JPS5839048U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5839048U
JPS5839048U JP1981133764U JP13376481U JPS5839048U JP S5839048 U JPS5839048 U JP S5839048U JP 1981133764 U JP1981133764 U JP 1981133764U JP 13376481 U JP13376481 U JP 13376481U JP S5839048 U JPS5839048 U JP S5839048U
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
semiconductor equipment
conductive wire
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981133764U
Other languages
Japanese (ja)
Inventor
三輪　順子
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1981133764U priority Critical patent/JPS5839048U/en
Publication of JPS5839048U publication Critical patent/JPS5839048U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の樹脂封止型半導体装置の一例の断面図
、第２図は、この考案の一実施例を示す断面図である。 図において、１は半導体素子、４は内部導電線、６は緩
衝部材を示す。なお、図中同一符号はそれぞれ同一また
ば相当部分を示す。FIG. 1 is a sectional view of an example of a conventional resin-sealed semiconductor device, and FIG. 2 is a sectional view of an embodiment of this invention. In the figure, 1 indicates a semiconductor element, 4 indicates an internal conductive wire, and 6 indicates a buffer member. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子およびこの半導体素子と外部電極とを結ぶ内
部導電線を封止用樹脂によって封止固定して成形される
半導体装置において、上記半導体素子を包みかつ上記内
部導電線をその全長にわたって包むように形成された緩
衝部材を介在させて樹脂封止したことを特徴とする半導
体装置。In a semiconductor device formed by sealing and fixing a semiconductor element and an internal conductive wire connecting the semiconductor element and an external electrode with a sealing resin, the semiconductor element is formed so as to enclose the semiconductor element and the internal conductive wire over its entire length. 1. A semiconductor device characterized in that the semiconductor device is resin-sealed with a buffer member interposed therebetween.
JP1981133764U 1981-09-08 1981-09-08 semiconductor equipment Pending JPS5839048U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981133764U JPS5839048U (en) 1981-09-08 1981-09-08 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981133764U JPS5839048U (en) 1981-09-08 1981-09-08 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5839048U true JPS5839048U (en) 1983-03-14

Family

ID=29927211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981133764U Pending JPS5839048U (en) 1981-09-08 1981-09-08 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5839048U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019361A (en) * 1973-06-20 1975-02-28
JPS5056164A (en) * 1973-09-13 1975-05-16
JPS5117805U (en) * 1974-07-29 1976-02-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019361A (en) * 1973-06-20 1975-02-28
JPS5056164A (en) * 1973-09-13 1975-05-16
JPS5117805U (en) * 1974-07-29 1976-02-09

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