or the like. Further, the second tool 10 constitutes a fine movement correction mechanism (adjustment section) with a member to be described later, and the coarse movement correction mechanism holds the chip 3 supplied onto the intermediate pocket 13 with high precision. The chip 3 is always held so that the deviation is within the normal pattern matching tolerance.

On the other hand, this face-down bonding device has a first camera 14. Second camera 15. It has a third camera I6 and three industrial television cameras.

The first camera 14 is disposed below the XY table 11, and passes through the collet 17 of the first tool 9 (the first
The pattern of the lower surface (principal surface) of the chip 3 vacuum-adsorbed to the tip (lower end) of the chip (see figure), that is, the position of the electrodes 4 and 5 in the rotational direction is detected. The XY table 11 has a structure in which a dedicated jig 12 for chip alignment is supported at one end of the XY table 11, so that detection of the main surface pattern of the chip 3 by the first camera 14 is not hindered.

The chip alignment dedicated jig 12 is made up of a transparent optical glass plate 18 and a lattice-shaped alignment plate 19 placed and fixed on the optical glass plate 18, as shown in FIG. ing. Further, as shown in FIG. 1, the XY table 11 is controlled to move freely in the XY directions on a horizontal plane by control motors 20 and 21. Further, around the tip of the first camera 14,
A lighting device 22 is provided to illuminate the main surface of the object 3, which is the subject. Furthermore, the collet 17
The rotation of the chip 3 held by the collet 17 of the first tool 9 can be freely corrected in the rotational direction. ing.

As shown in FIGS. 2 and 6, the second camera 15 is disposed below the intermediate pocket 13 in a fixed state, and is located above the intermediate pocket 13 at the lower end of the collet 23 of the second tool 10. The pattern on the main surface (lower surface) of the attracted chip 3 is detected. In addition, the second
An illumination device 2.1 is provided around the tip of the camera 15 to illuminate the main surface of the chip 3, which is the subject. Further, the collet 23 is rotationally controlled based on information detected by the second camera 15 and the third camera 16, and is held by the collet 23 of the second tool 10 (see FIG. 1). The position of the chip 3 in the rotational direction can be freely adjusted.

As shown in FIG. 2, the third camera 16 detects a substrate 2 fixed to the main surface of the stem 1 supported by a jig 26 (see FIG. 7) fed on a stem feeder 25. The pattern on the main surface, that is, the position of the wiring layers 6 and 7 is detected.

This detection is performed at the same time when the collet 23 of the second tool 10 attracts the 1000 pieces 3. Further, an illumination device 27 is disposed on the side of the third camera 16, and illuminates the main surface of the substrate 2 of the stem 1, which is the subject. Further, at the bonding position, the jig 26 is placed on the stem feeder 25, and control in the XY direction is performed by an XY table 29 based on detection information from the third camera 16 and the second camera 15. . The height of the main surface of the substrate 2 of the stem 1 at the bonding position is the detected height of the main surface of the chip 3 held by the second tool 10.

The first tool 9 and the second tool 10 are respectively disposed at the tips of arms 30.31 extending from the X table 28 and the XY table 29, respectively. Also,
The arms 30, 31 are each bent laterally in the middle. Further, motors 32 and 33 for controlling the rotation of the collets 17 and 23 of each of the first and second tools 9 and 10 are disposed at this bent portion. Further, the X table 28 is controlled to move along the X direction, that is, the direction in which the arms 30.31 extend, by a control motor 34. Further, the XY table 29 is operated in the X direction and the Y direction by a control motor 35 and a control motor 36.
Movement is controlled along the direction. Also,
The vertical movement of the first tool 9 and the second tool 10 is performed by vertical control motors 37 and 38 disposed on the X table 28 and the XY table 29 using cams and links described later.

Next, vertical movement control and rotation control of the first tool 9 and the second tool 10 will be explained with reference to FIG. In this description of FIG. 3, the first tool 9 and the second tool 10 are simply referred to as tool 40. The tool 40 has a cylindrical tool body 41, which is rotatably attached to the tips of the arms 30 and 31 via bearings 42. A driven gear 43 for a timing belt is provided on the lower outer periphery of the tool body 41.
is provided. A timing belt 46 is placed between the driven gear 43 and a timing belt drive gear 45 fixed to the motor 32 and the rotating shaft 44 of the motor 33. Therefore, when the motors 32 and 33 rotate in the normal direction, the tool body 41 rotates in the normal direction, and when the motors 32 and 33 rotate in the reverse direction, the tool body 41 rotates in the reverse direction. With this rotational control, the position of the chip 3 held by the tool 40 in the rotational direction can be controlled with high precision.

