JPS62112399A - Assembly of duoble-sided mounting printed circuit wiring board - Google Patents
Assembly of duoble-sided mounting printed circuit wiring boardInfo
- Publication number
- JPS62112399A JPS62112399A JP25227185A JP25227185A JPS62112399A JP S62112399 A JPS62112399 A JP S62112399A JP 25227185 A JP25227185 A JP 25227185A JP 25227185 A JP25227185 A JP 25227185A JP S62112399 A JPS62112399 A JP S62112399A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- wiring board
- circuit wiring
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔２ヂ業上の利用分野〕
この発明は１両面実装印刷回路配線板組立のハンダ付げ
において１表面及び裏面の電子部品ハンダ付げに各々融
点の異なるノーンダを利用する事によって両面の電子部
品ハンダ付けを可能にした組立方法に関するものである
。[Detailed Description of the Invention] [Second Field of Industrial Application] This invention utilizes soldering agents with different melting points for soldering electronic components on the front and back sides of a single-sided printed circuit wiring board assembly. This invention relates to an assembly method that makes it possible to solder electronic components on both sides.
従来、この種の位刷回路配線板の組立方法は第２図に示
すものがあった。図において（１１は印刷回路配線板、
（２）は印刷回路配線板搭載重子部品、（３）は印刷回
路配線板導体上に印刷されたクリーム状ハンダ、（４）
は印刷回路配線板上に設けられた電子部品搭載用導体、
（５１はクリーム状ハンダが溶融した接合ハンダ、（８
）は′電子部品の固定を目的とした接着剤である
次に各部の作用に付いて説明する。第２図に示す印刷回
路配線板（１）の片面の電子部品搭載用導体（４）上に
クリーム状ハンダ（３）を印刷機により供給しその後、
電子部品搭載用導体（４）の間に遊子部品固定用接着剤
（８′Ｉを塗布し、更にその上から電子部品（２）を搭
載、電子部品（２）を遊子部品固定用接着剤（８）で固
定した直後、クリーム状ハンダ（３）を溶融し。Conventionally, there has been a method of assembling this type of printed circuit wiring board as shown in FIG. In the figure (11 is a printed circuit wiring board,
(2) is a component mounted on a printed circuit wiring board, (3) is cream solder printed on a printed circuit wiring board conductor, (4)
is a conductor for mounting electronic components on a printed circuit wiring board,
(51 is a joining solder made of melted creamy solder, (8
) is an adhesive for the purpose of fixing electronic parts.Next, the function of each part will be explained. Cream solder (3) is supplied by a printing machine onto the electronic component mounting conductor (4) on one side of the printed circuit wiring board (1) shown in FIG.
Apply the adhesive for fixing the playback component (8'I) between the electronic component mounting conductors (4), then mount the electronic component (2) on top of that, and apply the adhesive for fixing the playback component (8'I) to the electronic component (2). Immediately after fixing in step 8), melt the creamy solder (3).
電子部品搭載用導体（４）と遊子部お（２）は浴融ハン
ダ（５）を介して接続される。次に印刷配線板（１）を
反転し、もう片面の電子部品搭載用導体（４）上に同一
の融点をもつクリーム状ハンダ（３）を印刷機により供
給し、その後電子部品を搭載、クリーム状ハンダ（３）
を溶融する。その際、裏面側に存在するハンダ（５）も
溶融するが、！子部品固定用接着剤（８１によって電子
部品（２）は落下１位置ズレする事なく、クリーム状ハ
ンダ（３）が溶融シフ、溶融ハンダ［５１ＶＣよって電
子部品搭載用導体（４）と′ぼ子部品（２１は接続され
２両面実装印刷回路配線板組立が完了する。The electronic component mounting conductor (4) and the playback part (2) are connected via bath melting solder (5). Next, the printed wiring board (1) is reversed, and cream solder (3) with the same melting point is supplied by a printing machine onto the conductor (4) for mounting electronic components on the other side, and then the electronic components are mounted and the cream solder is shaped solder (3)
to melt. At that time, the solder (5) on the back side also melts! Due to the adhesive for fixing the child parts (81), the electronic part (2) falls without shifting its position, and the creamy solder (3) melts, and the molten solder [51VC allows the electronic part (2) to fall and stay in place. The parts (21) are connected to complete the assembly of the two-sided printed circuit wiring board.
