JPS63257299A - Mounting position measurement system in electronic parts mounter - Google Patents
Mounting position measurement system in electronic parts mounterInfo
- Publication number
- JPS63257299A JPS63257299A JP62090788A JP9078887A JPS63257299A JP S63257299 A JPS63257299 A JP S63257299A JP 62090788 A JP62090788 A JP 62090788A JP 9078887 A JP9078887 A JP 9078887A JP S63257299 A JPS63257299 A JP S63257299A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- mounting position
- mounting
- visual recognition
- measurement system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 title description 17
- 230000000007 visual effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 238000012937 correction Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品実装機に係り、特に高精度な搭載を行
う為の搭載位置の測定方式に係る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting machine, and particularly to a method for measuring a mounting position for highly accurate mounting.
従来の方式では、基板上のマーキングパターンやリード
パターンなどから、そのパターンの重心を求め、その重
心を搭載位置として搭載ロボットに指令を出すという方
法が採られていた。In the conventional method, the center of gravity of the pattern is determined from the marking pattern or lead pattern on the board, and a command is issued to the loading robot using the center of gravity as the mounting position.
上記従来技術は、基板上のパターン及び搭載部品の形状
精度、つまり、基板及び部品製作時に生じる製造誤差と
いう点についての配慮がされておらず、あるいは、視覚
認識カメラでとらえた搭載位置を実際の搭載位置に変換
するときのオフセット誤差などにより、高精度な搭載が
必ずしも行なわれるとは限らなかった。The above-mentioned conventional technology does not take into account the shape accuracy of the pattern on the board and the mounted components, that is, the manufacturing errors that occur during the manufacturing of the board and parts, or the mounting position captured by the visual recognition camera is not accurately calculated. Highly accurate mounting was not always possible due to offset errors when converting to the mounting position.
本発明の目的は、基板及び部品製作時に生じる製造誤差
に関わりなく、又実際の搭載位置と視覚認識カメラでと
らえた搭載位置間のオフでソトを持つ必要がなく、高精
度な搭載が行なうことにある。The purpose of the present invention is to perform highly accurate mounting, regardless of manufacturing errors that occur during the manufacture of boards and parts, and without the need for separation between the actual mounting position and the mounting position captured by a visual recognition camera. It is in.
上記目的は、プリント基板上のパターンと部品のリード
パターンを視覚認識装置の同一視野上で認識させ１両パ
ターンの重なりあった画像を二次元的に捕え、認識した
パターン同士のマツチングをとることにより、高精度な
搭載が実現される。The above purpose is to recognize the pattern on the printed circuit board and the lead pattern of the component in the same field of view of the visual recognition device, to capture the overlapping images of both patterns two-dimensionally, and to match the recognized patterns. , high-precision mounting is achieved.
プリン１一基板上のパターンと部品のリードパターンと
の重なりあったパターン幅に直角な測定線を複数本引き
、それぞれのｉＩ＋ｑ定線におけるパターン幅を統計的
手法から搭載位置を決定する。このことにより、高精度
な搭載が実現される。A plurality of measurement lines are drawn perpendicular to the overlapping pattern width of the pattern on the printed circuit board 1 and the lead pattern of the component, and the mounting position is determined from the pattern width at each iI+q constant line using a statistical method. This enables highly accurate mounting.
以下、本発明の一実施例を図面を参照して説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第２図は実施例で使用している重子部品実装機の外訳図
である。１は電子部品を吸着し、プリント鎖板２の上に
搭載する為のロボットハンドを示す。FIG. 2 is an external view of the multiplex component mounting machine used in the example. 1 shows a robot hand for picking up electronic parts and mounting them on the printed chain plate 2.
このハンド１は直交形ロボット３によりＸ、Ｙ方向のい
ずれの方向にも自由に移動させることができる。ハント
上は基板２上に搭載する部品を部品供給装置５より吸着
してくる。そして、視覚認識カメラ４で搭載位置を検出
して部品をプリント基板２上に搭載する。This hand 1 can be freely moved in either the X or Y direction by the orthogonal robot 3. The hunt top picks up components to be mounted on the board 2 from a component supply device 5. Then, the mounting position is detected by the visual recognition camera 4 and the component is mounted on the printed circuit board 2.
