JP2011165850A - Substrate sucking device, and substrate sucking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate sucking device that holds constant a holding state of a substrate sucked by a suction head and a suction pad. <P>SOLUTION: The substrate sucking device includes the suction head 2 and the suction pad 3 mounted on a tip outer peripheral part of the suction head 2 and elastically displaced, and configures to suck the substrate 15 by those suction head 2 and suction pad 3. In the substrate sucking device, a suction surface 10 of the suction pad 3 protrudes forward from a tip surface 12 of the suction head 2. When the suction head 3 bends through vacuuming, the substrate 15 comes in contact with the tip surface 12 of the suction head 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate suction apparatus and a substrate suction method for sucking and sucking a substrate with a suction pad.

  For example, some flexible printed wiring boards (FPCs) have a reinforcing plate attached for the purpose of reinforcing a fitting portion or a connector portion attached to the wiring board (for example, described in Patent Document 1). ).

  In order to attach the reinforcing plate to the flexible printed wiring board, the reinforcing plate stacked on the tray is picked up and taken out by the substrate suction device, and then the reinforcing plate is transported to the table provided with the flexible printed wiring board. A reinforcing plate is placed and fixed at a predetermined position of the printed wiring board (for example, described in Patent Document 2).

  This type of substrate suction device is configured to suck the reinforcing plate by pressing the reinforcing plate with a rubber suction pad and vacuuming the air suction passage formed at the center of the suction pad to create a vacuum state. Has been.

JP 2003-92458 A JP 2007-189142 A

  However, when a rubber suction pad is used, the suction pad is crushed with no directionality, so that the holding state of the reinforcing plate to be sucked and changed changes. Specifically, the suction horizontal position and the suction height position of the reinforcing plate with respect to the substrate suction device are not constant. As a result, the bonding accuracy of the reinforcing plate to the flexible printed wiring board is lowered.

  On the other hand, when a resin suction pad that does not elastically deform is used instead of the rubber suction pad, the reinforcing plate is taken out from the tray and transported to the bonding position, or during rotation to change the direction of the reinforcing plate. The reinforcing plate adsorbed on the tip is easy to slide from the adsorbing pad. Therefore, in the case of using a resin suction pad, as in the case of using a rubber suction pad, a reduction in the accuracy of attaching the reinforcing plate to the flexible printed wiring board is inevitable.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate suction apparatus and a substrate suction method that can keep the held state of a sucked substrate constant.

  The invention described in claim 1 includes a suction head having an air suction passage that is vacuumed and is in a vacuum state, and a suction pad that is elastically displaceable attached to the outer periphery of the tip of the suction head. And a suction device for sucking the substrate with the suction pad, wherein the suction surface of the suction pad is brought into contact with the substrate prior to the tip surface of the suction head when sucking the substrate. And the suction pad is bent by the vacuum, and the substrate is sucked to the tip surface of the suction head.

  A second aspect of the present invention is the substrate suction apparatus according to the first aspect, wherein the suction pad is made of a rubber material and is attached to the outer peripheral portion of the tip of the suction head.

  A third aspect of the present invention is the substrate suction apparatus according to the first or second aspect, wherein when the substrate picked up by the suction head is photographed by an image pickup means, the image behind the substrate is reflected. It is characterized in that a background reflection preventing portion larger than the substrate for preventing the recording is provided.

  According to a fourth aspect of the present invention, there is provided a substrate adsorption method for adsorbing a substrate by vacuuming with a substrate adsorption device provided with an elastically displaceable adsorption pad attached to the outer periphery of the tip of the adsorption head, wherein the adsorption pad After contacting the substrate prior to the suction head, the suction pad is bent by the vacuum, and the substrate comes into contact with the tip surface of the suction head and is sucked.

