JPS62108560A - Water-cooling fin for semiconductor device - Google Patents

Water-cooling fin for semiconductor device

Info

Publication number
JPS62108560A
JPS62108560A JP24720385A JP24720385A JPS62108560A JP S62108560 A JPS62108560 A JP S62108560A JP 24720385 A JP24720385 A JP 24720385A JP 24720385 A JP24720385 A JP 24720385A JP S62108560 A JPS62108560 A JP S62108560A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
water
cooling
semiconductor device
insulator
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24720385A
Inventor
Takao Senda
Takao Shishido
Tadao Takano
Original Assignee
Internatl Rectifier Corp Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve a cooling effect without increasing the number of parts and man-hours on assembly by interposing an insulator to the inner circumferential surface of a cooling-water flow path. CONSTITUTION:A pipe 7 made of a metal is fixed previously to a water-cooling fin 2 for a semiconductor device by using solder 8, and the inner circumferential surface of the pipe 7 made of the metal, in which cooling water passes, and the outer circumferential surface of the pipe 7 made of the metal projected from the water-cooled fin 2 for the semiconductor device are coated with an insulator 9. The insulator 9 consists of a resin such as tetrafluoride resin, and forms a coating layer through baking treatment or is applied by using an epoxy group resin, an insulating coating etc. Cooling water passing in the pipe 7 made of the metal and the water-cooling in 2 for the semiconductor device are insulated completely by the insulator 9, thus directly bringing the flat type semiconductor device 1 into contact with the surface of the water-cooling in 2 for the semiconductor device. Accordingly, the number of parts and man-hours an assembly can be reduced while excess parts are not interposed, thus obtaining an excellent cooling effect.
JP24720385A 1985-11-06 1985-11-06 Water-cooling fin for semiconductor device Pending JPS62108560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24720385A JPS62108560A (en) 1985-11-06 1985-11-06 Water-cooling fin for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24720385A JPS62108560A (en) 1985-11-06 1985-11-06 Water-cooling fin for semiconductor device

Publications (1)

Publication Number Publication Date
JPS62108560A true true JPS62108560A (en) 1987-05-19

Family

ID=17159981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24720385A Pending JPS62108560A (en) 1985-11-06 1985-11-06 Water-cooling fin for semiconductor device

Country Status (1)

Country Link
JP (1) JPS62108560A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304379B2 (en) 2003-08-27 2007-12-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with pipe for passing refrigerant liquid

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752154A (en) * 1980-09-16 1982-03-27 Hitachi Ltd Cooler for semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752154A (en) * 1980-09-16 1982-03-27 Hitachi Ltd Cooler for semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304379B2 (en) 2003-08-27 2007-12-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with pipe for passing refrigerant liquid
US7705448B2 (en) 2003-08-27 2010-04-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for pipe for passing refrigerant liquid

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