JPS62107444U - - Google Patents
Info
- Publication number
- JPS62107444U JPS62107444U JP20011585U JP20011585U JPS62107444U JP S62107444 U JPS62107444 U JP S62107444U JP 20011585 U JP20011585 U JP 20011585U JP 20011585 U JP20011585 U JP 20011585U JP S62107444 U JPS62107444 U JP S62107444U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- wiring board
- semiconductor
- adhesive
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
Description
第１図〜第３図はこの考案の一実施例を示した
もので、第１図は異方導電性接着剤を塗布した配
線基板と半導体ペレツトの斜視図、第２図は異方
導電性接着剤を塗布した配線基板の縦断側面図、
第３図は配線基板に半導体ペレツトを接合した状
態の縦断側面図である。第４図および第５図はこ
の考案の他の実施例を示したもので、第４図は異
方導電性接着剤を塗布した配線基板と半導体ペレ
ツトの縦断側面図、第５図は配線基板に半導体ペ
レツトを接合した状態の縦断側面図である。第６
図〜第８図は従来の半導体ペレツトの取付け構造
を示したもので、第６図は異方導電性接着剤を塗
布した配線基板と半導体ペレツトの斜視図、第７
図は異方導電性接着剤を塗布した配線基板の縦断
側面図、第８図は配線基板に半導体ペレツトを接
合した状態の縦断側面図である。
１……半導体ペレツト、２……端子部、２ａ…
…バンプ、３……配線基板、４……配線、４ａ…
…半導体ペレツト接続端子部、５……異方導電性
接着剤、５ａ……絶縁性接着剤、５ｂ……導電性
粒子、６……加熱加圧治具、７……絶縁性接着剤
。
Figures 1 to 3 show an embodiment of this invention. Figure 1 is a perspective view of a wiring board and semiconductor pellet coated with an anisotropically conductive adhesive, and Figure 2 is a perspective view of an anisotropically conductive adhesive. Vertical side view of a wiring board coated with adhesive,
FIG. 3 is a vertical sectional side view of the semiconductor pellet bonded to the wiring board. Figures 4 and 5 show other embodiments of this invention, where Figure 4 is a longitudinal cross-sectional side view of a wiring board and semiconductor pellet coated with an anisotropic conductive adhesive, and Figure 5 is a side view of a wiring board coated with an anisotropic conductive adhesive. FIG. 6th
Figures 8 to 8 show the conventional mounting structure for semiconductor pellets. Figure 6 is a perspective view of a semiconductor pellet and a wiring board coated with an anisotropic conductive adhesive.
The figure is a vertical side view of a wiring board coated with an anisotropic conductive adhesive, and FIG. 8 is a vertical side view of a semiconductor pellet bonded to the wiring board. 1... Semiconductor pellet, 2... Terminal section, 2a...
...Bump, 3...Wiring board, 4...Wiring, 4a...
... Semiconductor pellet connecting terminal portion, 5 ... Anisotropic conductive adhesive, 5a ... Insulating adhesive, 5b ... Conductive particles, 6 ... Heating and pressing jig, 7 ... Insulating adhesive.
Claims (1)
、この半導体ペレツトの端子部に対応する端子部
が形成された配線基板面に接着剤を介して重ね、
この半導体ペレツトと配線基板とを押圧して両方
を端子部を導通させた状態で前記接着剤により半
導体ペレツトを配線基板に接着接合する半導体ペ
レツトの取付け構造において、前記接着剤を半導
体ペレツトの周縁部と対応する部分だけに設けて
半導体ペレツトと配線基板とを接着接合し、半導
体ペレツトと配線基板との押圧により押し拡げら
れた接着剤を、半導体ペレツトの外周側と、半導
体ペレツトの中央部側とに逃がしたことを特徴と
する半導体ペレツトの取付け構造。 A semiconductor pellet having a terminal portion at the periphery of the main surface is stacked on a wiring board surface on which a terminal portion corresponding to the terminal portion of the semiconductor pellet is formed via an adhesive,
In this semiconductor pellet mounting structure, the semiconductor pellet is adhesively bonded to the wiring board using the adhesive while the semiconductor pellet and the wiring board are pressed together so that the terminal portions of both are electrically connected. The semiconductor pellet and the wiring board are adhesively bonded by applying the adhesive to only the areas corresponding to the semiconductor pellet and the wiring board, and the adhesive spread by the pressure between the semiconductor pellet and the wiring board is applied to the outer circumference side of the semiconductor pellet and the center side of the semiconductor pellet. A mounting structure for semiconductor pellets, characterized in that the semiconductor pellets are allowed to escape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20011585U JPS62107444U (en) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20011585U JPS62107444U (en) | 1985-12-25 | 1985-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107444U true JPS62107444U (en) | 1987-07-09 |
Family
ID=31162326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20011585U Pending JPS62107444U (en) | 1985-12-25 | 1985-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107444U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (en) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | Mounting of integrated circuit using anisotropic conductive bonding agent |
| JPH0766286A (en) * | 1991-07-01 | 1995-03-10 | At & T Corp | Method for connecting electrically integrated circuit with substrate, and integrated circuit assembly |
| WO2000074023A1 (en) * | 1999-05-31 | 2000-12-07 | Citizen Watch Co., Ltd. | Electrical connection structure and flat display device |
-
1985
- 1985-12-25 JP JP20011585U patent/JPS62107444U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (en) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | Mounting of integrated circuit using anisotropic conductive bonding agent |
| JPH0766286A (en) * | 1991-07-01 | 1995-03-10 | At & T Corp | Method for connecting electrically integrated circuit with substrate, and integrated circuit assembly |
| WO2000074023A1 (en) * | 1999-05-31 | 2000-12-07 | Citizen Watch Co., Ltd. | Electrical connection structure and flat display device |
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