JPS62122352U - - Google Patents
Info
- Publication number
- JPS62122352U JPS62122352U JP1049686U JP1049686U JPS62122352U JP S62122352 U JPS62122352 U JP S62122352U JP 1049686 U JP1049686 U JP 1049686U JP 1049686 U JP1049686 U JP 1049686U JP S62122352 U JPS62122352 U JP S62122352U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling block
- semiconductor device
- groove
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図はこの考案の実施例を示す平面図、第2
図は同側面図、第3図は基板への装填状態を示す
側面図、第4図は同じく冷却ブロツクへの接続状
態を示す側面図である。 1…半導体装置本体、2…放熱板、3…基板、
4…冷却ブロツク、5…溝。
図は同側面図、第3図は基板への装填状態を示す
側面図、第4図は同じく冷却ブロツクへの接続状
態を示す側面図である。 1…半導体装置本体、2…放熱板、3…基板、
4…冷却ブロツク、5…溝。
Claims (1)
- 放熱板を具備してなる半導体装置において、前
記放熱板を冷却ブロツクに接続するときの屈曲の
際のガイドとなる溝を、前記放熱板に設けてなる
半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1049686U JPS62122352U (ja) | 1986-01-27 | 1986-01-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1049686U JPS62122352U (ja) | 1986-01-27 | 1986-01-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62122352U true JPS62122352U (ja) | 1987-08-03 |
Family
ID=30796841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1049686U Pending JPS62122352U (ja) | 1986-01-27 | 1986-01-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62122352U (ja) |
-
1986
- 1986-01-27 JP JP1049686U patent/JPS62122352U/ja active Pending