JPS62110889U - - Google Patents
Info
- Publication number
- JPS62110889U JPS62110889U JP12199385U JP12199385U JPS62110889U JP S62110889 U JPS62110889 U JP S62110889U JP 12199385 U JP12199385 U JP 12199385U JP 12199385 U JP12199385 U JP 12199385U JP S62110889 U JPS62110889 U JP S62110889U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sop
- suction pad
- metal pipe
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
Description
第１図は、本考案の吸着パツドの側面断面図で
あり、第２図は、本考案の下部図、第３図は、Ｆ
Ｐ及びＳＯＰモールド・ＩＣを吸着した状態の側
面断面図である。
１…金属パイプ、２…真空供給孔、３…真空供
給溝、４…ゴム製パツド、５…ＦＰ及びＳＯＰモ
ールド・ＩＣ、６…吸着変形したゴム製吸着パツ
ド。
FIG. 1 is a side sectional view of the suction pad of the present invention, FIG. 2 is a bottom view of the present invention, and FIG.
It is a side cross-sectional view of a state in which P and SOP molds and ICs are adsorbed. 1... Metal pipe, 2... Vacuum supply hole, 3... Vacuum supply groove, 4... Rubber pad, 5... FP and SOP mold/IC, 6... Rubber suction pad deformed by suction.
Claims (1)
する機構を有する、ハンドリング装置の吸着パツ
ドに於いて、吸着パツドを取り付け、及び、真空
を供給する金属パイプと、形状可変なゴム製パツ
ドを有し、前記金属パイプは、前記ＦＰ又はＳＯ
Ｐモールド・ＩＣを吸着した状態において、前記
ＦＰ又はＳＯＰモールド・ＩＣと接し、前記ＦＰ
又はＳＯＰモールド・ＩＣを水平に保持すること
を特徴とする吸着パツド。 A suction pad of a handling device having a mechanism for sucking and transporting FP or SOP mold/IC, has a metal pipe to which the suction pad is attached and supplies vacuum, and a rubber pad whose shape is variable, The metal pipe is the FP or SO
In the state where the P mold/IC is adsorbed, contact with the FP or SOP mold/IC, and the FP
Or a suction pad that holds the SOP mold/IC horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12199385U JPS62110889U (en) | 1985-08-08 | 1985-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12199385U JPS62110889U (en) | 1985-08-08 | 1985-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62110889U true JPS62110889U (en) | 1987-07-15 |
Family
ID=31011775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12199385U Pending JPS62110889U (en) | 1985-08-08 | 1985-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62110889U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0355134U (en) * | 1989-10-04 | 1991-05-28 | ||
| JP2010272778A (en) * | 2009-05-25 | 2010-12-02 | Hioki Ee Corp | Substrate warpage correction device |
| JP2011165850A (en) * | 2010-02-09 | 2011-08-25 | Fujikura Ltd | Substrate sucking device, and substrate sucking method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750230U (en) * | 1980-09-08 | 1982-03-23 |
-
1985
- 1985-08-08 JP JP12199385U patent/JPS62110889U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750230U (en) * | 1980-09-08 | 1982-03-23 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0355134U (en) * | 1989-10-04 | 1991-05-28 | ||
| JP2010272778A (en) * | 2009-05-25 | 2010-12-02 | Hioki Ee Corp | Substrate warpage correction device |
| JP2011165850A (en) * | 2010-02-09 | 2011-08-25 | Fujikura Ltd | Substrate sucking device, and substrate sucking method |