JPS6196555U - - Google Patents
Info
- Publication number
- JPS6196555U JPS6196555U JP1984181716U JP18171684U JPS6196555U JP S6196555 U JPS6196555 U JP S6196555U JP 1984181716 U JP1984181716 U JP 1984181716U JP 18171684 U JP18171684 U JP 18171684U JP S6196555 U JPS6196555 U JP S6196555U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead wire
- utility
- model registration
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181716U JPH0115182Y2 (nl) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984181716U JPH0115182Y2 (nl) | 1984-11-30 | 1984-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196555U true JPS6196555U (nl) | 1986-06-21 |
| JPH0115182Y2 JPH0115182Y2 (nl) | 1989-05-08 |
Family
ID=30739257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984181716U Expired JPH0115182Y2 (nl) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0115182Y2 (nl) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946664U (nl) * | 1972-07-28 | 1974-04-24 | ||
| JPS5043850U (nl) * | 1973-08-21 | 1975-05-02 | ||
| JPS5651847A (en) * | 1979-10-05 | 1981-05-09 | Hitachi Ltd | Preparation of semiconductor device |
-
1984
- 1984-11-30 JP JP1984181716U patent/JPH0115182Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946664U (nl) * | 1972-07-28 | 1974-04-24 | ||
| JPS5043850U (nl) * | 1973-08-21 | 1975-05-02 | ||
| JPS5651847A (en) * | 1979-10-05 | 1981-05-09 | Hitachi Ltd | Preparation of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0115182Y2 (nl) | 1989-05-08 |
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