JPS5858345U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5858345U
JPS5858345U JP15274281U JP15274281U JPS5858345U JP S5858345 U JPS5858345 U JP S5858345U JP 15274281 U JP15274281 U JP 15274281U JP 15274281 U JP15274281 U JP 15274281U JP S5858345 U JPS5858345 U JP S5858345U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
frame
resin
insulating material
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15274281U
Other languages
Japanese (ja)
Inventor
沖原　裕昭
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP15274281U priority Critical patent/JPS5858345U/en
Publication of JPS5858345U publication Critical patent/JPS5858345U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子接続用リードフレームのコネクタ線を接続す
る部分周辺に、樹脂又はガラス等の絶縁物からなる枠を
取り付けその蜂を含めて封止してなるこキを特徴とする
半導体装置。A semiconductor device characterized by a frame made of an insulating material such as resin or glass attached around a part of a lead frame for connecting a semiconductor element to which a connector wire is connected and sealed including the frame.
JP15274281U 1981-10-14 1981-10-14 semiconductor equipment Pending JPS5858345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15274281U JPS5858345U (en) 1981-10-14 1981-10-14 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15274281U JPS5858345U (en) 1981-10-14 1981-10-14 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5858345U true JPS5858345U (en) 1983-04-20

Family

ID=29945384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15274281U Pending JPS5858345U (en) 1981-10-14 1981-10-14 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5858345U (en)

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