JPS6196555U - - Google Patents

Info

Publication number
JPS6196555U
JPS6196555U JP1984181716U JP18171684U JPS6196555U JP S6196555 U JPS6196555 U JP S6196555U JP 1984181716 U JP1984181716 U JP 1984181716U JP 18171684 U JP18171684 U JP 18171684U JP S6196555 U JPS6196555 U JP S6196555U
Authority
JP
Japan
Prior art keywords
resin
lead wire
utility
model registration
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984181716U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0115182Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984181716U priority Critical patent/JPH0115182Y2/ja
Publication of JPS6196555U publication Critical patent/JPS6196555U/ja
Application granted granted Critical
Publication of JPH0115182Y2 publication Critical patent/JPH0115182Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1984181716U 1984-11-30 1984-11-30 Expired JPH0115182Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (https=) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (https=) 1984-11-30 1984-11-30

Publications (2)

Publication Number Publication Date
JPS6196555U true JPS6196555U (https=) 1986-06-21
JPH0115182Y2 JPH0115182Y2 (https=) 1989-05-08

Family

ID=30739257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984181716U Expired JPH0115182Y2 (https=) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPH0115182Y2 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946664U (https=) * 1972-07-28 1974-04-24
JPS5043850U (https=) * 1973-08-21 1975-05-02
JPS5651847A (en) * 1979-10-05 1981-05-09 Hitachi Ltd Preparation of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946664U (https=) * 1972-07-28 1974-04-24
JPS5043850U (https=) * 1973-08-21 1975-05-02
JPS5651847A (en) * 1979-10-05 1981-05-09 Hitachi Ltd Preparation of semiconductor device

Also Published As

Publication number Publication date
JPH0115182Y2 (https=) 1989-05-08

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