JPS62106636A - 炭化珪素質複合体からなる電子回路用基板 - Google Patents

炭化珪素質複合体からなる電子回路用基板

Info

Publication number
JPS62106636A
JPS62106636A JP24670185A JP24670185A JPS62106636A JP S62106636 A JPS62106636 A JP S62106636A JP 24670185 A JP24670185 A JP 24670185A JP 24670185 A JP24670185 A JP 24670185A JP S62106636 A JPS62106636 A JP S62106636A
Authority
JP
Japan
Prior art keywords
resin
electronic circuit
circuit board
silicon carbide
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24670185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0581076B2 (ko
Inventor
Yasuyuki Sato
靖之 佐藤
Shinji Saito
斉藤　信二
Hidetoshi Yamauchi
山内　英俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP24670185A priority Critical patent/JPS62106636A/ja
Publication of JPS62106636A publication Critical patent/JPS62106636A/ja
Publication of JPH0581076B2 publication Critical patent/JPH0581076B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP24670185A 1985-11-01 1985-11-01 炭化珪素質複合体からなる電子回路用基板 Granted JPS62106636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24670185A JPS62106636A (ja) 1985-11-01 1985-11-01 炭化珪素質複合体からなる電子回路用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24670185A JPS62106636A (ja) 1985-11-01 1985-11-01 炭化珪素質複合体からなる電子回路用基板

Publications (2)

Publication Number Publication Date
JPS62106636A true JPS62106636A (ja) 1987-05-18
JPH0581076B2 JPH0581076B2 (ko) 1993-11-11

Family

ID=17152345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24670185A Granted JPS62106636A (ja) 1985-11-01 1985-11-01 炭化珪素質複合体からなる電子回路用基板

Country Status (1)

Country Link
JP (1) JPS62106636A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165871A (ja) * 2010-02-09 2011-08-25 Denso Corp 電子装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165871A (ja) * 2010-02-09 2011-08-25 Denso Corp 電子装置およびその製造方法

Also Published As

Publication number Publication date
JPH0581076B2 (ko) 1993-11-11

Similar Documents

Publication Publication Date Title
US4882455A (en) Electronic circuit substrates
JP2787953B2 (ja) 電子回路基板
US6346317B1 (en) Electronic components incorporating ceramic-metal composites
CA2532822A1 (en) Composition gradient thermostructural composite structure and method for the production thereof
US20090011208A1 (en) Ceramics Made of Preceramic Paper or Board Structures, Method of Producing the Same and Use Thereof
KR19990028330A (ko) 코팅 방법, 세라믹 금속 구조물의 제조 방법, 결합 방법 및 이로부터 형성된 구조물
US5902756A (en) Ceramic matrix composites with integrated topcoat layers
KR101324952B1 (ko) 세라믹스 접합체의 제조 방법
US5925451A (en) Composite ceramic board and process for the productivity thereof
JPS6226886A (ja) セラミツクス質複合体からなる電子回路用基板
JPS62126694A (ja) 電子回路用多層基板
JPH046907Y2 (ko)
JPH05291706A (ja) プリント配線用基板の製造法
JP2002111219A (ja) 電気素子内蔵型配線基板およびその製造方法
JP2001158680A (ja) 炭化珪素・金属複合体及びその製造方法、並びにウェハ研磨装置用部材及びウェハ研磨装置用テーブル
US5531945A (en) Process for the production of base board for printed wiring
JPS62106636A (ja) 炭化珪素質複合体からなる電子回路用基板
JP2006062898A (ja) 金属−セラミックス複合構造体およびその製造方法
US6143421A (en) Electronic components incorporating ceramic-metal composites
JPS63252981A (ja) セラミツクス−高分子複合成形品及びその製造方法
JPS61287190A (ja) 電子回路用基板
JPH03108796A (ja) 多層電子回路基板
CN207995499U (zh) 一种多孔陶瓷电子线路
JP4192299B2 (ja) 複合積層体の製造方法
JP2753743B2 (ja) 電子回路基板の製造方法