JPS62120280U - - Google Patents

Info

Publication number
JPS62120280U
JPS62120280U JP722086U JP722086U JPS62120280U JP S62120280 U JPS62120280 U JP S62120280U JP 722086 U JP722086 U JP 722086U JP 722086 U JP722086 U JP 722086U JP S62120280 U JPS62120280 U JP S62120280U
Authority
JP
Japan
Prior art keywords
circuit component
socket
item
holder
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP722086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP722086U priority Critical patent/JPS62120280U/ja
Publication of JPS62120280U publication Critical patent/JPS62120280U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案ソケツトを装着した回路基板の
一部斜視図、第2図は本案ソケツトの拡大縦断側
面図である。 7…内筒、10…ホルダー、17…外筒。
FIG. 1 is a partial perspective view of a circuit board equipped with the socket of the present invention, and FIG. 2 is an enlarged longitudinal sectional side view of the socket of the present invention. 7...Inner cylinder, 10...Holder, 17...Outer cylinder.

Claims (1)

【実用新案登録請求の範囲】 (1) 底部に回路基板を貫通する取付ピンが突設
され、上部に円筒部を有する金属製ホルダーと、
回路部品のリード線挿入孔を有し、下端に挾着部
を備え前記円筒部に嵌合された金属製内筒と、前
記ホルダーの外周を被覆する絶縁性外筒からなる
電子キツトにおける回路部品差替用ソケツト。 (2) 絶縁性外筒が2以上連接一体化されてなる
前記第1項記載の回路部品差替用ソケツト。 (3) 外筒が夫々三角形の頂点に位置して相互に
隣接して一体化されてなる前記第1項記載の回路
部品差替用ソケツト。
[Claims for Utility Model Registration] (1) A metal holder having a protruding mounting pin that penetrates the circuit board at the bottom and a cylindrical portion at the top;
A circuit component in an electronic kit comprising a metal inner cylinder having a lead wire insertion hole for the circuit component, a clamping part at the lower end and fitted into the cylindrical part, and an insulating outer cylinder covering the outer periphery of the holder. Replacement socket. (2) The circuit component replacement socket according to item 1 above, wherein two or more insulating outer cylinders are connected and integrated. (3) The socket for circuit component replacement according to item 1 above, wherein the outer cylinders are located at the vertices of a triangle and are integrated adjacent to each other.
JP722086U 1986-01-23 1986-01-23 Pending JPS62120280U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP722086U JPS62120280U (en) 1986-01-23 1986-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP722086U JPS62120280U (en) 1986-01-23 1986-01-23

Publications (1)

Publication Number Publication Date
JPS62120280U true JPS62120280U (en) 1987-07-30

Family

ID=30790469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP722086U Pending JPS62120280U (en) 1986-01-23 1986-01-23

Country Status (1)

Country Link
JP (1) JPS62120280U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047377A (en) * 2018-09-14 2020-03-26 富士電機株式会社 Semiconductor device and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741975U (en) * 1980-08-19 1982-03-06
JPS6031071A (en) * 1983-07-29 1985-02-16 Fujitsu Ten Ltd Radar equipment for measuring speed

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741975U (en) * 1980-08-19 1982-03-06
JPS6031071A (en) * 1983-07-29 1985-02-16 Fujitsu Ten Ltd Radar equipment for measuring speed

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047377A (en) * 2018-09-14 2020-03-26 富士電機株式会社 Semiconductor device and method of manufacturing the same

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