JPS62124877U - - Google Patents
Info
- Publication number
- JPS62124877U JPS62124877U JP1238586U JP1238586U JPS62124877U JP S62124877 U JPS62124877 U JP S62124877U JP 1238586 U JP1238586 U JP 1238586U JP 1238586 U JP1238586 U JP 1238586U JP S62124877 U JPS62124877 U JP S62124877U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- circuit components
- tube
- circuit
- low pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
添付図面は本考案の実施例を示し、第１図は一
部切欠平面図、第２図は第１図Ａ―Ａ線切断側面
図である。
１→プリント基板、２，３ａ，３ｂ→回路部品
、４→端子脚、６→アルミニユーム管、７→被覆
套管、８→キヤツプ、９→樹脂モールド。
The accompanying drawings show an embodiment of the present invention, and FIG. 1 is a partially cutaway plan view, and FIG. 2 is a side view taken along the line AA in FIG. 1. 1→Printed circuit board, 2, 3a, 3b→circuit components, 4→terminal leg, 6→aluminum tube, 7→covered tube, 8→cap, 9→resin mold.
Claims (1)
て被覆材料を兼ねさせた回路部品、若しくは耐圧
力が低い金属管を被覆套管にした回路部品、及び
通常の回路部品を混在させて、回路をプリントし
た基板に接続固定し、基板と各回路部品を射出樹
脂によりモールドしてなるモールド部材において
、 前記の耐圧力の低い金属管を被覆材料に兼ねさ
せ、若しくは被覆套管とした回路部品に、耐圧キ
ヤツプを冠着してモールドを施してなる樹脂モー
ルド・プリント基板。[Scope of Claim for Utility Model Registration] Circuit components in which a metal tube such as an aluminum tube with low pressure resistance also serves as a covering material, circuit components in which a metal tube with low pressure resistance is used as a jacket tube, and ordinary circuit components. In a molded member in which a circuit is connected and fixed to a printed circuit board, and the board and each circuit component are molded with injection resin, the above-mentioned low pressure-resistant metal tube also serves as the coating material, or a jacket tube is used. A resin molded printed circuit board made of circuit components covered with a pressure-resistant cap and then molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1238586U JPS62124877U (en) | 1986-01-30 | 1986-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1238586U JPS62124877U (en) | 1986-01-30 | 1986-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124877U true JPS62124877U (en) | 1987-08-08 |
Family
ID=30800468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1238586U Pending JPS62124877U (en) | 1986-01-30 | 1986-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124877U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018524799A (en) * | 2015-05-19 | 2018-08-30 | タクトテク オーユー | Thermoformed plastic covers for electronics and related processes |
-
1986
- 1986-01-30 JP JP1238586U patent/JPS62124877U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018524799A (en) * | 2015-05-19 | 2018-08-30 | タクトテク オーユー | Thermoformed plastic covers for electronics and related processes |