JPS5877049U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5877049U
JPS5877049U JP1981172945U JP17294581U JPS5877049U JP S5877049 U JPS5877049 U JP S5877049U JP 1981172945 U JP1981172945 U JP 1981172945U JP 17294581 U JP17294581 U JP 17294581U JP S5877049 U JPS5877049 U JP S5877049U
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor equipment
lead
heat sink
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981172945U
Other languages
Japanese (ja)
Inventor
中川　正美
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981172945U priority Critical patent/JPS5877049U/en
Publication of JPS5877049U publication Critical patent/JPS5877049U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は一般的な半導体装置の構造を示す断面図、第２
図は他の半導体素子の一部破断乎面図、第３図は本考案
に係かる半導体装置の一実施例を示す縦断側面図、第４
図及び第５図はリードの変形例を示す断面図、第６図及
び第７図は他の実施例を示す断面図である。 １０・・・放熱板、１１・・・半導体素子、１２・・・
半田、１３・・・キャップ、１４・・・リード。Figure 1 is a cross-sectional view showing the structure of a general semiconductor device, Figure 2 is a cross-sectional view showing the structure of a general semiconductor device.
The figure is a partially cutaway view of another semiconductor element, FIG. 3 is a longitudinal sectional side view showing an embodiment of the semiconductor device according to the present invention, and FIG.
5 and 5 are cross-sectional views showing modified examples of the lead, and FIGS. 6 and 7 are cross-sectional views showing other embodiments. 10... Heat sink, 11... Semiconductor element, 12...
Handa, 13...cap, 14...lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板上に配置された半導体素子を覆う中空の樹脂製キ
ャップの側面にリードを貫通させて埋設固定し、前記キ
ャップを半導体素子に被せて放熱板に接着すると共にリ
ードの先端を半導体素子の表面電極に接続させたことを
特徴とする半導体装置。A lead is embedded and fixed by passing through the side surface of a hollow resin cap that covers a semiconductor element placed on a heat sink, and the cap is placed over the semiconductor element and adhered to the heat sink, and the tip of the lead is attached to the surface of the semiconductor element. A semiconductor device characterized by being connected to an electrode.
JP1981172945U 1981-11-19 1981-11-19 semiconductor equipment Pending JPS5877049U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981172945U JPS5877049U (en) 1981-11-19 1981-11-19 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981172945U JPS5877049U (en) 1981-11-19 1981-11-19 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5877049U true JPS5877049U (en) 1983-05-24

Family

ID=29964820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981172945U Pending JPS5877049U (en) 1981-11-19 1981-11-19 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5877049U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492449U (en) * 1972-04-08 1974-01-10
JPS5337461B2 (en) * 1974-10-03 1978-10-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492449U (en) * 1972-04-08 1974-01-10
JPS5337461B2 (en) * 1974-10-03 1978-10-09

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