従来の両面実装印刷回路配線板の組立を工、電子部品の
落下１位置ズレを防止するためＶｃ＆着剤を塗布し、電
子部品を同定しなげればならず、接着剤の塗布にあって
は童の制御、塗布の範囲を制御することが必要で、更に
加熱、紫外線によって硬化しなければならず、接着剤の
硬化設備が必要であり１組立工程が複雑化し９時間を要
するなどの問題があった。When assembling a conventional double-sided printed circuit wiring board, Vc and adhesive must be applied to prevent the electronic components from falling out of position, and the electronic components must be identified. It is necessary to control the temperature and the area of application, and it also has to be cured by heating and ultraviolet rays, which requires adhesive curing equipment, making the assembly process complicated and requiring 9 hours. there were.
この発明はかかる問題を改善するためになされたもので
あり、電子部品のハンダ付けに使用されるハンダの融点
を表面、裏面との間に差を付ける事によって５接着剤を
使用せずに′ｉ扛子部品を固定し。両面印刷回路配線機
の組立を可１１ヒにする事を提供するものである。This invention was made to improve this problem, and by creating a difference in the melting point of the solder used for soldering electronic parts between the front and back sides, it is possible to solder electronic parts without using adhesives. Fix the i-pump parts. To provide a double-sided printed circuit wiring machine that can be assembled in 11 seconds.
この発明圧係石部品の固定方法は、先ず高融点を特徴と
するクリーム状ハンダを片面の印刷回路配線板上に設け
られた電子部品搭載用導体上に印刷によって供給し、そ
の上に電子部品を搭載してクリーム状ハンダを浴融し、
ハンダ付けをする。The method for fixing the pressure stone parts of this invention is to first apply creamy solder, which is characterized by a high melting point, onto a conductor for mounting electronic components provided on a single-sided printed circuit wiring board by printing, and then mount the electronic components on top of it. Then, the creamy solder is melted in a bath.
Do the soldering.
次にもう片面の印刷回路配線板上Ｖｒ、設けられた直子
部品搭載用導体上知代融点を特徴とするクリーム状ハン
ダを印刷によって供給し、その上Ｋ ％子部品を搭載し
、先にハンダ付けした高融点を特徴とするハンダの融点
以下の熱によってハンダ付けする事により２先にハンダ
付けした′電子部品の落下及び位置ズレをなくすように
したものである。Next, on the other side of the printed circuit wiring board Vr, cream solder characterized by a melting point is supplied by printing on the conductor provided for mounting direct child components, and then K% child components are mounted and soldered first. By soldering using heat below the melting point of the solder, which is characterized by a high melting point, it is possible to prevent the electronic components soldered first from falling or shifting.
この発明は先に問題点を特徴とするハンダによって電子
部品がハンダ付けされ、後からハンダ付けする低融点を
′特徴とするハンダを浴１叙する時。The present invention first describes the use of a solder characterized by a low melting point when electronic components are soldered together using a solder characterized by problems, and then soldered later.
先て・・ンダ付けした高融点を特徴とするハンダの融点
以下の熱を加えてハンダ付けすることにより先にハンダ
付けされた電子部品のハンダが溶融することなく、電子
部品が固定されたまま、ハンダ付けが出き９両面印刷配
＃板の組立ハンダ付けが可能となる。By applying heat below the melting point of the solder, which is characterized by a high melting point, the solder of the previously soldered electronic components will not melt and the electronic components will remain fixed. , it is possible to assemble and solder 9 double-sided printed wiring boards.
