JPH02101790A - Mounting method of electronic parts for substrate - Google Patents
Mounting method of electronic parts for substrateInfo
- Publication number
- JPH02101790A JPH02101790A JP63254392A JP25439288A JPH02101790A JP H02101790 A JPH02101790 A JP H02101790A JP 63254392 A JP63254392 A JP 63254392A JP 25439288 A JP25439288 A JP 25439288A JP H02101790 A JPH02101790 A JP H02101790A
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic parts
- solder
- substrate
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 43
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 7
- 239000006071 cream Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、予めプリント配線が施された基板の表裏両面
に対して、電子部品をリフロー半田付は法にて取付ける
場合における実装方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a mounting method when electronic components are attached by reflow soldering to both the front and back sides of a board on which printed wiring has been previously applied. It is.
従来、予めプリント配線が施された基板の表裏両面に対
して、電子部品をリフロー半田付は法にて取付けるには
、先づ、基板の表面を上向きにして、この表面における
プリント配線のうち、各電子部品における端子を接続す
るパッド部に、クリーム状半田を塗着したのち、各電子
部品の装着箇所に各々電子部品を接着剤にて接着し、接
着剤の硬化後において、基板を、当該基板における裏面
が上向きになるように裏返し、次いで、この裏面におけ
るプリント配線のうち、各電子部品における端子を接続
するパッド部に、クリーム状半田を塗着したのち、各電
子部品の装着箇所に各々電子部品を載置し、この状態で
リフロー炉に入れて加熱して、表裏両面における前記ク
リーム状半田を溶かすことにより、表裏両面における電
子部品を、表裏両面に対して半田付けする方法が採用さ
れている。Conventionally, in order to use reflow soldering to attach electronic components to both the front and back sides of a board that has been printed wiring in advance, first, the front side of the board is facing upward, and the printed wiring on this surface is After applying creamy solder to the pads that connect the terminals of each electronic component, each electronic component is adhered to the mounting location using adhesive, and after the adhesive has hardened, the board is attached to the corresponding board. Turn the board over so that the back side faces upwards, then apply creamy solder to the pads that connect the terminals of each electronic component among the printed wiring on the back side, and then apply cream solder to the mounting locations of each electronic component. A method is adopted in which the electronic components are placed on both the front and back sides by placing them in a reflow oven and heating them to melt the creamy solder on both the front and back sides. ing.
そして、この従来の実装方法において、基板の表面に対
して電子部品を接着剤にて接着するのは、基板を、その
裏面が上向きになり表面が下向きになるように裏返にし
たとき、表面に対する電子部品が落下することがないよ
うにするためであるが、従来の実装方法では、前記接着
剤を塗着する工程と、この接着剤を硬化する工程とを必
要し、これだけ工程が複雑になるから、基板の両面に対
する実装に要するコストがアンプするのである。In this conventional mounting method, electronic components are bonded to the surface of the board using adhesive when the board is turned over so that the back side is facing up and the front side is facing down. This is to prevent electronic components from falling, but conventional mounting methods require a process of applying the adhesive and a process of curing this adhesive, which makes the process complicated. This increases the cost required for mounting on both sides of the board.
また、基板の表面に塗着したクリーム状半田をリフロー
炉に入れて溶融するまでの間には、前記接着剤を塗着す
る工程、この接着剤を硬化する工程、基板を裏返す工程
、及び基板の裏面にクリーム状半田を塗着して電子部品
を載置する工程が存在し、表面に塗着したクリーム状半
田は、長い時間にわたって大気空気に曝されることによ
り、劣化現象が可成り進行するから、リフロー炉での半
田付けに際して、半田付は不良が発生したりするぽかり
か、半田ボール（半田の微小粒が、飛び散って電子部品
の端子やプリント配線等に付着すること）が発生するの
であった。In addition, before the creamy solder applied to the surface of the board is placed in a reflow oven and melted, there are a process of applying the adhesive, a process of curing this adhesive, a process of turning the board over, and a process of turning the board over. There is a process of applying creamy solder to the back side of the device and placing the electronic components thereon.The creamy solder applied to the surface of the device is exposed to atmospheric air for a long period of time, resulting in considerable deterioration. Therefore, when soldering in a reflow oven, solder defects may occur, or solder balls (small particles of solder scatter and adhere to the terminals of electronic components, printed wiring, etc.) occur. It was.
