JPS6194344U - - Google Patents
Info
- Publication number
- JPS6194344U JPS6194344U JP17854984U JP17854984U JPS6194344U JP S6194344 U JPS6194344 U JP S6194344U JP 17854984 U JP17854984 U JP 17854984U JP 17854984 U JP17854984 U JP 17854984U JP S6194344 U JPS6194344 U JP S6194344U
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- semiconductor wafers
- semiconductor
- processing liquid
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 4
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17854984U JPS6194344U (de) | 1984-11-24 | 1984-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17854984U JPS6194344U (de) | 1984-11-24 | 1984-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6194344U true JPS6194344U (de) | 1986-06-18 |
Family
ID=30736113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17854984U Pending JPS6194344U (de) | 1984-11-24 | 1984-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6194344U (de) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550626A (en) * | 1978-10-06 | 1980-04-12 | Mitsubishi Electric Corp | Surface treatment of thin plate |
| JPS5540527B2 (de) * | 1979-11-14 | 1980-10-18 | ||
| JPS5850741A (ja) * | 1981-09-21 | 1983-03-25 | Nec Corp | シリコンウエ−ハのハンドリング方法 |
-
1984
- 1984-11-24 JP JP17854984U patent/JPS6194344U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550626A (en) * | 1978-10-06 | 1980-04-12 | Mitsubishi Electric Corp | Surface treatment of thin plate |
| JPS5540527B2 (de) * | 1979-11-14 | 1980-10-18 | ||
| JPS5850741A (ja) * | 1981-09-21 | 1983-03-25 | Nec Corp | シリコンウエ−ハのハンドリング方法 |
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