JPS62114058U - - Google Patents

Info

Publication number
JPS62114058U
JPS62114058U JP186686U JP186686U JPS62114058U JP S62114058 U JPS62114058 U JP S62114058U JP 186686 U JP186686 U JP 186686U JP 186686 U JP186686 U JP 186686U JP S62114058 U JPS62114058 U JP S62114058U
Authority
JP
Japan
Prior art keywords
target
sputtering apparatus
shield plate
plasma
holds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP186686U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP186686U priority Critical patent/JPS62114058U/ja
Publication of JPS62114058U publication Critical patent/JPS62114058U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP186686U 1986-01-09 1986-01-09 Pending JPS62114058U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP186686U JPS62114058U (fr) 1986-01-09 1986-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP186686U JPS62114058U (fr) 1986-01-09 1986-01-09

Publications (1)

Publication Number Publication Date
JPS62114058U true JPS62114058U (fr) 1987-07-20

Family

ID=30780172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP186686U Pending JPS62114058U (fr) 1986-01-09 1986-01-09

Country Status (1)

Country Link
JP (1) JPS62114058U (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (ja) * 2008-11-13 2010-05-27 Fujikura Ltd ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法
WO2014132308A1 (fr) * 2013-02-28 2014-09-04 キヤノンアネルバ株式会社 Dispositif de pulvérisation
JP2016003388A (ja) * 2014-06-19 2016-01-12 東京エレクトロン株式会社 板状部材の固定機構、ｐｖｄ処理装置及び板状部材の固定方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (ja) * 2008-11-13 2010-05-27 Fujikura Ltd ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法
WO2014132308A1 (fr) * 2013-02-28 2014-09-04 キヤノンアネルバ株式会社 Dispositif de pulvérisation
US9368331B2 (en) 2013-02-28 2016-06-14 Canon Anelva Corporation Sputtering apparatus
JP5934427B2 (ja) * 2013-02-28 2016-06-15 キヤノンアネルバ株式会社 スパッタリング装置
JP2016003388A (ja) * 2014-06-19 2016-01-12 東京エレクトロン株式会社 板状部材の固定機構、ｐｖｄ処理装置及び板状部材の固定方法

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