以下、この発明の一実捲例を図に付いて説明する。第１
図において、（１）は印刷回路配線板、〔２）は印刷回
路配線板上に実装ハンダ付けされる電子部品、（３）は
高融点を特徴とするクリーム状ハンダ。Hereinafter, an example of winding the present invention will be explained with reference to the drawings. 1st
In the figure, (1) is a printed circuit wiring board, [2] is an electronic component that is mounted and soldered on the printed circuit wiring board, and (3) is a creamy solder characterized by a high melting point.
（４）は印刷回路配線板上に設けられた電子部品搭載用
導体、（５）は高融点を特徴とする溶融ハンダ、（６）
は低融点を特徴とするクリーム状ハンダ、（７）は低融
点を特徴とする溶融ハンダである。(4) is a conductor for mounting electronic components on a printed circuit wiring board, (5) is a molten solder characterized by a high melting point, and (6)
(7) is a creamy solder characterized by a low melting point, and (7) is a molten solder characterized by a low melting point.
次に上記−実抱例の作用を説明する。第１図（ａ）に示
す印刷回路配ｈａｆｌｌの片面の電子部品搭載用導体（
４）上に高融点を特徴とするクリーム状ハンタ。Next, the operation of the above-mentioned actual example will be explained. The conductor for mounting electronic components on one side of the printed circuit hafl shown in Figure 1(a)
4) Creamy hanta characterized by high melting point on top.
（３）を印刷機により供給し、更にその上に電子部品（
２）を搭載し、高融点を特徴とするクリーム状ハンダ（
３）を潜融し、電子部品搭載用導体（４）と電子部品（
２）は高融点を特徴とする溶融ハンダ（５１を介して接
続される７その状態を（ｂ） Ｋ示す。次匠印刷回路配
線板（１）を反転し、もう片面０１子部品搭載用導体（
４１上ｙｃ低融点を特徴とするクリーム状ハンダ（６）
を印刷機により供給する。その状態を（Ｃ） Ｋ示す。(3) is supplied by a printing machine, and electronic components (
2), a creamy solder with a high melting point (
3) is latently melted to form a conductor for mounting electronic components (4) and an electronic component (
2) is connected through molten solder (51), which is characterized by a high melting point. The state shown in (b) K is shown in (b). (
Creamy solder with low melting point (6)
is supplied by a printing machine. The state is shown in (C)K.
更にクリーム状ハンダ（６）の上に電子部品（２）を搭
載し低融点を特徴とするクリーム状ハンダを溶融する時
、先πハンダ付けされた高融点を特徴とする印刷回路配
線板の下面に位置するハンダ（５）は溶融することなく
、先にハンダ付けされた電子部品（２）はあたかも接着
剤によって固定されたごとく落下することなく１位置ズ
レもする事なく、電子部品（２）は抵融点を特徴とする
ハンダ（７）によって′電子部品（２）と電子部品搭載
用導体（４１はハンダ付げによって接続される。Furthermore, when the electronic component (2) is mounted on the creamy solder (6) and the creamy solder, which is characterized by a low melting point, is melted, the lower surface of the printed circuit wiring board, which is characterized by a high melting point, is soldered at the tip. The solder (5) located at the position does not melt, and the electronic component (2) that was soldered first does not fall or shift even one position, as if it had been fixed with adhesive. The electronic component (2) and the electronic component mounting conductor (41) are connected by soldering using a solder (7) having a low melting point.
なお、上記の実か＝ ｆｌＪは、印刷回路配線板メ板に
クリーム状ハンダを印刷によって供給する方法であるが
、マ・イクロディスクベンスによる供給力法、鳴流式ハ
ンダ槽による供給方法を使用しても同様の効果を奏する
。In addition, the above-mentioned method = flJ is a method of supplying creamy solder to a printed circuit wiring board by printing, but it also uses a supply force method using a micro disk vent and a supply method using a sonic flow solder bath. The same effect can be achieved even if
以上のように、ごの発明によれば１両−面実装印刷回路
配線板組立圧おいて、相方の面のハンダ付けπ使用され
るハイダに融点の差をつけることによって、電子部品固
定用接着剤を用いずに、Ｎ子部品を落下２位置ズレする
事なく、印刷回路配線の両面実装が得られろという効果
がある。As described above, according to the invention, when assembling a double-sided printed circuit wiring board, the adhesive for fixing electronic components can be created by applying a difference in melting point to the soldering π used on the other side. There is an effect that double-sided mounting of printed circuit wiring can be achieved without using a chemical agent and without the N child parts being dropped and shifting two positions.
