JPS62107443U - - Google Patents
Info
- Publication number
- JPS62107443U JPS62107443U JP1985200114U JP20011485U JPS62107443U JP S62107443 U JPS62107443 U JP S62107443U JP 1985200114 U JP1985200114 U JP 1985200114U JP 20011485 U JP20011485 U JP 20011485U JP S62107443 U JPS62107443 U JP S62107443U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor
- semiconductor pellet
- adhesive
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/072—
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- H10W72/073—
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- H10W72/241—
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- H10W90/724—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985200114U JPS62107443U (enExample) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985200114U JPS62107443U (enExample) | 1985-12-25 | 1985-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107443U true JPS62107443U (enExample) | 1987-07-09 |
Family
ID=31162324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985200114U Pending JPS62107443U (enExample) | 1985-12-25 | 1985-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107443U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (ja) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | 異方性導電接着剤を用いた集積回路の実装方法 |
| JP2007335832A (ja) * | 2006-06-15 | 2007-12-27 | Korea Electronics Telecommun | フリップチップパッケージ及びその製造方法 |
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1985
- 1985-12-25 JP JP1985200114U patent/JPS62107443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340445A (ja) * | 1989-07-07 | 1991-02-21 | Oki Electric Ind Co Ltd | 異方性導電接着剤を用いた集積回路の実装方法 |
| JP2007335832A (ja) * | 2006-06-15 | 2007-12-27 | Korea Electronics Telecommun | フリップチップパッケージ及びその製造方法 |