JPS62108560A - Water-cooling fin for semiconductor device - Google Patents

Abstract

PURPOSE:To improve a cooling effect without increasing the number of parts and man-hours on assembly by interposing an insulator to the inner circumferential surface of a cooling-water flow path. CONSTITUTION:A pipe 7 made of a metal is fixed previously to a water-cooling fin 2 for a semiconductor device by using solder 8, and the inner circumferential surface of the pipe 7 made of the metal, in which cooling water passes, and the outer circumferential surface of the pipe 7 made of the metal projected from the water-cooled fin 2 for the semiconductor device are coated with an insulator 9. The insulator 9 consists of a resin such as tetrafluoride resin, and forms a coating layer through baking treatment or is applied by using an epoxy group resin, an insulating coating etc. Cooling water passing in the pipe 7 made of the metal and the water-cooling in 2 for the semiconductor device are insulated completely by the insulator 9, thus directly bringing the flat type semiconductor device 1 into contact with the surface of the water-cooling in 2 for the semiconductor device. Accordingly, the number of parts and man-hours an assembly can be reduced while excess parts are not interposed, thus obtaining an excellent cooling effect.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a water cooling fin for a semiconductor device in which an insulator is interposed on the inner peripheral surface of a cooling water flow path.

[Prior art] Semiconductor stacks used for resistance welding machines, etc.
As shown in the figure, a laminated pressure contact structure in which a flat semiconductor device 1 such as a thyristor is sandwiched, and water cooling fins 2.2 made of metal blocks are arranged on the anode and cathode sides respectively, and these constitute one unit. This is what I did.

The water cooling fins 2.2 are connected by an insulating hose 3 to form a cooling water circulation path.

The cooling water used for cooling the semiconductor stack as described above is generally tap water or public industrial tap water, but in order to ensure sufficient performance of the semiconductor stack, the electrical resistivity must be 5,000Ω.・Cooling water of cm or more is desirable. However, due to the need to conserve water resources and reduce operating costs, cooling water is often circulated and used, and it cannot be denied that the quality of the water gradually deteriorates even if it passes through a designated filtration device. In such a case, the electrical resistivity of the cooling water decreases, and therefore the insulation resistance between the water cooling fins 2.2 in contact with the cooling water decreases.

Conventionally, a method has been proposed in which an insulating sheet 4 is interposed between the flat semiconductor device 1 and the water cooling fins 2, as shown in FIG.

[Problems to be Solved by the Invention] As described above, conventionally, an insulating sheet 4 is interposed to insulate the flat semiconductor device 1 and the water cooling fins 2, but in this case, external leads drawn out from each electrode Terminals 5 and 6 are required, which increases the number of parts and the number of man-hours required for assembly, and there are problems such as a decrease in the cooling effect.

[Purpose of the Invention] This invention was made to solve the above-mentioned problems, and provides a semiconductor device that does not require external lead-out terminals, does not increase the number of parts or assembly man-hours, and has a high cooling effect. The purpose is to obtain water cooling fins for use.

[Means for Solving the Problems] A water cooling fin for a semiconductor device according to the present invention has an insulating material interposed on the inner peripheral surface of a cooling water flow path provided in a water cooling fin for a semiconductor device made of a metal block. It is something.

[Effect].

In the water cooling fin for a semiconductor device of the present invention, the insulator interposed on the inner peripheral surface of the cooling water flow path electrically insulates between the flat semiconductor device and the water cooling fin for a semiconductor device.

[Example] Hereinafter, an example of the present invention will be described based on FIG. 1 and FIG. 2.

FIG. 1 is a longitudinal sectional view showing a first embodiment of a water cooling fin for a semiconductor device according to the present invention.

In the figure, 2 is a water-cooling fin for a semiconductor device made of a copper block, and 7 is a metal made of a metal with good heat and good electrical conductivity such as copper for forming a cooling channel passing through the water-cooling fin 2 for a semiconductor device. This metal vibrator 7 is fixed in advance to the water cooling fin 2 for semiconductor device using solder 8.

Next, the inner circumferential surface of the metal vibrator 7 through which the cooling water passes and the outer circumferential surface of the metal vibrator 7 protruding from the semiconductor device water cooling fin 2 are covered with an insulator 9. This insulator 9
is, for example, tetrafluoride resin (trade name: Teflon),
A coating layer is formed by baking. Alternatively, instead of the above baking treatment, use epoxy resin, insulating paint, etc.
Apply by dip method.

According to the first embodiment, the cooling water passing through the metal pipe 7 and the water cooling fins 2 for semiconductor devices are completely insulated by the insulator 9.
The flat semiconductor device l shown in FIGS. 3 and 4 can be brought into direct contact with the surface of the substrate.

That is, even if the quality of the cooling water flowing through the circulation channel deteriorates and the electrical resistivity of the cooling water decreases, the insulator 9 interposed on the inner peripheral surface of the metal vibrator 7 will keep the flat semiconductor device 2 and the semiconductor Since the insulation between the device water cooling fins 2 and the water cooling fins 2 is maintained at a high level, no problem arises.

Next, a second embodiment of the present invention will be described based on FIG.

In this embodiment, screws 10 are cut on the inner surface of the through hole of the water cooling fin 20 for semiconductor devices and on the outer circumferential surface of the metal vibrator 7, and the inner circumferential surface of the metal vibrator 7 and both ends thereof Insulate it in the same way. Note that this insulation treatment may be performed before screwing the metal vibrator 7 into the water cooling fin 2 for semiconductor devices, or after screwing the metal vibrator 7 into the water cooling fin 2 for semiconductor devices. Furthermore, when screwing in the metal vibrator 7, applying an appropriate thermal compound or the like to the threaded portion in advance improves the heat conduction between the metal vibrator 7 and the water cooling fin 2 for semiconductor devices. desirable.

In addition to the effects of the first embodiment, the second embodiment increases the contact area between the semiconductor device water cooling fin 2 and the metal vibe 7 due to the formation of the threaded portion, improving the cooling effect, etc. There are also secondary effects.

[Effects of the Invention] As described above, the present invention has an insulating layer interposed on the inner peripheral surface of the cooling water flow path provided in the water cooling fin for semiconductor devices made of a metal block. Insulating sheets, external lead-out terminals, etc. are required as separate parts, reducing the number of parts and assembly man-hours, and eliminating unnecessary parts such as external lead-out terminals between the flat semiconductor device and the water cooling fin for semiconductor devices. Since there is no intervention, the cooling effect is low and does not cause any problems.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a water cooling fin for a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a water cooling fin for a semiconductor device showing a second embodiment of the invention, and FIG. 4 and 4 are explanatory diagrams showing a method of cooling a semiconductor stack using conventional water cooling fins for semiconductor devices. In the figure, 1...PAT type semiconductor device, 2...Water cooling tool for semiconductor device, 3...Insulator board, 7...
・Metal pipe, 9...insulator layer. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] 1. A water cooling fin for a semiconductor device having a cooling water flow path penetrating through a metal block, characterized in that an insulator is interposed on the inner peripheral surface of the cooling water flow path. water cooling fins. 2. The water cooling fin for a semiconductor device according to claim 1, wherein the cooling water flow path is formed of a metal pipe with an insulator interposed on the inner peripheral surface thereof.