  According to the substrate suction apparatus of the present invention, after the elastically displaceable suction pad comes into contact with the substrate prior to the tip surface of the suction head, the suction pad is bent by the vacuum and the substrate is sucked to the tip surface of the suction head. Therefore, the crushing direction of the suction pad attached to the outer periphery of the tip of the suction head is regulated by this suction head. Further, according to the substrate suction device of the present invention, the suction pad is bent by the vacuum and the substrate is sucked to the front end surface of the suction head, so that the substrate is sucked and held by both the suction pad and the suction head. In addition, it is possible to prevent the rotation deviation of the substrate and to make the adsorption height position of the substrate constant.

FIG. 1 is a cross-sectional view showing the entire substrate suction apparatus of this embodiment. FIG. 2 is an enlarged cross-sectional view showing the main part of the tip portion of the substrate suction apparatus of the present embodiment. FIG. 3 is a process diagram for adsorbing a substrate by the substrate adsorbing device of this embodiment, (A) is a cross-sectional view showing a state before adsorbing the substrate, and (B) is a state in which an adsorbing pad is brought into contact with the substrate on the tray. FIG. FIG. 4 is a process diagram for adsorbing a substrate by the substrate adsorbing apparatus of the present embodiment, and is a cross-sectional view showing a state in which the substrate is brought into contact with and adsorbed on the tip surface of the adsorption head by vacuuming. FIG. 5 is a process diagram for adsorbing a substrate by the substrate adsorbing apparatus of the present embodiment, and is a cross-sectional view showing a state in which the adsorbed substrate is bonded onto a flexible printed wiring board. FIG. 6 is a process diagram for adsorbing a substrate by a substrate adsorbing device equipped with a rubber adsorbing pad and bonding the substrate onto a flexible printed circuit board. FIG. 6A shows a state before adsorbing the substrate, and FIG. The state which adsorb | sucked the board | substrate with the pad is shown, (C) shows the state which affixes the adsorbed board | substrate on a flexible printed wiring board. FIG. 7 is a cross-sectional view showing a resin-made suction pad. FIG. 8 is a diagram showing the slip amount between the suction pad and the substrate when the substrate is sucked with the rubber suction pad and the resin suction pad and the substrate is repeatedly moved in the horizontal direction. FIG. 9 is a diagram showing a slip angle between the suction pad and the substrate when the substrate is sucked with the rubber suction pad and the resin suction pad and the substrate is rotated in the in-plane direction.

Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.
[Description of structure of substrate adsorption device]
First, the structure of the substrate suction apparatus of this embodiment will be described. As shown in FIGS. 1 and 2, the substrate suction apparatus of the present embodiment is attached to a suction head 2 having an air suction passage 1 that is vacuumed and brought into a vacuum state, and a front end outer periphery of the suction head 2. A suction pad 3 capable of elastic displacement is provided, and the suction head 2 and the suction pad 3 are configured to suck the substrate.

  The suction head 2 includes a large-diameter portion 4 to which a vacuum means is connected, a small-diameter portion 5 smaller than the large-diameter portion 4, a pad mounting portion 6 for mounting the suction pad 3, and a background reflection prevention portion 7. Become. The suction head 2 is made of a resin having a hardness higher than that of the suction pad 3. For example, the suction head 2 is formed by molding MC nylon (trade name) manufactured by Nippon Polypenco.

  The large-diameter portion 4 is formed with a screw hole 8 for connecting a vacuum means for making the air suction passage 1 in a vacuum state. The screw hole 8 is formed through the air suction passage 1 from the outside of the large diameter portion 4. The small diameter portion 5 is formed on the distal end side of the large diameter portion 4 and has a smaller diameter than the large diameter portion 4. The pad mounting portion 6 is formed at the tip of the small diameter portion 5 and has a smaller diameter than the small diameter portion 5. The pad mounting portion 6 is formed with a step portion 9 that prevents the suction pad 3 mounted on the outer peripheral portion from falling off. Since the suction pad 3 is locked to the stepped portion 9, the suction pad 3 is prevented from falling off from the pad mounting portion 6.

  The background reflection preventing portion 7 is formed between the large diameter portion 4 and the small diameter portion 5. The background reflection prevention unit 7 is formed in a disk shape that is larger than the large-diameter portion 4 and has a larger diameter than a substrate that is an adsorption target described later. The background reflection prevention unit 7 functions to prevent any object from being reflected on the back side of the substrate when the picked-up substrate is imaged by the imaging means from below to above.