On the other hand, inside the tool main body 41, a collet/seven shaft 47 that can be raised and lowered is disposed. This collet shaft 47
As shown in the figure, the tool main body 41 is supported by three rollers 49 arranged at 120° intervals via supports 48 at the upper and lower parts thereof so as to be vertically movable. Further, a collet 17 (collet 23) is attached to the lower end of this collet shaft 47 to vacuum-adsorb the chip 3. The upper end of the collet shaft 47 protrudes upward from the tool body 41, and a thick pull head 50 is attached to the upper end.
have. This pull head 50 is hung by being hooked to one end of an L-shaped lever 52 that swings around a pin 51. The lever 52 is rotatably attached via a pin 54 to one end of a lever 53, the other end of which extends linearly. The other end of the lever 53 is
The vertical control motor 37 (vertical control motor 38)
The lever 58 is rotatably connected via a pin 59 to one end of a lever 58 that contacts a cam 56 fixed to a rotating shaft 55 and swings about a pin 57 . Therefore, the collet shaft 47 is moved up and down by the link formed by the lever 58.degree. 53.52 and the pins 57, 59, 54.51, and the cam 56.

Further, a compression spring 62 is disposed between a flange 60 provided at the middle portion of the collet shaft 47 and a protrusion 61 on the upper part of the tool body 41. This compression spring 62 urges the collet shaft 47 downward.

Therefore, when the collet shaft 47 is raised, the lever 52
However, when chip bonding is performed when descending, the restoring force of the compression spring 62 is used to perform chip bonding. Therefore, by determining the spring constant of the compression spring 62, a desired bonding load can be obtained.

In such a face-down bonding apparatus, when the first tool 9 holds the chip 3 on the dedicated jig 12 for chip alignment, the pattern positions of the electrodes 4 and 5 on the main surface of the chip 3 are adjusted in this holding state. is detected by the first camera 14, and the collet 17 of the first tool 9 is rotated and corrected based on this detection information. Coarse motion correction is performed by correcting the rotation of the tip 3 in its held state. In other words, it is possible to correct deviations that exceed the tolerance of normal face-down bonding fine movement correction (high precision) pattern matching. Further, the rotational correction is performed while the first tool 9 is moving from the chip loader section to the intermediate pocket 13. The chip 3 whose position in the rotational direction has been coarsely adjusted is placed on the intermediate pocket 13.

On the other hand, in synchronization with the operation of the first tool 9 holding the chips 3 on the dedicated jig 12 for chip alignment, the second tool 10
holds the chip 3 on the intermediate pocket 13. This second
After the tool 10 holds the chip 3, the pattern of the electrodes 4.5 on the main surface of the chip 3 held by the second tool 10 is detected, as in the case of the first tool 9, and determines whether the position in the rotational direction is good or not. is determined, and the rotation of the collet 23 is controlled so that it is at the desired position, and the tip 3 is finely adjusted. Since this fine movement correction mechanism is a fine movement correction (high precision) in normal face-down bonding, it cannot correct large deviations.

However, since the chip 3 is accurately placed on the intermediate pocket 13 by the coarse motion correction mechanism including the first tool 9, when the chip 3 is held on the intermediate pocket 13 by the second tool 10, , even if the tip 3 is misaligned,
Since the deviation is within the tolerance of pattern matching in high-precision positioning, fine movement correction in the second tool IO can be performed reliably and with high precision. Further, the fine movement correction mechanism of the second tool 10 is performed by taking into account the deviation in the rotational direction of the stem l on the stem feeder 25. Further, the fine adjustment is performed while the second tool 10 is moving from the intermediate pocket 13 to the bonding position on the jig 26.

On the other hand, pattern detection of the wirings N6 and 7 on the substrate 2 of the stem 1 placed on the jig 26 is performed by the third camera l6,
The position of the wiring layer 6.7 is corrected in the X and Y directions so that it becomes a desired position. At this time, the position of the XY table 29 is corrected taking into account the deviation of the chip 3 in the second tool 10 in the X and Y directions. The second tool 10 is connected to the intermediate pocket 1 by the first tool 9 from the chip alignment dedicated jig 12.
When the first tool 9 places the chip 3 on the intermediate pocket 13 from the intermediate pocket 13 toward the stem 1 in synchronization with the movement toward the stem 1, the chip 3 held by the second tool 10 is placed on the substrate 2. Bond to. After bonding,
The solder material, such as AuSn, which has been previously deposited on the surfaces of the electrodes 4 and 5 of the chip 3 and the wiring layers 6 and 7 of the substrate 2, may be heated by a heater built into the jig 26 or the like or by hot gas spraying. The chip 3 is melted by a heater and bonded to the substrate 2.

