JPS62101648A - Epoxy resin molding material for semiconductor sealing - Google Patents

Abstract

PURPOSE:To provide the titled material having excellent moisture resistance, by blending an epoxy resin with a hardener, a curing accelerator, an inorg. filler and a fluororesin surface improver. CONSTITUTION:An epoxy resin having at least one epoxy group per molecule (e.g., a phenolic novolak) is blended with a hardener such as maleic anhydride, a curing accelerater such as various imidazole compds., an inorg. filler such as CaCO3, a fluororesin surface improver such as a perfluoroacrylate/dodecyl methacrylate copolymer and optionally a parting agent, a colorant, a flame retarder, etc. The mixture is mixed in a mixing roll mill to obtain an epoxy resin molding material for use in semiconductor sealing.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin molding material for semiconductor encapsulation that can provide highly reliable electronic components even after being left in high temperature and high humidity conditions for a long time.

[Conventional technology and problems]

When electronic components are left in high temperature and high humidity conditions for long periods of time, they are no longer highly integrated or highly reliable.
There is a problem in that external moisture infiltrates into the baggage through the resin pulp and the gaps between the resin, the lead frame, and the element, corroding and breaking the M wiring on the element. Countermeasures include buffer coating the element surface, increasing the purity of raw materials, and reducing stress in the resin. However, studies regarding the suppression of moisture-permeable water and moisture-absorbed water in the resin bulk, and the adhesion between the resin and the lead frame are not necessarily sufficient.
In order to improve the moisture resistance reliability of resin-sealed semiconductor devices, countermeasures against this problem have become an important issue0. The purpose is to improve.

[Means for solving problems]

The present invention is an epoxy resin, a curing agent, and a curing accelerator.

This is an epoxy resin molding material for semiconductor encapsulation characterized by containing an inorganic filler and a fluorocarbon resin surface modifier as essential components. Epoxy resins used in the present invention include novola meta-type epoxy resins such as diglycidether of bisphenol A, phenol novolac, and cresol novolak.

Any epoxy resin can be used as long as it has at least one epoxy group in its molecule, such as an aliphatic cyclic epoxy resin. Further, as a curing agent (X) known epoxy resin curing agents can be used. Some examples include maleic anhydride, phthalic anhydride, and tetrahydrophthalic anhydride.

Hexahydrophthalic anhydride, trimellitic anhydride.

Acid anhydride hardeners such as pyromellitic anhydride.

diaminodiphenylmethane, diaminodiphenyl ether, diaminodiphenylsulfonic tonoaromatic amine,
So-called phenolic curing agents that have polyhydric phenolic hydroxyl groups, such as phenol novolak, cresol novolac, condensates of phenol resols, etc. and paraxylene dimethoxide, and condensates of phenol, cresol, etc., and diphenyl ether, formaldehyde, etc. be.

As a curing accelerator, all known useful materials for epoxy resins can be used.Those with particularly excellent latent properties include tetra-converted phosphonium tetra-converted borate, tetra-substituted ammonium tetra-substituted borate, various imidazole compounds, Various imidazole compounds and their derivatives are effective.Also, two or more of these curing accelerators may be used in combination.The epoxy resin mg product used in the present invention is suitable for semiconductors such as transistors, ICs, and LSIs. In order to transfer mold the device, it is desirable to blend an inorganic photonic agent. Examples of the inorganic photonic agent include calcium carbonate, seaweed flour, zirconium silicate, calcium silicate, quartz glass powder, glass fiber powder, etc. are useful, and 24 or more of these may be used in combination if necessary.Furthermore, in the present invention, addition of a fluorocarbon resin surface modifier is essential in order to improve the moisture resistance of the resin.

As such a fluorocarbon resin surface modifier, there is a copolymer of perfluoroacrylate dodecyl methacrylate. When this modifier is kneaded into a resin, the perfluoroalkyl groups are arranged on the surface layer with the lipophilic groups 1 on the resin side. As a result, the moisture resistance of the semiconductor device molded by Citra/Spha mold can be improved.

Also, that! For machining, a release agent, a colorant, a silane coupling agent, a flame retardant, a flame retardant aid, etc. may be added.

In preparing the molding material of the epoxy resin composition used in the present invention, the solid component materials are crushed and then thoroughly mixed in a desired ratio.

For mixing, conventional mixing and kneading machines such as a Mikinon roll machine, a co-kneader, and a ball mill can be used.

The resulting mixture can be applied directly to the transfer bottom mold.

[Example 1] 100 parts by weight of 0-kunzol novolac type epoxy resin (T200 per Evokin), 501 parts by weight of phenol novolac curing agent, 2.4 diamino-6-[2-methylimidazolyl-(1)]-]ethyl S-triazine 21 parts silica powder 450 parts heavy metal.

05 parts by weight of furano resin surface modifier, 10 parts by weight of brominated epoxy resin, 5 parts by weight of antimony trioxide.

r-glycidoxypropyltrimethquine silane.

After mixing 2 parts by weight each of carnauba wax and carbon black, the mixture was kneaded with two rolls (60 to 80°C) for 10 minutes and coarsely pulverized to obtain the desired resin assembly II for semiconductor encapsulation.

An LSI was formed into a transfer bottom shape using the above resin composition. Molding time was 175°C.

70ke/cII, 3 minutes teal.

Next, the obtained LSI sealed product (temperature: 121°C, 2 atm supersaturated steam cooker (PCT cooker) was put into a supersaturated steam cooker (PCT cooker), taken out at predetermined intervals, the electrical continuity of the LSI was checked, and the
/) Checked for corrosion and disconnection of AL wiring. the result,
Moisture resistance reliability is O/40 for 500 hours and 1 for 1000 hours.
It was 2/40 at 740,2000 hours.

[Comparative Example 1] An LSI was sealed under the same conditions as Example 1 using a resin assembly obtained by the same composition and method as Example 1 except that no fluorocarbon resin surface modifier was added. A PCT test was conducted.

As a result, the moisture resistance reliability was 2/40,500 after 200 hours.
It was 22/40 in time, 39/40 in 1001 hours〇 [Effect of the invention]

Claims (1)

[Claims] An epoxy resin molding material for semiconductor encapsulation, characterized by containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a fluororesin display modifier as essential components.