  The suction pad 3 is made of a rubber material such as NBR (nitrile rubber) or silicone rubber, for example, and is attached to the outer periphery of the tip of the suction head 2. Since NBR or silicone rubber has sufficient heat resistance, it can sufficiently withstand even if the substrate is pressed onto a warmed table described later. The suction pad 3 includes a skirt portion 3 </ b> A that comes into contact with the substrate and a body portion 3 </ b> B that comes into close contact with the outer periphery of the pad mounting portion 6. In the skirt portion 3A, slits 11 are formed in the radial direction so that the skirt portion 3A can be easily bent by its own elasticity when the entire substrate suction device 2 is lowered and the suction surface 10 is pressed against the substrate.

  Further, the suction surface 10 of the suction pad 3 protrudes forward from the tip surface 12 of the suction head 2 so as to contact the substrate prior to the tip surface 12 of the suction head 2 when sucking the substrate. . From another viewpoint, the tip surface 12 of the suction head 2 is set back from the suction surface 10 of the suction pad 3 by a distance H. The distance H is shorter than the bending allowance (crushing allowance) of the skirt portion 3A. For example, when the bending allowance of the skirt portion 3A is 0.5 cm, the distance H is about 0.3 cm, which is shorter than that value.

  If the distance H is longer than the bending allowance of the skirt portion 3A, the tip surface 12 of the suction head 2 does not contact the substrate when the substrate is pressed. On the other hand, if the tip surface 12 of the suction head 2 protrudes from the suction surface 10 of the suction pad 3, the skirt portion 3A will not bend.

[Description of substrate adsorption method]
Next, a method for adsorbing a substrate using the substrate adsorbing device configured as described above will be described. First, as shown in FIG. 3A, the substrate suction device 13 is set at a predetermined position. Next, the substrate suction device 13 is lowered so as to approach the substrate 15 placed on the tray 14, as shown in FIG.

  When the substrate suction device 13 is lowered so as to approach the substrate 15, the suction pad 3 contacts the substrate 15 prior to the suction head 2. Specifically, the suction surface 10 of the suction pad 3 contacts the substrate 15 before the tip surface 12 of the suction head 2. And the position which presses the board | substrate 15 only with the suction pad 3 which consists of rubber materials so that force may not be applied to the tray 14 with the board | substrate suction apparatus 13 is made into a bottom dead center. For the substrate 15, for example, a reinforcing plate for reinforcing a fitting portion or a connector portion attached to a flexible printed wiring board is used. In the present embodiment, a metal plate having a thickness of about 0.1 mm is used as the substrate 15.

  Next, the air suction passage 1 is evacuated by vacuuming with a vacuum means. When the degree of vacuum in the air suction passage 1 is increased, the skirt portion 3A of the suction pad 3 is contracted, and the substrate 15 is lifted upward. The substrate 15 finally comes into contact with the front end surface 12 of the suction head 2. As a result, the substrate 15 is sucked and held by the substrate sucking device 13 while being in contact with the tip surface 12 of the suction head 2 and the suction surface 10 of the suction pad 3.

  Next, after taking out the board | substrate 15 from the tray 14, the board | substrate adsorption | suction apparatus 13 is moved and the board | substrate 15 is arrange | positioned just above the camera (imaging means) 16 shown in FIG. By taking an image when the substrate 15 is sucked by the suction pad 3 by the camera 16, the reference position and inclination of the substrate 15 with respect to the suction pad 3 are examined. The reference position and inclination of the substrate 15 with respect to the suction pad 3 are obtained from the angle formed by the position of the reference hole provided in the substrate 15 and one side of the substrate 15 and the reference line. In order to obtain the angle formed by the positions of these reference holes and the angle, the vertical distance (focal length) L between the substrate 15 sucked by the suction pad 3 and the camera 16 is required. Therefore, the vertical distance L between the substrate 15 and the camera 16 must be accurate.

