JPS62110889U - - Google Patents

Info

Publication number
JPS62110889U
JPS62110889U JP12199385U JP12199385U JPS62110889U JP S62110889 U JPS62110889 U JP S62110889U JP 12199385 U JP12199385 U JP 12199385U JP 12199385 U JP12199385 U JP 12199385U JP S62110889 U JPS62110889 U JP S62110889U
Authority
JP
Japan
Prior art keywords
mold
sop
suction pad
metal pipe
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12199385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12199385U priority Critical patent/JPS62110889U/ja
Publication of JPS62110889U publication Critical patent/JPS62110889U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の吸着パツドの側面断面図で
あり、第２図は、本考案の下部図、第３図は、Ｆ
Ｐ及びＳＯＰモールド・ＩＣを吸着した状態の側
面断面図である。 １…金属パイプ、２…真空供給孔、３…真空供
給溝、４…ゴム製パツド、５…ＦＰ及びＳＯＰモ
ールド・ＩＣ、６…吸着変形したゴム製吸着パツ
ド。 FIG. 1 is a side sectional view of the suction pad of the present invention, FIG. 2 is a bottom view of the present invention, and FIG.
It is a side cross-sectional view of a state in which P and SOP molds and ICs are adsorbed. 1... Metal pipe, 2... Vacuum supply hole, 3... Vacuum supply groove, 4... Rubber pad, 5... FP and SOP mold/IC, 6... Rubber suction pad deformed by suction.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＦＰ又は、ＳＯＰモールド・ＩＣを、吸着搬送
する機構を有する、ハンドリング装置の吸着パツ
ドに於いて、吸着パツドを取り付け、及び、真空
を供給する金属パイプと、形状可変なゴム製パツ
ドを有し、前記金属パイプは、前記ＦＰ又はＳＯ
Ｐモールド・ＩＣを吸着した状態において、前記
ＦＰ又はＳＯＰモールド・ＩＣと接し、前記ＦＰ
又はＳＯＰモールド・ＩＣを水平に保持すること
を特徴とする吸着パツド。 A suction pad of a handling device having a mechanism for sucking and transporting FP or SOP mold/IC, has a metal pipe to which the suction pad is attached and supplies vacuum, and a rubber pad whose shape is variable, The metal pipe is the FP or SO
In the state where the P mold/IC is adsorbed, contact with the FP or SOP mold/IC, and the FP
Or a suction pad that holds the SOP mold/IC horizontally.
JP12199385U 1985-08-08 1985-08-08 Pending JPS62110889U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12199385U JPS62110889U (en) 1985-08-08 1985-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12199385U JPS62110889U (en) 1985-08-08 1985-08-08

Publications (1)

Publication Number Publication Date
JPS62110889U true JPS62110889U (en) 1987-07-15

Family

ID=31011775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12199385U Pending JPS62110889U (en) 1985-08-08 1985-08-08

Country Status (1)

Country Link
JP (1) JPS62110889U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355134U (en) * 1989-10-04 1991-05-28
JP2010272778A (en) * 2009-05-25 2010-12-02 Hioki Ee Corp Substrate warpage correction device
JP2011165850A (en) * 2010-02-09 2011-08-25 Fujikura Ltd Substrate sucking device, and substrate sucking method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750230U (en) * 1980-09-08 1982-03-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750230U (en) * 1980-09-08 1982-03-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355134U (en) * 1989-10-04 1991-05-28
JP2010272778A (en) * 2009-05-25 2010-12-02 Hioki Ee Corp Substrate warpage correction device
JP2011165850A (en) * 2010-02-09 2011-08-25 Fujikura Ltd Substrate sucking device, and substrate sucking method

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