JPS62107951A - 表面研削装置 - Google Patents
表面研削装置Info
- Publication number
- JPS62107951A JPS62107951A JP24624985A JP24624985A JPS62107951A JP S62107951 A JPS62107951 A JP S62107951A JP 24624985 A JP24624985 A JP 24624985A JP 24624985 A JP24624985 A JP 24624985A JP S62107951 A JPS62107951 A JP S62107951A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grinding wheel
- workpiece
- chuck
- chucks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24624985A JPS62107951A (ja) | 1985-11-05 | 1985-11-05 | 表面研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24624985A JPS62107951A (ja) | 1985-11-05 | 1985-11-05 | 表面研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62107951A true JPS62107951A (ja) | 1987-05-19 |
JPH0512099B2 JPH0512099B2 (enrdf_load_stackoverflow) | 1993-02-17 |
Family
ID=17145717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24624985A Granted JPS62107951A (ja) | 1985-11-05 | 1985-11-05 | 表面研削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62107951A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0732252A (ja) * | 1993-07-22 | 1995-02-03 | Hitachi Ltd | ワーク自転型研削加工方法、ワーク自転型研削盤及びシリコンウェハ並びにセラミック基板 |
JP2002200545A (ja) * | 2000-12-27 | 2002-07-16 | Disco Abrasive Syst Ltd | 研削装置 |
JP2008042081A (ja) * | 2006-08-09 | 2008-02-21 | Disco Abrasive Syst Ltd | ウエーハ研削装置 |
JP2018083252A (ja) * | 2016-11-24 | 2018-05-31 | 株式会社ディスコ | 研削装置 |
-
1985
- 1985-11-05 JP JP24624985A patent/JPS62107951A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0732252A (ja) * | 1993-07-22 | 1995-02-03 | Hitachi Ltd | ワーク自転型研削加工方法、ワーク自転型研削盤及びシリコンウェハ並びにセラミック基板 |
JP2002200545A (ja) * | 2000-12-27 | 2002-07-16 | Disco Abrasive Syst Ltd | 研削装置 |
JP2008042081A (ja) * | 2006-08-09 | 2008-02-21 | Disco Abrasive Syst Ltd | ウエーハ研削装置 |
JP2018083252A (ja) * | 2016-11-24 | 2018-05-31 | 株式会社ディスコ | 研削装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0512099B2 (enrdf_load_stackoverflow) | 1993-02-17 |
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