JPS62114205A - 厚膜電気部品の製造方法 - Google Patents

厚膜電気部品の製造方法

Info

Publication number
JPS62114205A
JPS62114205A JP61202608A JP20260886A JPS62114205A JP S62114205 A JPS62114205 A JP S62114205A JP 61202608 A JP61202608 A JP 61202608A JP 20260886 A JP20260886 A JP 20260886A JP S62114205 A JPS62114205 A JP S62114205A
Authority
JP
Japan
Prior art keywords
furnace
thick film
atmosphere
paste
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61202608A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451043B2 (OSRAM
Inventor
ウオルター．フランシス．エクスト
エドワード．アンドリュー．ヘイダツク
クラーク．ケネス．フイツシヤー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of JPS62114205A publication Critical patent/JPS62114205A/ja
Publication of JPH0451043B2 publication Critical patent/JPH0451043B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)
  • Conductive Materials (AREA)
JP61202608A 1985-11-12 1986-08-28 厚膜電気部品の製造方法 Granted JPS62114205A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/797,092 US4622240A (en) 1985-11-12 1985-11-12 Process for manufacturing thick-film electrical components
US797092 1985-11-12

Publications (2)

Publication Number Publication Date
JPS62114205A true JPS62114205A (ja) 1987-05-26
JPH0451043B2 JPH0451043B2 (OSRAM) 1992-08-18

Family

ID=25169878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61202608A Granted JPS62114205A (ja) 1985-11-12 1986-08-28 厚膜電気部品の製造方法

Country Status (9)

Country Link
US (1) US4622240A (OSRAM)
EP (1) EP0222075B1 (OSRAM)
JP (1) JPS62114205A (OSRAM)
KR (1) KR900001799B1 (OSRAM)
BR (1) BR8604444A (OSRAM)
CA (1) CA1250054A (OSRAM)
DE (1) DE3682568D1 (OSRAM)
ES (1) ES2002282A6 (OSRAM)
ZA (1) ZA866245B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340485A (ja) * 1987-09-24 1991-02-21 Air Prod And Chem Inc 厚膜電子回路の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302412A (en) * 1989-02-03 1994-04-12 The Boc Group, Inc. Single atmosphere for firing compatible thick film material
CA2007199C (en) * 1989-02-03 1993-05-18 Satish S. Tamhankar Single atmosphere for firing copper compatible thick film materials
US5194294A (en) * 1989-02-20 1993-03-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
US4994436A (en) * 1989-03-10 1991-02-19 American Air Liquide Process for safely destroying organic binders in ceramic components during the firing process
FR2644665B1 (fr) * 1989-03-16 1996-05-03 Air Liquide Procede d'elaboration de moyens de connexions electriques, en particulier de substrats d'interconnexion pour circuits hybrides
DE69032742T2 (de) * 1989-08-09 1999-06-17 Rhomed, Inc., Albuquerque, N.Mex. Direkte radioetikettierung von antikörpern und sonstigen proteinen mittels technetium oder rhenium
US5601684A (en) * 1992-09-03 1997-02-11 Olympus Optical Co., Ltd. Method for manufacturing an ion flow electrostatic recording head
JPH09510949A (ja) * 1994-04-05 1997-11-04 ザ・ユニバーシティ・オブ・クイーンズランド 基体の被覆
US6395206B1 (en) 2000-06-05 2002-05-28 Praxair Technology, Inc. Method of removing an organic binder from a green ceramic form
JP2004050223A (ja) * 2002-07-19 2004-02-19 Denso Corp アルミニウム製品のろう付け方法とその炉
DE102009002664A1 (de) * 2009-04-27 2010-10-28 Sintertechnik Gmbh Kommutatoranordnung für einen Elektrokleinmotor
JP5826656B2 (ja) * 2012-02-06 2015-12-02 日東電工株式会社 導電性フィルムロールの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914517A (en) * 1971-02-23 1975-10-21 Owens Illinois Inc Method of forming a conductively coated crystalline glass article and product produced thereby
US3726006A (en) * 1971-04-28 1973-04-10 Us Army Method for sintering thick-film oxidizable silk-screened circuitry
US3914514A (en) * 1973-08-16 1975-10-21 Trw Inc Termination for resistor and method of making the same
US4122232A (en) * 1975-04-21 1978-10-24 Engelhard Minerals & Chemicals Corporation Air firable base metal conductors
GB2050327B (en) * 1979-03-21 1983-05-25 Plessey Inc Thick film circuits
US4296272A (en) * 1979-11-30 1981-10-20 Rca Corporation Composite substrate
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
DE3004606A1 (de) * 1980-02-08 1981-08-13 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum einbrennen von dickschicht-nichtedelmetall-pasten und vorrichtung zur durchfuehrung des verfahrens
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
US4567111A (en) * 1982-11-04 1986-01-28 Uop Inc. Conductive pigment-coated surfaces
JPS6021888A (ja) * 1983-07-18 1985-02-04 工業技術院長 セラミツクスのメタライズ法
US4540604A (en) * 1983-08-25 1985-09-10 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340485A (ja) * 1987-09-24 1991-02-21 Air Prod And Chem Inc 厚膜電子回路の製造方法

