JPS62120099A - Calibrator of chip parts mounting - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a chip component mounting calibration device for mounting chip components on a printed circuit board. Each side of the chip component is held between two directions, and in this state, the chip component is transferred to a printed circuit board and mounted thereon.

Therefore, since the configuration is such that the chip component is held between two directions, the directions can be determined, and no positional deviation such as rotational deviation occurs between the chip component and the head that is holding it. However, in recent years, due to changes in the shape of chip components, devices that use a suction device to suck the chip components and transfer them to a printed circuit board to mount them have come into widespread use instead of the clamping head.

For this reason, in the suction device, positional deviations such as rotational deviations occur between the chip components and their suction heads, and this must be corrected during mounting. Therefore, it has become necessary to correct this positional deviation with high precision.

[Purpose of the invention]

The present invention has been made based on the above circumstances, and its purpose is to provide a chip component mounting calibration device that can easily perform calibration during suction and obtain mounting calibration information. It is in.

[Summary of the invention]

The present invention involves micro-rotating a chip component sucked by a suction device at a first position using a micro-rotating means, roughly moving it to a second position and micro-rotating it again, and imaging at least two corners of the chip component at this time. The corner coordinates of the chip component at the first and second positions are detected from the image data obtained by 1@, and from these corner coordinates, the suction position by the suction device is determined by the calibration information calculation means, and further calibration is performed on the mounting position. This is a chip component mounting calibration device that obtains information.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of the apparatus of the present invention. In the figure, reference numeral 1 indicates a chip component, which is being sucked by a suction nozzle 3 of a suction device 2 . Now, when the chip component 1 is suctioned by the suction device 2 in this way and mounted on a printed circuit board (not shown), positional deviations such as rotational deviations occur when the chip component 1 is suctioned, so the following calibration device is used. is provided. In other words, 10 and 11 are IT
These ITV cameras are V-cameras (industrial television cameras), and the chip component 1 is attached to each corner A and 8 of the chip component 1 from below in the field of view! They are arranged so that they resemble each other. The image signals output from these ITV cameras 10 and 11 are sent to the suction control device 1111, where they are converted into digital image data by an A/D converter installed in this suction control device 12 and stored in the image memory. It is meant to be remembered. Now, this adsorption control device 12 is
The mounting calibration information when the chip component 1 is picked up, that is, the rotation angle of the chip component 1 with respect to the reference line and the magnification of each ITV camera 10.11 are determined, and from these rotation angles and magnifications, the rotation angle, etc. when mounted by the mounting device 2 is calculated. In other words, it has the function of determining the angle for accurately mounting the device at a predetermined mounting position, and has various functions as shown in FIG. The camera coordinate conversion means 12-1 has a function of converting the visual field coordinates of the ITV camera 11 into the visual field coordinates of the ITV camera 10, and the minute rotation means 12-2 converts the chip component 1 sucked by the suction device 2. It has the function of making a slight rotation in the first position, then moving to the second position and making a slight rotation again. The suction position 'a calculation means 12-3 detects the coordinates of each corner A and B of the chip component 1 when it is slightly rotated at the first and second positions from the image data obtained by imaging with the rTV camera 10.11, and calculates these coordinates. The function is to obtain the suction positions Qs1 and Qs2 of the suction nozzle 3 from the corner A and B coordinates, and the calibration information calculation means 12-4 uses these suction positions Qs1 and Qs2 to obtain mounting calibration information for the mounting position 2, that is, the chip component 1. Rotation angle and ITV camera10.
It has a function to find the magnification of 11.

Next, the operation of the apparatus configured as described above will be explained.

When mounting the chip component 1 on the printed circuit board, calibration is performed to determine the rotation angle of the suction nozzle 2 so that the chip component 1 is accurately mounted at a predetermined mounting position. Note that it is assumed that there is no rotational shift between the fields of view of each ITV camera 10.11. if. If there is a rotational shift, the chip component 1 is imaged, and from the image, one I
Adjust by rotating the TV camera 10 or 11.

Now, when the chip component 1 is sucked by the suction nozzle 3 and is in the state shown in FIG.
The positions of the V-cameras 10 and 11 are moved and adjusted so that corner A is within the field of view F2O of the ITV camera 10 as shown in FIG. 3, and corner B is within the field of view F11 of the ITV camera 11. Adjust so that it fits. At this time,
The distance from the ITV camera 70.11 is determined from the coordinate origin Q1 of the field of view FIO and the origin Q2 of the field of view F11, which is DX in the X-axis direction and DY in the Y-axis direction. Also, the suction position O
5 in terms of the coordinates of the ITV camera 10, Os (Os
xl, ○sy1). Here, the coordinate position of corner A in the field of view coordinates of the ITV camera 10 is as shown in FIG.
Ayl) On the other hand, let the coordinate position of corner B in the field of view coordinates of the ITV camera 11 be B (BXl, BVI).