〔effect〕

(1) The face-down bonding device of the present invention is capable of holding a chip in a state in which the chip 3 is deviated by more than the pattern matching tolerance in high-precision positioning, which occurs when the chip 3 in the dedicated jig 12 for chip alignment is vacuum-adsorbed. The first tool that can correct 9. First camera 14. Since the second tool 10 holds the precisely positioned chip 3 in the second tool IO, the position is corrected by a coarse movement correction mechanism such as the motor 33, and the chip 3 is transferred onto the intermediate pocket 13. Even if 3 moves, the deviation will be within the tolerance of pattern matching in high-precision positioning.
This has the effect that the position can be corrected.

(2) According to the above (11), according to the present invention, since the chip 3 is fixed to the substrate 2 by highly accurate overlapping, it is possible to achieve the effect of performing highly accurate face-down bonding.

(3) In the face-down bonding apparatus of the present invention, the position correction in the rotational direction of the chip 3 is a coarse movement position correction.

Since these operations are performed separately from the fine movement position correction and at the same time, the index time of the operations is shortened, and the effect of achieving high speed bonding is obtained.

(4) According to the above (1), the face-down bonding apparatus of the present invention has the effect of improving the productivity of assembling a dome-shaped light emitting diode device.

(5) According to (3) above, the face-down bonding device of the present invention can reduce the number of workers by automating face-down bonding, and can also operate at high speed, so when incorporated into an assembly line, This has the effect of improving line balance.

(6) According to (1) to (5) above, according to the face-down bonding apparatus of the present invention, the manufacturing cost of the light emitting diode device can be reduced by improving the yield due to high precision bonding and improving productivity due to faster bonding. A synergistic effect can be obtained in that a reduction in

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to the face-down bonding technology in the production of light emitting diode devices, which is the background field of application, but it is not limited to this, and for example, , it can be applied to manufacturing technology of electronic components such as ICs.

The present invention is applicable at least to overlapping feeding techniques.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view showing essential parts of a face-down bonding apparatus according to an embodiment of the present invention, FIG. 2 is a schematic perspective view, and FIG. 3 is a schematic diagram showing a tool drive structure. 4 is a schematic diagram showing the support structure of the tool, FIG. 5 is a schematic diagram showing the chin loader section, FIG. 6 is a schematic diagram showing the intermediate pocket section, and FIG. 7 is a schematic diagram showing the bonding section. FIG. 8 is a perspective view showing the chip, substrate, etc., and FIG. 9 is a perspective view of the semiconductor device with the chip fixed. ■... Stem, 2... Substrate, 3... Light emitting diode element (chip), 4.5... Electrode, 6.7... Wiring layer, 8... Lead, 9... 1st tool, 10...
・Second tool, 11... XY table, 12... Dedicated jig for chip alignment, 13... Intermediate pocket, 14.
...First camera, 15...Second camera, 16...Third camera, 17...Collet, 18...Optical glass plate, 19...Par alignment plate, 20.21...Control motor,
22...Lighting device, 23...Collet, 24...
Lighting device, 25... Stem feeder, 26... Jig, 27... Lighting device, 28... X table, 29...
・XY table, 30.31...arm, 32.33
...Motor, 34°35...Control motor, 36...
・Control motor, 37.38... Vertical control motor, 4
0... Tool, 41... Tool body, 42... Bearing, 43... Driven gear, 44... Rotating shaft, 45... Drive gear, 46... Timing bell l-147. ...Elevating shaft, 48...Support, 49
...Roller, 50...Pull head, 51, 54, 5
7.59... Pin, 52°53.58... Lever, 55... Rotating shaft, 56... Cam, 60... Flange, 61... Projection, Fig. 1 Fig. 2 Figure 3

Claims (1)

[Claims] 1. A face-down bonding device for fixing an object to a substrate with the main surface of the object facing the main surface of the substrate, the device comprising: a first tool for holding the object; and a first tool for holding the object;
a first monitor camera that detects a main surface pattern of an object to be mounted held by the tool; an adjustment unit that rotates and adjusts the first tool based on information from the first monitor camera; an intermediate pocket made of a transparent body that receives an object; a second tool that holds an object placed on the intermediate pocket; and a second tool that detects a main surface pattern of the object held by the second tool. a second monitor camera, a third monitor camera that detects a main surface pattern of the substrate, and an adjustment unit that corrects the positions of the object to be mounted and the substrate based on information from at least the second monitor camera and the third monitor camera. and an adjustment section that adjusts the rotation of the second tool based on information from at least the second monitor camera and the third monitor camera.