JPS6196798A - Conveyor for inspecting thin type intergrated circuit - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an IC handler, and particularly to a layout of a conveying device suitable for a thin type 10 handle.

[Background of the invention]

In the IC manufacturing process, a tC hunt is used to automatically test a large number of ICs with high efficiency.

This IC handler is a device that automatically sequentially transports untested ICs to test sockets, sorts the ICs according to the test results, and automatically carries them out.

Conventionally, thick so-called D
Since IP type ICs were the mainstream, IC handlers were also configured for DIP type ICs.

However, in recent years, thin so-called FPP type ICs as shown in FIGS. 3(A) and 3(B) have been developed.

This FPP type tC is defined as an ICj whose bottom and top surfaces are parallel plate-shaped and whose terminals (leads) protrude parallel to the flat plate. This type of IC is rapidly becoming popular because it is suitable for mounting many ICs in a small space, and there is a tendency for this type to become the mainstream IC.

The above thin IC (F P P type) is a thick IC.
Since the thinner leads are densely packed and protrude laterally, handling them is technically more difficult than handling thick type ■C.

Handlers for thick ICs use a chute with an inclination of approximately 35° to transport the ICs.Using this, the loader is placed above, the unloader is placed below, and an inspection device is placed between them. Efforts have been made to reduce the area required for IC/λC/run installation by using a three-dimensional arrangement such as providing sockets and holes.

However, since the leads of thin ICs protrude to the side, the I
There is a possibility that the leads of C may get caught and deformed or entangled with each other, or the leads may collide with a conveyance member and be damaged.

Due to these circumstances, the handler for thin IC
It is difficult to install a means of self-glide downhill. As a result, the IC to be inspected is mounted on a pallet 1 as shown in FIG. are sequentially supplied to the measurement socket, and the thin ICs that have been measured are placed on pallet 1.
Means for loading and unloading the equipment is provided.

The pallet 1 illustrated in FIG. 4 has 40 thin ICs 2 arranged in rows and columns and is transported in the direction of arrow a. For convenience of explanation, the arrangement of thin ICs arranged vertically and horizontally, parallel to arrow a, is called a column, and the arrangement perpendicular to arrow a is called a row. In the example of FIG. 4, 40 thin ICs 2 are mounted in 5 columns x 8 rows.

FIG. 5 shows an example of a thin IC inspection conveyance machine created by the present inventors and for which the present applicant has filed a separate application (hereinafter referred to as the device of the prior application).

In the device of the previous application, a pallet 1 loaded with thin ICs is carried into a loader 3 as shown by arrow a, and a suction conveyor 4 suction-holds the thin ICs (not shown) and transfers them to a preheating conveyor 5. Transfer.

The above-mentioned preheating transfer machine 5 has four lanes 5a, 5b, 5c, and 5d, and while conveying the thin IC in the direction of the arrow along each lane, the thin IC is heated to the temperature of the inspection condition. Preheat. However, if the temperature of the inspection condition is lower than room temperature, the sample will be cooled while being transported. In the present invention, preheating includes preheating (ie, precooling) of the inlet.

The thin ICs that have reached the end points of each of the preheating lanes 5a to 5d are transferred to the conveyor 7 by the suction conveyance means 6, and are sent in the direction of arrow C to pass in front of the measurement socket 8. This thin I
When C approaches the position directly facing the measurement socket 8, it is pushed in the direction of arrow P by a button (not shown) and attached to the measurement socket 8, and its electrical performance is measured and inspected to determine whether it is good or bad. . According to the inspection results, rejected products are discharged to the defective product unloader 9, and acceptable products are sent to the unloader 11 by the pitch feeding means 10 as shown by arrow d.

On the other hand, the pallet 1, which has become empty after the thin ICs have been delivered in the loader 3, is moved by the pallet feeding means 12 by the arrow a'
direction and is waiting at the 1' position.

The thin IC transported by the pitch feeding means 10 is mounted on an empty pallet 1' by the suction transporting means 13, and the loaded pallet is carried out by the unloader 11 as shown by arrow e.

The device of the prior application described above (FIG. 5) has the excellent effect of automatically conveying the thin ICs and sequentially supplying them to the measurement socket for measurement and inspection. Since the structure is such that measurement is performed using the measurement socket 8, the I
The efficiency of the entire C handler may be limited by the processing efficiency of the measurement socket 8.

If there are 4 preheating lanes as shown in Figure 5, 1
Time required for preheating of thin ICs Tp, time required for measurement T
s, when 4Ts<Tp, the efficiency of the entire IC handler is constrained by the time required for preheating, and when 47s>Tp, the efficiency of the entire IC handler is constrained by the time required for measurement.

Generally speaking, when the number of preheating lanes is N (however, N is an integer greater than or equal to 2), N X T s >'["
When p, the efficiency of the entire IC handler is limited by the time required for measurement.