しかも、従来の実装方法では、基板の表面に実装する電
子部品を、基板の表面に対して接着剤にて固着するので
、基板の表面における電子部品の取付は位置を、半田を
溶かして修正すること、及び表面における電子部品を半
田を熔かして交換することができない点も問題であった
。Moreover, in the conventional mounting method, electronic components mounted on the surface of the board are fixed to the surface of the board with adhesive, so when mounting the electronic components on the surface of the board, the position must be corrected by melting solder. Another problem was that electronic components on the surface could not be replaced by melting solder.
本発明は、前記従来の実装方法が有する問題を解消した
実装方法を提供することを目的とするものである。An object of the present invention is to provide a mounting method that solves the problems of the conventional mounting methods.
この目的を達成するため本発明は、基板の表面を上向き
にして、この表面におけるプリント配線のパッド部に、
クリーム状半田を塗着したのち、基板の表面に電子部品
を、当該電子部品における端子が前記パッド部に接触す
るように載置し、この状態でリフロー炉に入れて基板の
表面に載置した電子部品を半田付けし、次いで、前記基
板を、その裏面が上向きになるように裏返にして、該裏
面におけるプリント配線のパッド部に、クリーム状半田
を塗着したのち、基板の裏面に電子部品を、当該電子部
品における端子が前記パッド部に接触するように載置し
、この状態でリフロー炉に入れて基板の裏面に載置した
電子部品を半田付けする構成にした。In order to achieve this object, the present invention has the surface of the substrate facing upward, and the pad portion of the printed wiring on this surface.
After applying the creamy solder, an electronic component was placed on the surface of the board so that the terminal of the electronic component was in contact with the pad portion, and in this state, it was placed in a reflow oven and placed on the surface of the board. After soldering the electronic components, turn the board over so that the back side faces upward, apply creamy solder to the pads of the printed wiring on the back side, and then solder the electronic components to the back side of the board. was placed so that the terminals of the electronic component were in contact with the pad portions, and in this state, the electronic component placed on the back surface of the board was placed in a reflow oven and soldered.
このような方法にすると、基板の表面に塗着したクリー
ム状半田は、基板の表面に電子部品を載置する工程を経
たのち、直ちにリフロー炉に入れらるれことになり、ま
た、基板の裏面に塗着したクリーム状半田も、基板の裏
面に電子部品を載置する工程を経たのち、直ちにリフロ
ー炉に入れられることになり、基板の表面および裏面に
塗着したクリーム状半田が、前記従来のように、長い時
間にわたって大気空気に曝されることを回避できるから
、クリーム状半田の劣化に伴う半田付は不良、及び半田
ボール等の発生を確実に防止できるのである。With this method, the creamy solder applied to the surface of the board will be put into the reflow oven immediately after the process of placing electronic components on the surface of the board, and the solder will be placed in the reflow oven. The creamy solder applied to the back side is also put into a reflow oven immediately after the process of placing electronic components on the backside of the board, and the creamy solder applied to the front and back sides of the board is Since it is possible to avoid exposure to atmospheric air for a long period of time as in the past, it is possible to reliably prevent soldering defects and the occurrence of solder balls due to deterioration of the creamy solder.
なお、基板の表面に載置した電子部品を基板の表面に対
して固着する半田は、基板の裏面に対する電子部品の半
田付けに際してリフロー炉に入れたとき、下向きになっ
た状態で溶けることになるが、この場合、基板の表面に
おけるパッド部の面積と、これに塗着するクリーム状半
田の塗着面積との比率を適当に選定することにより、熔
融半田の表面張力を大きくすることができるから、下向
き状態の電子部品が落下することを防止できるのである
。Note that the solder that fixes electronic components placed on the front surface of the board to the front surface of the board will melt with the solder facing downward when placed in a reflow oven when soldering electronic components to the back of the board. However, in this case, the surface tension of the molten solder can be increased by appropriately selecting the ratio between the area of the pad on the surface of the board and the area of the creamy solder applied thereto. , it is possible to prevent electronic components that are facing downward from falling.
また、本発明の実装方法は、基板の表面及び裏面におけ
る電子部品を、基板の表面及び裏面に対して各々半田付
けのみにて固着するものであるから、基板の表面及び裏
面における電子部品の取付は位置を修正すること、及び
、電子部品を交換することが至極容易にできるのである
。Furthermore, since the mounting method of the present invention fixes the electronic components on the front and back surfaces of the board only by soldering to the front and back surfaces of the board, the mounting method of the electronic components on the front and back surfaces of the board is easy. It is extremely easy to modify the position and replace the electronic components.