  In the present embodiment, the substrate 15 is in a state of being in contact with the tip surface 12 of the suction head 2 made of a resin having higher hardness than the suction pad 3 in addition to being sucked by the suction pad 3 made of a rubber material. is there. As a result, even if the substrate 15 is taken out from the tray 14 a plurality of times, the suction height of the substrate 15 with respect to the substrate suction device 13 is always constant, so that the vertical distance L between the substrate 15 and the camera 16 varies. Disappears. Thereby, the reference position and inclination of the substrate 15 with respect to the substrate suction device 13 can be accurately measured.

  Next, as shown in FIG. 5, the substrate suction device 13 is moved onto a table on which the flexible printed wiring board 17 is provided, and the substrate 15 is positioned and bonded to a predetermined portion of the flexible printed wiring board 17. When the substrate 15 was bonded to the flexible printed wiring board 17, the arrangement state of the flexible printed wiring board 17 with respect to the table was photographed with a camera (not shown) different from the previous camera, and obtained by photographing. The arrangement position and inclination of the flexible printed wiring board 17 with respect to the table are obtained from the image. Then, using the reference position and inclination of the flexible printed wiring board 17 and the reference position and inclination of the substrate 15 sucked by the previous suction pad 3 as well as the positions of the two as data, the substrate suction device 13 is lowered and the flexible printed wiring The substrate 15 is placed on a predetermined portion of the plate 17.

  A hot melt adhesive is applied to the substrate attachment portion of the flexible printed wiring board 17. On the other hand, the table is heated by a heater or the like. For this reason, the board | substrate 15 is affixed on the flexible printed wiring board 17 with the adhesive agent in a semi-molten state. When the substrate 15 is attached to the flexible printed wiring board 17, the substrate 15 is pressed against the flexible printed wiring board 17 with a certain force. As a result, the substrate 15 is accurately attached to a predetermined portion of the flexible printed wiring board 17.

  On the other hand, only the rubber material shown in FIG. 6 is used instead of the substrate suction device 13 in which the suction pad 3 made of a rubber material and the suction head 2 made of a resin having higher hardness than the suction pad 3 are combined as in the present embodiment. When the substrate suction device 19 having the suction pad 18 formed in step 1 and the substrate suction device 21 including the suction head 20 formed only from the resin shown in FIG. 7 are used, the substrate suction device 13 of the present embodiment is used. 15 cannot be accurately attached to the flexible printed wiring board 17.

  In the substrate suction device 19 having the suction pad 18 formed of only the rubber material shown in FIG. 6, when the suction pad 18 is pressed against the substrate 15 and vacuumed, the vacuum inside the suction pad increases, so that the skirt portion 18 </ b> A is bent. Then, the substrate 15 is shrunk and the substrate 15 is lifted upward (the state shown in FIGS. 6A to 6B is obtained).

  The lift amount SF of the substrate 15 is determined by the balance between the vacuum degree due to the vacuum and the substrate weight, and is not always constant as in the present embodiment. Therefore, the vertical distance (focal length) L between the substrate 15 and the camera 16 is likely to change every time the substrate is taken out. As a result, the position and inclination of the substrate 15 sucked by the suction pad 18 cannot be measured accurately. Further, if the bottom dead center position of the suction pad 18 that sucks the substrate 15 (in other words, the vertical distance L) changes, the flexible printing is performed while the two substrates 15 are stacked as shown in FIG. There is a possibility of sticking to the wiring board 17. In particular, when a very thin metal plate of about 0.1 mm is used as the substrate 15, the substrate 15 may be attached to the flexible printed wiring board 17 with two sheets being stacked.

  Further, the suction pad 18 made of only a rubber material does not have directionality in the direction of crushing, so the suction state of the substrate 15 is not constant. Therefore, every time the substrate 15 is sucked, the suction state of the substrate 15 with respect to the suction pad 18 changes, which adversely affects the bonding accuracy to the flexible printed wiring board 17.

  On the other hand, in the substrate suction device 21 including the suction head 20 formed only of the resin shown in FIG. 7, when the substrate 15 is pushed out by the suction head 20 when the substrate 15 is taken out from the tray 14, the tray 14 itself is deformed and the substrate 15 is removed. An error may occur due to failure to absorb.

