JPS5837146U - integrated circuit device - Google Patents
integrated circuit deviceInfo
- Publication number
- JPS5837146U JPS5837146U JP1981131504U JP13150481U JPS5837146U JP S5837146 U JPS5837146 U JP S5837146U JP 1981131504 U JP1981131504 U JP 1981131504U JP 13150481 U JP13150481 U JP 13150481U JP S5837146 U JPS5837146 U JP S5837146U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- integrated circuit
- circuit device
- resin
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の集積回路装置を示す断面図、第２図は本
考案に用いる集積回路装置の樹脂枠の平面図、第３図は
本考案の一実施例の断面図である。
１・・・・・・回路基板、２・・・・・・集積回路素子
、３・・・・・・ワイヤ、４・・・・・・樹脂枠、５・
・・・・・封止樹脂、６・・・・・・２重樹脂枠、７・
・・・・・内枠、８・・・・・・外枠、９・・・・・・
内枠と外枠の連結部。FIG. 1 is a sectional view showing a conventional integrated circuit device, FIG. 2 is a plan view of a resin frame of the integrated circuit device used in the present invention, and FIG. 3 is a sectional view of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Integrated circuit element, 3... Wire, 4... Resin frame, 5...
...Sealing resin, 6...Double resin frame, 7.
...Inner frame, 8...Outer frame, 9...
Connection part between inner frame and outer frame.
Claims (1)
囲んで樹脂枠を取付け、この枠内に封止樹脂を充填して
なる集積回路装置において、前記□ 樹脂枠は、内
枠とこの内枠に連結部により連結された外枠との２重枠
により予じめ構成され、前記内枠内に前記集積回路素子
を含んで封止樹脂の充填後前記外枠が前記連結部で切り
離されたもので□ あることを特徴とする集積回路
装置。In an integrated circuit device in which an integrated circuit element is mounted on a circuit board, a resin frame is attached around the integrated circuit element, and a sealing resin is filled in the frame, the resin frame has an inner frame and an inner frame. The frame is configured in advance by a double frame with an outer frame connected to the frame by a connecting portion, and after the inner frame contains the integrated circuit element and is filled with a sealing resin, the outer frame is separated at the connecting portion. An integrated circuit device characterized by □.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981131504U JPS5837146U (en) | 1981-09-04 | 1981-09-04 | integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981131504U JPS5837146U (en) | 1981-09-04 | 1981-09-04 | integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5837146U true JPS5837146U (en) | 1983-03-10 |
Family
ID=29925078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981131504U Pending JPS5837146U (en) | 1981-09-04 | 1981-09-04 | integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837146U (en) |
-
1981
- 1981-09-04 JP JP1981131504U patent/JPS5837146U/en active Pending
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