Next, the minute rotation means 12-2 sends a minute rotation control wJ signal to the mounting device 2. As a result, the suction nozzle 3 rotates slightly at the first position, that is, the current position, and the corners A and B move to A' and B= as shown in FIG. The coordinates of each corner 'M, B' at this time are A - (A - xl, A - yl) B = (B - xl, B - yl).

Next, the minute rotation means 12-2 transmits a movement control signal to the mounting device 2.
Send to. Thereby, the mounting device 2 moves the position of the suction nozzle 3 to, for example, the second position Os2. Then, the coordinates of each corner A and B at the moved position Os2 are determined. In addition, let this coordinate be A (Ax2. AV2) B (Bx2. sy2>. Then, at this position ○s2, insert chip component 1 again.
, and find the coordinates of each corner at this time. That is, A −(A −x2. A −y2> 8−(8−x2.8− y2>).

Next, the camera coordinate conversion means 12-1 converts the ITV camera 11
In order to convert the field of view coordinates of the ITV camera 10 into the field of view coordinates of the ITV camera 10, the intervals DX and DY are determined.

Therefore, it can be expressed as DX = (G2 KVl-GI KV2) ÷ 2 (Kx
2Ky1-Ky2Kx1)DY= (GI Kx2-G
2Kxl)÷2 (Kx2Kyl-KV2Kxl). However, Qi =3-xi2-3xi2 +Axi2-A-x
i23 = yi2-3yt2 +Ayi2-A-yi
2+ 2 (AxiBxi+AyiBVi-3'xi
A -xi-B -yiA -Vi)Kxi-3xi-
AXi-B-x;+A-xiKyi-Byi-Ayi-
B'yi+A-Vi(i-1,2).

Next, the suction position ○s1 on the chip component 1 is determined by the suction position calculating means 12-3. Here, ITV camera 1
The coordinates of the corner B captured in the field of view F11 of the ITV camera 10 are converted into the coordinates of the field of view of the ITV camera 10. That is, Cx1-Bx1+DX, C=xl=B-x1+DXC
Replace with y1-By1+DY, C=yl=B-V1+DY. Then, from the given formula % formula %), 0sxl - (G2 (A-yl-Ayl) - G1
(C”yl-Cyl) )÷H...(1) Qsy1= (G2 (A-xl-Axl)-G1(
C'x1-Cx1))÷H...(2) However, Ql -A-X12-AX12+A-yl2-AV12
G2 =C=x12-Qx12-+-C-y12-Cy
12H= (A-yl-Ayl) (C-xl-Cx
1)-(A'xl-Axl> (C-Vl-Cyl
). Therefore, the suction position 031 can be determined from the above equations (1) and (21).

Now, in the same manner as above, the suction position at the movement position Qs2 is determined. In other words, ○sx2- (G4 (A'V2-Ay2)-G3
(C-y2-Cy2) >÷I...(a Osy2 - (G4 (A-x2-Ax2)-G
3 (C-y2-Cy2>) ÷■...(4
) becomes. However, G3-A'x22-Ax22+A-y2''-Ay2
2G4-C-x22-Cx22+C-y22-Cy22
1 = (A -V2-Ay2) (C-x2- C
x2)-(A = x2-Ax2) (C-V2-
Cy2).

When the coordinate positions of the suction positions Qs1 and Os2 are determined as described above. Next, the calibration information calculation means 12-4 determines the rotation angle θ of the chip component 1 with respect to the reference line M shown in FIG. 5 and the magnification N (bit/pulse) of each ITV camera 10, 11. In addition, in FIG. 5, Wl is the coordinate system of the ITV camera 10, W2 is the coordinate system of the mounting device 2, and both units are pulses (in image data). Therefore, the following formula holds true.

From this formula \= COSθ・(X2+Y2)÷(Xdx+Ydy)
θ-tan' ((XdV-Ydx)÷(X
dx+Ydy)). Here, it is X-〇sx2- Q 5xI Y -Osy2-0sy1. As described above, the mounting calibration information of the mounting device 2 is obtained.