  Further, after the substrate 15 is picked up from the tray 14 and moved to the position where the camera 16 is provided, the operation of moving the substrate 15 again to the table provided with the flexible printed wiring board 17 is performed, but productivity is improved. Accordingly, it is required to increase the speed of movement of the substrate suction device. When the substrate suction device is moved at a high speed, the substrate suction device 21 composed of the suction head 20 made of only resin causes a slip at a portion where the substrate 15 is sucked.

  For example, the displacement of the substrate 15 before and after the movement when the substrate suction device 21 is made to reciprocate 10 times in each stroke with acceleration when the stroke is set to 162 mm, 300 mm, and 540 mm in the X direction and the Y direction which are horizontal directions. FIG. 8 shows the result of measuring the amount of displacement between the suction pad and the substrate. In this experiment, the diameter Φ of the air suction passage 1 opened to the tip 22 of the suction head 20 was 1.5 mm and 3.0 mm. Moreover, it measured similarly using the board | substrate adsorption | suction apparatus 13 of this embodiment shown in FIG. In FIG. 8, diagonal lines indicate experimental data when the diameter is 1.5 mm, black marks indicate experimental data when the diameter is 3.0 mm, and white lines indicate experimental data of the present embodiment.

  As can be seen from this result, when the diameter Φ of the suction passage 1 is 1.5 mm, a large slip occurs in the Y direction when the stroke is 300 mm. When the diameter Φ of the suction passage 1 is 3.0 mm (shown in black in FIG. 8), the amount of slip is smaller than that in Φ1.5 mm (shown by the hatched line in FIG. 8), but it is not within a negligible range. On the other hand, in the present embodiment (shown in white in FIG. 8), the amount of slippage slipping in any of the X direction and the Y direction is small and can be ignored.

  FIG. 9 shows an experimental result of measuring the slip amount while rotating the substrate suction device 21 in a horizontal plane and gradually increasing the angular acceleration of the rotation. In FIG. 9, line A is experimental data when using the substrate suction device 21 with the air suction passage 1 having a diameter of 3.0 mm, and line B is experimental data when using the substrate suction device 13 of this embodiment. . When the diameter Φ of the suction passage 1 is 3.0 mm, it slips before reaching the maximum angular acceleration (about 17,000 degrees / s 2) of the apparatus. On the other hand, in the substrate suction device 13 of the present embodiment, no slip occurs even at the maximum angular acceleration of the device.

  As described above, according to the substrate suction device of the present embodiment, the suction pad 3 that can be elastically displaced comes into contact with the substrate 15 prior to the front end surface 12 of the suction head 2 and then the suction pad 3 is bent by the vacuum. Since the substrate 15 is adsorbed to the tip surface 12 of the suction head 2, the crushing direction of the suction pad 3 mounted on the outer periphery of the tip of the suction head 2 is regulated by the suction head 2. Therefore, there is no change in the suction state of the substrate 15 due to the fact that the collapse direction of the suction pad 3 is not determined as in the prior art, and the substrate 15 can always be sucked and held in a constant state. Further, when the substrate 15 is sucked, the substrate 15 comes into contact with the tip surface 12 of the suction head 2 and the suction pad 3 is not further crushed, so that the suction state of the substrate 15 is stabilized. As a result, according to the substrate suction device of this embodiment, the accuracy of attaching the substrate 15 to the flexible printed wiring board 17 can be increased.

  Further, according to the substrate suction device of the present embodiment, since the substrate 15 contacts the front end surface 12 of the suction head 2, an accurate bottom dead center position is detected when the substrate 15 is attached to the flexible printed wiring board 17. can do. Thereby, it is possible to prevent two substrates 15 from being stacked and attached to the flexible printed wiring board 17.

  Further, according to the substrate suction apparatus of the present embodiment, the skirt portion 3A of the suction pad 3 is contracted by sucking the substrate 15 by vacuum, but the substrate 15 contacts the tip surface 12 of the suction head 2, so this is always the case. Since the substrate 15 comes into contact with the front end surface 12 of the suction head 2, the vertical distance (camera focal length) L from the camera 16 to the substrate 15 can be made constant.