第１図は実施例で使用している搭載ヘッド部の拡大図で
ある。ハント１により把持した部品８をティーチで指定
された。プリント基Ｆｊ、、ｈ２のパターン位置６へ搭
載ヘッドを移動させる。搭載ヘッドは、プリント基板上
のパターンと部品のリードパターンを同一視野とで認識
させる為１部品を基板パターン上に搭載する寸前まで下
降させる。Ｚｉｌ１１方向に切換える機構を備えており
、この機械により、視覚認識装置４で両パターンの重な
りあったパターン幅を補正して搭載位置を決定すること
ができる。FIG. 1 is an enlarged view of the mounting head used in the embodiment. The part 8 gripped by Hunt 1 was specified by teaching. The mounting head is moved to pattern position 6 of print base Fj, .h2. The mounting head lowers one component until it is just about to be mounted on the circuit board pattern in order to recognize the pattern on the printed circuit board and the lead pattern of the component in the same field of view. It is equipped with a mechanism for switching to Zil11 direction, and with this machine, the visual recognition device 4 can correct the overlapping pattern width of both patterns and determine the mounting position.
第３図は、プリント基板上のパターンと部品のリードパ
ターンとの重なりあった画像を、視覚認識′ＪＡ置で認
識した画像図である。この撮像図にあらかじめ指定され
た測定線、第３図の上方向の測定線ＬＵ、 〜ＬＵ４
下方向の測定線ＬＤ、 〜ＬＤイ。FIG. 3 is an image diagram of an overlapping image of a pattern on a printed circuit board and a lead pattern of a component, which is recognized using visual recognition 'JA'. The measurement line specified in advance in this imaging diagram, the measurement line LU in the upper direction in Figure 3, ~LU4
Downward measurement line LD, ~LDi.
右方向の測定線ＬＲ，−ＬＲ今、左方向の測定線ＬＬ、
〜ＬＬ４から、重なりあったパターンの本数及び各々の
パターン幅の距離を計測する。計測された結果は以下の
表に示すとうりである。Rightward measurement line LR, -LR Now, leftward measurement line LL,
From ~LL4, the number of overlapping patterns and the distance of each pattern width are measured. The measured results are shown in the table below.
第 ３ 表
第 ４ 表
まず回転方向のズレの有無は、測定したパターンの本数
により求められる。回転方向にズレがない場合は、測定
線ＬＵ＋ での本数＝測定線Ｌ Ｕｚでの本数＝・・
・＝測定線ＬＤ３ での本数＝測定線ＬＤ４−での本数
、又は、測定線ＬＲ１での本数＝測定線ｒ、Ｒｚ での
本数＝・・・＝測定線Ｌ Ｌ：（での本数＝ ｓ＋ｒｒ
定線ＬＬ４での本数という関係が成り立つ。第３図での
測定結果を見ると、上方向の本数（３，４゜６．６）、
下方向の本数（３，３，４，４）のように上記の関係が
成り立たないので、回転方向にズレがあると判断できる
。次に、回転方向の補正量を求めるには、測定線ＬＵ／
での距離の平均値（（ＤＵｔｔ ＋ Ｄ Ｕｔλ＋
ＤＵ／３ ） ／ ３ ）のように。Table 3 Table 4 First, the presence or absence of deviation in the rotational direction is determined by the number of patterns measured. If there is no deviation in the rotation direction, the number of measuring lines LU+ = the number of measuring lines L Uz =...
・=Number of measurement lines LD3=Number of measurement lines LD4- or number of measurement lines LR1=Number of measurement lines r, Rz=...=Number of measurement lines LL:(Number of lines=s+rr
The relationship of the number of constant lines LL4 holds true. Looking at the measurement results in Figure 3, the number of upward lines (3.4°6.6),
Since the above relationship does not hold true for the downward number (3, 3, 4, 4), it can be determined that there is a deviation in the rotational direction. Next, to find the correction amount in the rotational direction, the measurement line LU/
The average value of the distance at ((DUtt + D Utλ+
Like DU/3)/3).
