JPS619846U - 半導体素子の封止構造 - Google Patents

半導体素子の封止構造

Info

Publication number
JPS619846U
JPS619846U JP1984092398U JP9239884U JPS619846U JP S619846 U JPS619846 U JP S619846U JP 1984092398 U JP1984092398 U JP 1984092398U JP 9239884 U JP9239884 U JP 9239884U JP S619846 U JPS619846 U JP S619846U
Authority
JP
Japan
Prior art keywords
sealing structure
semiconductor elements
circuit board
metal frame
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984092398U
Other languages
English (en)
Inventor
常雄 小林
Original Assignee
カシオ計算機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by カシオ計算機株式会社 filed Critical カシオ計算機株式会社
Priority to JP1984092398U priority Critical patent/JPS619846U/ja
Publication of JPS619846U publication Critical patent/JPS619846U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す分解斜視図、第２図は
、同縦断側面図、第３図は別の実施例の分解縦断側面図
、第４図は同組立縦断側面図である。 １・・・回路基板、２・・・パターン、３・・・リード
半田、４・・・半導体素子、５・・・金属枠、６・・・
接着剤、７・・・導電性接着剤、８・・・孔、９・・・
封止樹脂、１０・・・感光性レジストフィルム、１１・
・・注入孔、５ａ・・・天井板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板と、この回路基板上に載置された半導体素子と
    、この半導体素子を囲うように前記回路基板上に取り付
    けられた金属枠と、この金属枠の内部へ充填され前記半
    導体素子を封止する封止樹脂とからなることを特徴とす
    る半導体素子の封止構造。
JP1984092398U 1984-06-20 1984-06-20 半導体素子の封止構造 Pending JPS619846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984092398U JPS619846U (ja) 1984-06-20 1984-06-20 半導体素子の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984092398U JPS619846U (ja) 1984-06-20 1984-06-20 半導体素子の封止構造

Publications (1)

Publication Number Publication Date
JPS619846U true JPS619846U (ja) 1986-01-21

Family

ID=30649157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984092398U Pending JPS619846U (ja) 1984-06-20 1984-06-20 半導体素子の封止構造

Country Status (1)

Country Link
JP (1) JPS619846U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08340063A (ja) * 1995-06-14 1996-12-24 Nec Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08340063A (ja) * 1995-06-14 1996-12-24 Nec Corp 半導体装置及びその製造方法

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