  Further, according to the substrate suction device of the present embodiment, the suction pad 3 is bent by the vacuum and the substrate 15 is sucked to the tip surface 12 of the suction head 2, so that the substrate 15 is held by both the suction pad 3 and the suction head 2. Thus, the suction displacement of the substrate 15 can be prevented by the suction pad 3 and the suction height position of the substrate 15 can be kept constant by the suction head 2. Therefore, according to the substrate suction device of the present embodiment, the slip and rotation deviation of the substrate 15 can be suppressed even if the substrate suction device is moved at a high speed.

  Further, according to the substrate suction apparatus of the present embodiment, the skirt portion 3A of the suction pad 3 protrudes ahead of the front end surface 12 of the suction head 2, so that when the substrate 15 is taken out from the tray 14, the suction pad 3 is removed. When the lowering of the substrate suction device 13 is stopped in a state where the substrate is in contact with the substrate 15 (the front end surface 12 of the suction head 2 is not in contact with the substrate 15), the substrate 15 is sucked and taken out without applying a load to the tray. be able to.

  Further, according to the substrate suction device of the present embodiment, since the suction pad 3 made of a rubber material is mounted on the outer periphery of the tip of the suction head 2, the structure itself is simple and does not increase the cost.

  Further, according to the substrate suction device of the present embodiment, when the picked-up substrate 15 is photographed by the imaging means from below to above, the background reflection prevention unit 7 larger than the substrate 15 is provided in the suction head 2. Therefore, the background reflection prevention unit 7 can prevent the background reflection on the back side of the substrate 15 and can know the accurate adsorption state of the adsorbed substrate 15.

  According to the substrate suction method of the present embodiment, the suction pad 3 is bent by the vacuum after the suction pad 3 contacts the substrate 15 prior to the suction head 2, and the substrate 15 comes into contact with the front end surface 12 of the suction head 2. Since the adsorption is performed, the adsorption holding state of the substrate 15 can always be kept constant, and the bonding accuracy of the substrate 15 to the flexible printed wiring board 17 can be improved.

  INDUSTRIAL APPLICABILITY The present invention can be used for a substrate suction device that sucks a substrate by vacuuming with a suction pad.

DESCRIPTION OF SYMBOLS 1 ... Air suction passage 2 ... Adsorption head 3 ... Adsorption pad 6 ... Pad mounting part 7 ... Background reflection prevention part 10 ... Adsorption surface (adsorption surface of an adsorption pad)
12 ... tip surface (tip surface of suction head)
14 ... Tray 15 ... Substrate 16 ... Camera (imaging means)
17 ... Flexible printed circuit board

Claims (4)

A substrate having a suction head having an air suction passage that is vacuumed and brought into a vacuum state, and an elastically displaceable suction pad mounted on the outer periphery of the tip of the suction head. An adsorption device,
The suction surface of the suction pad protrudes forward from the tip surface of the suction head so as to come into contact with the substrate prior to the tip surface of the suction head when sucking the substrate, and is sucked by vacuum. A substrate suction device, wherein a pad is bent and the substrate is sucked to a front end surface of the suction head. It is a board | substrate adsorption | suction apparatus of Claim 1, Comprising:
The suction pad is made of a rubber material and is attached to the outer periphery of the tip of the suction head. The substrate suction apparatus according to claim 1 or 2, wherein
A substrate suction apparatus, wherein the suction head is provided with a background reflection prevention unit larger than the substrate for preventing reflection behind the substrate when the sucked substrate is photographed by an imaging means. A substrate adsorption method for adsorbing a substrate by vacuuming with a substrate adsorption device equipped with an elastically displaceable adsorption pad attached to the outer periphery of the tip of the adsorption head,
After the suction pad comes into contact with the substrate prior to the suction head, the suction pad is bent by vacuum, and the substrate comes into contact with and sucked at the tip surface of the suction head. .

Images