ＬＵ＋ からＬＵ＋でのパターン幅の距離の平均値を
計算する。計算結果をグラフにすると、第４図のように
なる。この図において、直線ＳＬ、は測定結果を一次式
で表わしたもので、この直線ＳＬを回転方向のズレがな
い場合の理論式による直線ＴＬに近似させれば回転方向
の補正を行うことかできる。つまり、角度０７が補正量
となる。この補正は複数回行い、指定回数以上補正して
も近似しない場合は不良部品とみなす。Calculate the average value of the pattern width distance from LU+ to LU+. The calculation results are graphed as shown in Figure 4. In this figure, the straight line SL represents the measurement results using a linear equation, and by approximating this straight line SL to the straight line TL based on the theoretical equation when there is no deviation in the rotational direction, the rotational direction can be corrected. . In other words, angle 07 is the correction amount. This correction is performed multiple times, and if the approximation is not achieved even after the specified number of corrections, the part is considered to be defective.
次に、第３図から回転方向の補正を行った撮像図を第５
図に示す。上側のように、あらかじめ指定されたａｌり
定線Ｌ Ｒｔ −Ｉ、Ｒ４、Ｌ Ｌ／ 〜Ｉ−Ｉ、
４からパターン幅の距離を計測する。そして、計測結果
の全平均値（（Ｄ Ｒ２，＋ Ｄ Ｒｉミコ・・・ＤＬ
４２＋１つＬ＋３） ／８ ｘ ３） がパターンごと
に設定された閾値Ｔに近似されるよう補正することによ
り、Ｙ方向の補正を行うことができる。つまり、（＜
Ｄ Ｒ／／ ＋ Ｄ Ｒ／２ ＋・・ Ｄ 丁
、４２＋ Ｄ Ｌ４３）゛ ／８ ×３）−丁がＹ方向
の補正量となる。この補正も複数回行い、指定回数以上
補正しても近似しない場合は不良部品とみなす。又、Ｘ
方向の補正量の求め力゛も同様である。Next, the image taken with the rotation direction corrected from Figure 3 is shown in Figure 5.
As shown in the figure. As shown above, the pre-specified al constant line L Rt -I, R4, L L/ ~I-I,
Measure the distance of the pattern width from 4. Then, the total average value of the measurement results ((D R2, + D Ri Miko...DL
Correction in the Y direction can be performed by correcting so that 42+1 L+3) /8 x 3) is approximated to the threshold T set for each pattern. In other words, (<
DR// + DR/2 +... D digits, 42+ DL43)゛ /8 x 3) - digits is the correction amount in the Y direction. This correction is also performed multiple times, and if the approximation is not achieved even after the specified number of corrections, the part is considered to be defective. Also, X
The same applies to the force required to determine the amount of correction in the direction.
以上述べたアルゴリズムをフローチャートにすると、第
６図のようになる。A flowchart of the algorithm described above is shown in FIG. 6.
以上説明した通り、パターン同士のマツチングをとるこ
とにより、基板や部品などの製造誤差に係わりなく、又
、実際の搭載位置と視覚認識カメラでとらえた搭載位置
間のオフセットも持つ必要がなくなり、高精度な搭載が
でるという効果がある。As explained above, by matching patterns, there is no need to worry about manufacturing errors in boards or parts, and there is no need to have an offset between the actual mounting position and the mounting position captured by a visual recognition camera, resulting in high This has the effect of providing accurate mounting.
本発明によれば、基板や部品の形状精度のバラツキに関
係なく又、実際の搭載位置と視覚認識カメラでとらえた
搭載位置間のオフセットを持つ必要がなくなり、高精度
な搭載ができるという効果がある。According to the present invention, there is no need to have an offset between the actual mounting position and the mounting position captured by a visual recognition camera, regardless of variations in the shape accuracy of boards and components, and the effect is that highly accurate mounting is possible. be.