Also Published As

Publication number Publication date
ZA866245B (en) 1988-04-27
ES2002282A6 (es) 1988-08-01
EP0222075A2 (en) 1987-05-20
BR8604444A (pt) 1987-11-17
KR870004737A (ko) 1987-06-01
US4622240A (en) 1986-11-11
EP0222075B1 (en) 1991-11-21
JPH0451043B2 (OSRAM) 1992-08-18
DE3682568D1 (de) 1992-01-02
EP0222075A3 (en) 1989-02-08
CA1250054A (en) 1989-02-14
KR900001799B1 (ko) 1990-03-24

Similar Documents

Publication Publication Date Title
JPS62114205A (ja) 厚膜電気部品の製造方法
US3476586A (en) Method of coating carbon bodies and the resulting products
US4772488A (en) Organic binder removal using CO2 plasma
EP0243626B1 (en) Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
US4619836A (en) Method of fabricating thick film electrical components
JP3723753B2 (ja) 耐火性の構成部材上の被覆の製造方法及びかかる被覆の使用
EP0975464B1 (en) Silicon nitride coating compositions
KR910000799B1 (ko) 적외선 노를 사용한 구리 후막 전도체의 제조방법
JPH0688240A (ja) 金属支持体表面に珪素含有沈着物を形成させる方法、金属支持体の耐蝕処理方法及び金属化した重合体支持体
JPH0757815B2 (ja) 基板上にポリイミド層を形成する方法および硬化されている複合構造体
EP0316452B1 (en) Process for preparing thin film of base metal and application of the same
JPH0555600B2 (OSRAM)
US5194294A (en) Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
KR100742858B1 (ko) 접착성이 우수한 실리콘 산화피막의 연소화학 기상증착방법
DE19515069A1 (de) Verfahren zur Herstellung anorganischer Schichten auf Festkörperoberflächen mit Hilfe einer Coronaentladung
JP2005505096A5 (OSRAM)
SU1046345A1 (ru) Способ получени стеклоэмалевого покрыти на металлической поверхности
JPH06240346A (ja) 耐剥離性、耐摩耗性、耐ビルドアップ性に優れた熱処理炉用ロール
Yamada et al. Continuous Coating of Insulating Film on Stainless Steel Foil
JPH05856A (ja) 薄膜形成材料の焼成方法
JPH01249171A (ja) 無機酸化物膜を有する基体の製造方法
JPH11241169A (ja) 無機フィラー強化金属複合皮膜形成材料
JPH07187752A (ja) 電気絶縁性及び耐熱性ガラス状無機質体及びそれを有する耐熱性基材並びにその形成方法
FR2611692A1 (fr) Encres dielectriques pour circuits en cuivre a plusieurs couches
JPH01219039A (ja) ガラスセラミック基板