However, while the measurement time Ts does not vary greatly depending on the specifications of the thin IC to be measured, the preheating time 'rp varies significantly depending on the test conditions of the thin IC. Therefore, in order to ensure that the thin IC handler as a whole can always operate at maximum efficiency, N
It is necessary to satisfy the expression p so that the efficiency of the entire apparatus is not restricted by the time required for measurement.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and is a thin IC.
Inspection of thin ICs that can automatically perform high-efficiency measurement and inspection without significantly complicating the structure of the handler, without increasing the required installation area, and without being restricted by the time required for measuring thin ICs. The purpose of this project is to provide a transportation device for

[Summary of the invention]

In order to achieve the above object, the conveying device of the present invention has a thin I
a loader that supplies a pallet with C arrayed in N rows;
N rows of transport lanes for transporting thin ICs and preheating them to the temperature of inspection conditions, and N thin ICs mounted on the pallet.
means for holding the ICs and mounting them on the respective transport lanes, N thin IC1 measurement sockets provided at the end points of the N rows of preheating transport lanes, and N ICs that have been measured in the N measurement sockets. The present invention includes means for holding thin ICs and loading them in N rows on a pallet, and an unloader for carrying out the loaded pallets.

[Embodiments of the invention]

FIG. 1 shows one embodiment of the conveying device of the present invention.

This embodiment is an example in which N=5, and thin ICs 2 are mounted in five rows on a pallet 1.

3 is a loader that supplies the pallet 1 loaded with thin ICs;
Reference numeral 4' denotes a suction conveyance machine that suctions and holds five thin ICs on the pallet 1 and loads them onto the preheating conveyance machine 5.

The preheating conveyor 5 of this embodiment has 5a to 5 in correspondence with N=5.
Five lines of transport lanes are provided.

One measurement socket 14 a , 14 b , 14 c (
Of the five, only three are shown in the figure, and two are omitted). Each measurement socket is provided with means 16 for automatically attaching and detaching a thin IC.

13' is a means for suctioning and transporting thin ICs that have been measured five at a time; products that pass inspection are transported and mounted on empty pallet 1', and products that fail inspection are transferred to a defective product unloader. 9
to be discharged.

12, the pallet emptied by loader 3 is transferred to unloader 1.
1, and is provided with a buffer 15 on the way. This buffer 15 is a means for adjusting the excess or shortage of pallet supply, and temporarily stores empty pallets when there is an excess of empty pallets, and releases them when there is a shortage.

As mentioned above, the transfer device of this embodiment is equipped with 5 preheated transfer lanes and 5 measurement sockets corresponding to (N) 5, the row of thin ICs mounted on the pallet 1. The transporting means 4' transfers five thin ICs belonging to the same row among the five rows of thin ICs on the pallet 1 to the five preheating transport lanes 5a to 5e, respectively, and the five ICs that have reached the end point of preheating transport. The thin ICs are each distributed to five measurement sockets and measured in parallel, and based on the measurement results, they are sent onto an empty pallet 1' or to a defective product unloader 9.

In this way, since the number of rows loaded on the pallet, the number of preheating transportation lanes, and the number of measurement sockets installed are the same, the flow of thin ICs in the transportation device of this example is parallel. There are 5 rows, and the flow is smooth and steady, and there is no imbalance in processing capacity.

Furthermore, this embodiment can accommodate changes in the number of columns in the array as described below.

For example, if thin ICs that are larger than the thin IC 2 can be mounted in only three rows on a pallet of the same size as the pallet 1, two of the five preheating transfer lanes It is possible to use the apparatus as a three-lane conveying device by putting one row inactive and activating three rows, and activating the three measurement sockets corresponding to the three preheating conveyance lanes. In this way, it is possible to quickly and easily perform setup changes in response to changes in the dimensions of the thin IC, providing a greater degree of freedom in operation.

〔Effect of the invention〕

As described in detail above, the device of the present invention does not have a significantly more complicated configuration than the device of the prior application (FIG. 5), does not increase the required installation area, and has a thin design. IC
It has an excellent practical effect of being able to automatically measure with high efficiency.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view showing one embodiment of the present invention. FIG. 2 is a plan view showing the device. 1.1'...Pallet, 2...Thin IC, 3...
Unloader, 4.4'... Adsorption conveyance machine, 5... Preheating conveyance machine, 5a to 5e... Conveyance lane, 6... Adsorption conveyance means, 7th section... Conveyor, 8... Measurement socket, 9...defective product unrotor, 10...pitch feeding means, 11...
Unloader, 12...Pallet feeding means, 13.13
'...Adsorption conveyance means, 14a, 1'4b, 14cm measurement socket, 15...Noh/nofa, 16...Thin IC automatic attachment/detachment means.

Claims (1)

[Claims] A loader that supplies a pallet with thin ICs arranged and mounted in N rows, N rows of transport lanes that transport the thin ICs and preheat them to a temperature of inspection conditions, and N thin ICs mounted on the pallet. means for holding and mounting the ICs on the respective transfer lanes, N thin IC measurement sockets provided at the end points of the N rows of preheating transfer lanes, and N thin IC measurement sockets that have been measured in the N measurement sockets. A thin IC comprising a means for holding thin ICs and mounting them in N rows on a pallet, and an unloader for carrying out the loaded pallet, where N is an integer of 2 or more. Transport device for inspection.