しかも、本発明の実装方法は、基板を二度にわたってリ
フロー炉に入れる工程を必要とするものの、前記従来の
ように、基板の表面に接着剤を塗着する工程と、該接着
剤を硬化する工程とを必要としないから、これだけ工程
が簡単になって、電子部品の実装に要するコトスの低減
を図ることができる効果を有する。Moreover, although the mounting method of the present invention requires the step of putting the board into a reflow oven twice, unlike the conventional method, there is a step of applying an adhesive to the surface of the board, and a step of curing the adhesive. Since no steps are required, the steps are simplified and the cost required for mounting electronic components can be reduced.
以下、本発明の実施例を図面について説明するに、図に
おいて符号１は、ガラエボ樹脂又はセラミック等の絶縁
体製の基板を示し、該基板１の表面１ａには、パッド部
２ａを備えたプリント配線２が形成され、また、基板１
の裏面１ｂにも、バ・ノド部３ａを備えたプリント配線
３が形成されている。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, reference numeral 1 indicates a substrate made of an insulator such as glass evo resin or ceramic, and the surface 1a of the substrate 1 is printed with a pad portion 2a. Wiring 2 is formed, and substrate 1
Also formed on the back surface 1b is a printed wiring 3 having a bar/knot portion 3a.
この基板１を、その表面１ａが上向きになるような状態
にして、その表面１ａにおける各プリント配線２のパッ
ド部２ａに、第１図に示すように、クリーム状半田４を
塗着したのち、前記基板１の表面１ａに、電子部品５，
６を、第２図に示すように、当該各電子部品５．６にお
ける各端子５ａ。After placing the board 1 in such a state that its surface 1a faces upward, and applying creamy solder 4 to the pad portion 2a of each printed wiring 2 on the surface 1a, as shown in FIG. Electronic components 5,
6, each terminal 5a in each electronic component 5.6, as shown in FIG.
６ａが前記パッド部２ａに接触するようにして載置し、
この状態で、基板１を、高い温度に保持されたリフロー
炉（図示せず）に入れて加熱し、前記クリーム状半田４
を溶かすことにより、表面１ａに載置した各電子部品５
．６を、表面１ａに対して半田付けする。6a is placed in contact with the pad portion 2a,
In this state, the substrate 1 is placed in a reflow oven (not shown) maintained at a high temperature and heated, and the creamy solder 4 is heated.
By melting each electronic component 5 placed on the surface 1a
．． 6 to the surface 1a.
次いで、前記基板１を、その裏面１ｂが上向きになり表
面１ａが下向きになるように裏返にして、上向きにした
裏面１ｂにおける各プリント配線３のパッド部３ａに、
第３図に示すように、クリーム状半田７を塗着したのち
、前記基板１の裏面１ｂに、電子部品８，９を、第４図
に示すように、当該各電子部品８．９における各端子３
ａ、９ａが前記パッド部３ａに接触するようにして載置
し、この状態で、基板１を、高い温度に保持されたりフ
ロー炉（図示せず）に入れて加熱し、前記クリーム状半
田７を溶かすことにより、表面１ｂに載置した各電子部
品８，９を、表面１ｂに対して半田付けする。Next, the substrate 1 is turned over so that the back surface 1b faces upward and the front surface 1a faces downward, and a pad portion 3a of each printed wiring 3 is placed on the upwardly facing back surface 1b.
As shown in FIG. 3, after applying creamy solder 7, electronic components 8 and 9 are attached to the back surface 1b of the substrate 1, as shown in FIG. terminal 3
a, 9a are placed in contact with the pad portion 3a, and in this state, the substrate 1 is heated by being held at a high temperature or placed in a flow furnace (not shown), and the creamy solder 7 is heated. By melting, the electronic components 8 and 9 placed on the surface 1b are soldered to the surface 1b.
この場合、基板１の裏面１ｂに対する各電子部品８，９
の半田付けに際して、基板１を、その裏面１ｂを上向き
にした状態でリフロー炉に入れると、基板１の表面１ａ
に対して各電子部品５，６を固着した半田が溶けること
により、各電子部品５．６が落下すると考えられるが、
本発明者達の実験によると、各電子部品５，６が通常の
大きさである場合、パッド部２ａの面積に対して、クリ
ーム状半田４の塗着面積を６５％以上にすることにより
、下向き状態の電子部品５，６が落下することを、溶融
半田の表面張力によって防止できるのであった。In this case, each electronic component 8, 9 on the back surface 1b of the board 1
When soldering, when the board 1 is placed in a reflow oven with the back side 1b facing upward, the front side 1a of the board 1
It is thought that each electronic component 5.6 falls due to the melting of the solder that fixed each electronic component 5, 6 against the
According to experiments conducted by the inventors, when the electronic components 5 and 6 are of normal size, by making the area of the cream solder 4 at least 65% of the area of the pad portion 2a, The surface tension of the molten solder could prevent the electronic components 5 and 6 facing downward from falling.