第１図はこの発明に、ｒ、る方法を説明する図、第２図
は従来方法を説明する図である。
図中、 （ｌｌｆ）印刷回路配線板、（２）は電子部品
、（３）は尚融点クリーム状ハンダ、（４１は電子部品
搭載用導体、（５１は溶融ハンダ、（６）は低融点クリ
ーム状ハンダ、（７）は溶融ハンダ。
なお２図中同一符号は四−又は相当部分を示す。FIG. 1 is a diagram for explaining a method according to the present invention, and FIG. 2 is a diagram for explaining a conventional method. In the figure, (llf) is a printed circuit wiring board, (2) is an electronic component, (3) is a creamy solder with a low melting point, (41 is a conductor for mounting electronic components, (51 is a molten solder, and (6) is a low melting point cream. (7) is molten solder.The same reference numerals in the two figures indicate 4 or equivalent parts.
Claims (1)
構成される電子回路において、電子部品をハンダ付けす
る際のハンダの融点に差を付けた２種のハンダを使用し
、表面及び裏面のハンダ付けに各々融点の異なるハンダ
を利用して電子部品をハンダ付けすることによつて、片
面（例えば表面）がハンダ付けを完了し、更に片面（例
えば裏面）をハンダ付けする際の電子部品の落下及び位
置ズレを防止したことを特徴とする両面実装印刷回路配
線板組立方法。In electronic circuits that are constructed by mounting and soldering electronic components on the front and back sides of a printed circuit board, two types of solder with different melting points are used to solder the electronic components. By soldering electronic components using solders with different melting points, one side (e.g., the front side) has been soldered, and when the other side (e.g., the back side) is soldered, the electronic parts can be soldered. A method for assembling a double-sided printed circuit wiring board characterized by preventing falling and positional displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25227185A JPS62112399A (en) | 1985-11-11 | 1985-11-11 | Assembly of duoble-sided mounting printed circuit wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25227185A JPS62112399A (en) | 1985-11-11 | 1985-11-11 | Assembly of duoble-sided mounting printed circuit wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112399A true JPS62112399A (en) | 1987-05-23 |
Family
ID=17234915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25227185A Pending JPS62112399A (en) | 1985-11-11 | 1985-11-11 | Assembly of duoble-sided mounting printed circuit wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112399A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101790A (en) * | 1988-10-08 | 1990-04-13 | Rohm Co Ltd | Mounting method of electronic parts for substrate |
| JP2012058129A (en) * | 2010-09-10 | 2012-03-22 | Hideo Nishikawa | Contactor and method of manufacturing the same |
| WO2014171085A1 (en) * | 2013-04-18 | 2014-10-23 | 住友電装株式会社 | Method for manufacturing electronic circuit unit |
-
1985
- 1985-11-11 JP JP25227185A patent/JPS62112399A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101790A (en) * | 1988-10-08 | 1990-04-13 | Rohm Co Ltd | Mounting method of electronic parts for substrate |
| JP2012058129A (en) * | 2010-09-10 | 2012-03-22 | Hideo Nishikawa | Contactor and method of manufacturing the same |
| WO2014171085A1 (en) * | 2013-04-18 | 2014-10-23 | 住友電装株式会社 | Method for manufacturing electronic circuit unit |
| JP2014212196A (en) * | 2013-04-18 | 2014-11-13 | 住友電装株式会社 | Method for manufacturing electronic circuit unit |
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