Therefore, when the mounting device 2 performs the mounting operation on the printed circuit board using the above rotation angle θ and magnification N, the rotation angle and the like are controlled and mounted.

By the way, when actually detecting the chip component 1, it is necessary to detect which position of the chip component 1 and at what angle the chip component 1 is being sucked. Therefore, as shown in FIG. The deviation ITx 1Ty of the position O3 and the inclination angle ψ of the chip component 1 are determined. Note that the coordinates are converted into the coordinates of the ITV camera 10.

Since the suction position Os is always constant, each corner (A xn).

By the coordinate position of Ayn) and (Bxn, 8yn), f
The fi quantities Tx, Ty and the inclination angle ψ are determined. Therefore, the central IP is ((Axn+Bxn)/2, (Ayn+3yn)
/2). In addition, since the shape of the chip component 1 is known in advance, the angle α is calculated, so the inclination angle ψ is ψ−α−β −tl−tan ” ((Byn−Ayn)÷(B
xn −A X11) ).

In addition, the deviation amounts Tx and Ty are the positions expressed in coordinates when the POs is rotated by ψ according to the camera coordinates, so Tx = cos (J) - TXO-3in (J) - T
y.

Ty-sinψ-Txo+cosψ-Ty.

becomes. However, Txo=Osx −(Axn+Bxn) /2Tyo−
Osy-(Ayn+Byn)/2. here,(
○SX, ○SV) are the coordinate positions of the ITV camera 10.

From the above, the amount of deviation TX in the coordinates of the ITV camera 10,
Ty and the inclination angle ψ are determined, and the amount of deviation in the suction position of the chip component 1 is corrected based on these values. Note that, in reality, the maximum deviations Tx and Ty are multiplied by the reciprocal of the magnification N.

In this embodiment, the chip component 1 is slightly rotated at the first position by the micro-rotating means 12-2, and then moved to the second position and rotated again. Since each coordinate of B is detected and the rotation angle θ and magnification N are determined from these coordinates, when the chip component 1 is suctioned by the suction nozzle 3 and mounted on a printed circuit board, etc., positional deviation such as rotational deviation occurs during suction. Even if this occurs, this positional shift can be reliably corrected. Therefore, the chip component 1 can be accurately mounted at a predetermined mounting position without deviation.

Note that the present invention is not limited to the above-mentioned embodiment, and can be modified without departing from the spirit thereof.

For example, when detecting the suction position on chip component 1, the coordinates of each corner of the chip component are detected using two ITV cameras.
It is also possible to detect and obtain the coordinates of two or more corners using a V camera or a plurality of ITV cameras. Note that the detection accuracy is higher when two rTV cameras are used than when one rTV camera is used.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a chip component mounting calibration apparatus that can easily perform calibration during suction and obtain mounting calibration information.

[Brief explanation of drawings]

Fig. 1 is an overall configuration diagram of a chip component mounting calibration device according to the present invention, Fig. 2 is a specific functional block diagram of a suction control device in this device, and Figs. 3 to 6 are mounting diagrams in this device. FIG. 3 is a diagram for explaining the operation of obtaining calibration information. DESCRIPTION OF SYMBOLS 1... Chip component, 2... Mounting device, 3... Suction nozzle, 10.11... ITV camera, 12... Suction control device, 12-1... Camera coordinate conversion means, 12
-2...Minute rotation means, 12-3...Adsorption position calculation means, 12-4...Calibration information calculation means. Applicant's agent Patent attorney Takehiko Suzue Figure 1

Claims (3)

[Claims] (1) A suction device that sucks and holds a chip component, transfers it, and performs the mounting operation at a predetermined mounting position; and the chip component that is suctioned by this suction device is slightly rotated at a first position, and then transferred to a second position. micro-rotating means for moving and micro-rotating again; imaging means for capturing images of at least two corners of the chip component when micro-rotated at the first and second positions; 1
and a calibration information calculating means for detecting each corner coordinate of the chip component at a second position, determining a suction position by the suction device from these corner coordinates, and calculating mounting calibration information for the mounting position. Features a chip component mounting calibration device. (2) The chip component mounting calibration device according to claim (1), wherein the imaging means includes two imaging devices to take images of each corner of the chip component having a mutually symmetrical positional relationship. (3) The chip component mounting calibration device according to claim 1, wherein the calibration information calculating means calculates the magnification of the imaging device and the rotation angle of the chip component with respect to the reference line as the mounting calibration information.