図面は本発明の実施例を示し、第１図は基板の表面にク
リーム状半田を塗着したときの斜視図、第２図は基板の
表面に電子部品を搭載したときの斜視図、第３図は基板
を裏返にして基板の裏面にクリーム状半田を塗着したと
きの斜視図、第４図は基板の裏面に電子部品を搭載した
ときの斜視図である。
１・・・・基板、１ａ・・・・基板の表面、１ｂ・・・
・基板の裏面、２，３・・・・プリント配線、２ａ、３
ａ・・・・パッド部、４，７・・・・クリーム状半田、
５゜６．８．９・・・・電子部品、５ａ、 ６ａ、３
ａ、９ａ・・・・電子部品の端子。The drawings show embodiments of the present invention, and FIG. 1 is a perspective view when creamy solder is applied to the surface of a board, FIG. 2 is a perspective view when electronic components are mounted on the surface of the board, and FIG. The figure is a perspective view when the board is turned over and creamy solder is applied to the back surface of the board, and FIG. 4 is a perspective view when electronic components are mounted on the back surface of the board. 1...Substrate, 1a...Surface of substrate, 1b...
・Back side of board, 2, 3...Printed wiring, 2a, 3
a... Pad part, 4, 7... Creamy solder,
5゜6.8.9...Electronic parts, 5a, 6a, 3
a, 9a...Terminals of electronic components.
Claims (1)
リント配線のパッド部に、クリーム状半田を塗着したの
ち、基板の表面に電子部品を、当該電子部品における端
子が前記パッド部に接触するように載置し、この状態で
リフロー炉に入れて基板の表面に載置した電子部品を半
田付けし、次いで、前記基板を、その裏面が上向きにな
るように裏返にして、該裏面におけるプリント配線のパ
ッド部に、クリーム状半田を塗着したのち、基板の裏面
に電子部品を、当該電子部品における端子が前記パッド
部に接触するように載置し、この状態でリフロー炉に入
れて基板の裏面に載置した電子部品を半田付けすること
を特徴とする基板に対する電子部品の実装方法。(1) With the surface of the board facing upward, apply creamy solder to the pad of the printed wiring on this surface, and then place an electronic component on the surface of the board, with the terminal of the electronic component contacting the pad. In this state, the electronic components placed on the surface of the board are soldered by placing it in a reflow oven, and then turning the board over so that the back side faces upward, and printing on the back side. After applying creamy solder to the pads of the wiring, an electronic component is placed on the back side of the board so that the terminals of the electronic component are in contact with the pads, and in this state, the board is placed in a reflow oven. 1. A method for mounting electronic components on a board, the method comprising soldering electronic components placed on the back surface of a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63254392A JPH02101790A (en) | 1988-10-08 | 1988-10-08 | Mounting method of electronic parts for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63254392A JPH02101790A (en) | 1988-10-08 | 1988-10-08 | Mounting method of electronic parts for substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101790A true JPH02101790A (en) | 1990-04-13 |
Family
ID=17264341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63254392A Pending JPH02101790A (en) | 1988-10-08 | 1988-10-08 | Mounting method of electronic parts for substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101790A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202920A (en) * | 2014-09-04 | 2014-12-10 | 浪潮电子信息产业股份有限公司 | Double-side Printed Circuit Board Assembly (PCBA) based one-time reflow soldering method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61199694A (en) * | 1985-03-01 | 1986-09-04 | 富士電機株式会社 | Manufacture of hybrid integrated circuit |
| JPS62112399A (en) * | 1985-11-11 | 1987-05-23 | 三菱電機株式会社 | Assembly of duoble-sided mounting printed circuit wiring board |
-
1988
- 1988-10-08 JP JP63254392A patent/JPH02101790A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61199694A (en) * | 1985-03-01 | 1986-09-04 | 富士電機株式会社 | Manufacture of hybrid integrated circuit |
| JPS62112399A (en) * | 1985-11-11 | 1987-05-23 | 三菱電機株式会社 | Assembly of duoble-sided mounting printed circuit wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104202920A (en) * | 2014-09-04 | 2014-12-10 | 浪潮电子信息产业股份有限公司 | Double-side Printed Circuit Board Assembly (PCBA) based one-time reflow soldering method |
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