JPS62107444U - - Google Patents
Info
- Publication number
- JPS62107444U JPS62107444U JP1985200115U JP20011585U JPS62107444U JP S62107444 U JPS62107444 U JP S62107444U JP 1985200115 U JP1985200115 U JP 1985200115U JP 20011585 U JP20011585 U JP 20011585U JP S62107444 U JPS62107444 U JP S62107444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- wiring board
- semiconductor
- adhesive
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
- H10W72/325—Die-attach connectors having a filler embedded in a matrix
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985200115U JPS62107444U (enExample) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985200115U JPS62107444U (enExample) | 1985-12-25 | 1985-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107444U true JPS62107444U (enExample) | 1987-07-09 |
Family
ID=31162326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985200115U Pending JPS62107444U (enExample) | 1985-12-25 | 1985-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107444U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (ja) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | 異方性導電接着剤を用いた集積回路の実装方法 |
| JPH0766286A (ja) * | 1991-07-01 | 1995-03-10 | At & T Corp | 集積回路と基板との電気的接続方法及び集積回路組立体 |
| WO2000074023A1 (fr) * | 1999-05-31 | 2000-12-07 | Citizen Watch Co., Ltd. | Structure de connexions electriques et ecran plat |
-
1985
- 1985-12-25 JP JP1985200115U patent/JPS62107444U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (ja) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | 異方性導電接着剤を用いた集積回路の実装方法 |
| JPH0766286A (ja) * | 1991-07-01 | 1995-03-10 | At & T Corp | 集積回路と基板との電気的接続方法及び集積回路組立体 |
| WO2000074023A1 (fr) * | 1999-05-31 | 2000-12-07 | Citizen Watch Co., Ltd. | Structure de connexions electriques et ecran plat |