第１図は本発明の一実施例を示す搭載ヘッド部の拡大斜
視図、第２図は本発明の一実施例を示す電子部品実装機
の全体構成を示す斜視図、第３図は重なり合ったパター
ンを視覚認識装置で認識した撮像図、第４図は測定結果
の一例を示す線図、第５図は重なり合ったパターンを視
覚認識装置で認識した撮像図、第６図は本発明による処
理の一例を示すフローチャートである。
１・・・搭載ハンド、２・・・プリント基板、３・・・
直交ロボット、４・・・視覚認識カメラ、５・・部品供
給装置、６・・基板パターン、７・・・搭載ヘッド、８
・・・電子部品、９・・・視覚認識カメラで撮像した、
基板上のパターン、１０・・・視覚認識カメラで撮像し
た、部品のリードパターン。
Ｘとン′
第 １ 図
ゝ２
２：ブソ゛７）１版 ７：膝截゛ヘッド４ ：
イ之覚認・貞曳゛カノラ ８ ： 充 ＋部り
ら６：基筏パターソ
＄ ２ 口
第 ３ 図
第 ４ 圀
ｔＵｔ ＬＬ／２ Ｌ／Ｊ３ Ｌめ第 ５ 図Fig. 1 is an enlarged perspective view of a mounting head section showing an embodiment of the present invention, Fig. 2 is a perspective view showing the overall configuration of an electronic component mounting machine showing an embodiment of the invention, and Fig. 3 is an overlapping view. Fig. 4 is a diagram showing an example of the measurement results; Fig. 5 is an image showing the overlapping patterns recognized by the visual recognition device; Fig. 6 is a diagram showing the processing according to the present invention. It is a flowchart which shows an example. 1... Mounting hand, 2... Printed circuit board, 3...
Cartesian robot, 4... Visual recognition camera, 5... Component supply device, 6... Board pattern, 7... Mounting head, 8
...Electronic components, 9...Image taken with a visual recognition camera,
Pattern on the board, 10... Lead pattern of the component, imaged by a visual recognition camera. Xton' Figure 1 2 2: Buso 7) 1st edition 7: Kneeling head 4:
I no Kakuken・Teihiki Canora 8: Mitsuru + Part Rira 6: Base raft Patterso $ 2 Mouth 3rd Figure 4 Kuni tUt LL/2 L/J3 L's Figure 5
Claims (1)
備えた電子部品実装機において、プリント基板上のパタ
ーンと部品のリードパターンを視覚認識装置の同一視野
上で認識させ、両パターンの重なりあった画像を二次元
的に捕え、認識したパターン幅を補正することにより搭
載位置を決定することを特徴とする電子部品実装機にお
ける搭載位置測定方式。1. In an electronic component mounting machine equipped with a visual recognition device to detect the mounting position of electronic components, the pattern on the printed circuit board and the lead pattern of the component are recognized in the same field of view of the visual recognition device, and the overlap of both patterns is detected. A method for measuring a mounting position in an electronic component mounting machine, which is characterized in that the mounting position is determined by capturing a two-dimensional image of the pattern and correcting the recognized pattern width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62090788A JPH0824235B2 (en) | 1987-04-15 | 1987-04-15 | How to determine the mounting position of electronic components in a mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62090788A JPH0824235B2 (en) | 1987-04-15 | 1987-04-15 | How to determine the mounting position of electronic components in a mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63257299A true JPS63257299A (en) | 1988-10-25 |
| JPH0824235B2 JPH0824235B2 (en) | 1996-03-06 |
Family
ID=14008334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62090788A Expired - Lifetime JPH0824235B2 (en) | 1987-04-15 | 1987-04-15 | How to determine the mounting position of electronic components in a mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824235B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016166872A (en) * | 2015-03-03 | 2016-09-15 | コグネックス・コーポレイション | Vision system for training assembly system by virtual assembly of object |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59228787A (en) * | 1983-06-10 | 1984-12-22 | 日立電子株式会社 | Method of positioning flat pack ic |
| JPS6146997A (en) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | Voice reproduction system |
-
1987
- 1987-04-15 JP JP62090788A patent/JPH0824235B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59228787A (en) * | 1983-06-10 | 1984-12-22 | 日立電子株式会社 | Method of positioning flat pack ic |
| JPS6146997A (en) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | Voice reproduction system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016166872A (en) * | 2015-03-03 | 2016-09-15 | コグネックス・コーポレイション | Vision system for training assembly system by virtual assembly of object |
| US10223589B2 (en) | 2015-03-03 | 2019-03-05 | Cognex Corporation | Vision system for training an assembly system through virtual assembly of objects |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0824235B2 (en) | 1996-03-06 |
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