JPS6189012A - Method of cutting substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application] The present invention provides a method for cutting a substrate used for manufacturing semiconductor devices, etc.
This relates to a so-called dicing method.

[Conventional technology]

The substrates used for manufacturing semiconductor devices and the like are themselves quite expensive, and the substrates incorporating the devices are extremely expensive. Therefore, the greater the number of elements that can be obtained from one substrate, the lower the element unit cost can be.

In order to fabricate a larger number of elements within the same area, substrate dicing technology becomes an important element as well as higher integration of elements. Further, when it is necessary to provide elements close to the cut surface, the dicing technique for the substrate becomes complicated. Particularly when manufacturing devices using a glass material such as quartz as a substrate, a single chip on the surface of the device occurs during dicing.
, the so-called chipping shown at 301 in FIG. 2 is much larger and occurs in a larger amount than in single-crystal silicon substrates.

In recent years, highly integrated elements have been manufactured on quartz substrates and the like, and the size of the elements has become as large as K, which is equivalent to the size of chipping during dicing. As described above, chipping greatly impedes the arrangement of elements in the vicinity of the cutting surface, and furthermore, significantly impedes the reduction in the cost of elements.

Conventionally, as a method to reduce the size and number of chippings that occur when cutting a substrate, so-called dicing, a blade made of diamond particles (so-called diamond blade, hereinafter abbreviated as blade) has been generally used. ] Possible methods include making the diamond grain size finer, slowing down the blade movement speed, and narrowing the blade width. However, there is a limit to how fine the grain size can be made, and the strength The service life of the blade will be significantly shortened due to decrease in speed and clogging, which will lead to higher cost of the device.In addition, the method of slowing down the blade movement speed will reduce the amount of chipping, although it depends on the rotation speed of the blade. There is a limit to the decrease in
This cannot be a fundamental solution to the scope of the problem we are discussing here. Furthermore, reducing the moving speed poses a major problem in terms of mass productivity. The narrower the grade width, the better the results, but the width is 1/1 of the board thickness. The degree is the strength limit.

[Problem that the invention seeks to solve]

As mentioned above, there is a limit to the reduction in the size of chipping with the conventional technology, and the method of reducing the grain size of the blade, which is considered to be the most effective, results in a significant decrease in the strength of the blade, resulting in repeated failures during cutting of the substrate. The blade will need to be replaced.

The present invention is intended to solve these problems, and by making improvements to the substrate without modifying the diamond blade for dicing, the size of chipping can be significantly reduced, and it is possible to cut the substrate with high productivity. The present invention provides a method.

[Means for solving problems]

In the substrate cutting method of the present invention, before cutting the substrate, the cut portion overlaps the boundary line of the cut portion and the portion existing after cutting, or
Alternatively, the grooves may be provided in contact with each other or separated by a certain length.

The substrate used in the present invention may be any substrate used for manufacturing semiconductor devices, etc., and glass substrates such as quartz are particularly effective. Also, the size of the chipping is approximately the width of the cutting blade, and the width of the cutting blade is approximately the thickness of the substrate. The depth of the groove is desirably less than 115 degrees of the thickness of the substrate and more than 15 degrees. Furthermore, the width of the groove must be less than the chipping size (ie, less than 1/of the substrate thickness) to prevent chipping if it is less than '/soo. The grooves may be formed by any method, but if the substrate is used for manufacturing semiconductor devices, it is preferable to use etching during the process or to form the grooves using a cutting blade before cutting.

〔Example〕

Basically, the substrate cutting method of the present invention is as shown in FIG.
b). 101 is i(
The dicing blade cuts the diagonally shaded section at the cross section shown at 201 (so-called scribe line).
In this example, the material used was aluminum that had been properly etched. 102 is a groove which is a feature of the present invention;
Separated by t from the scribe line of 01, width W and depth h
As shown in FIGS. 1(α) and (A).

10S, 205 is an area where elements can actually be placed. The substrate 204 is made of quartz glass. 102(
Various methods can be considered for creating the grooves in 202), but
- For example, grooves may be etched into the substrate using photoetching techniques. Another example is the method of creating grooves mechanically, and since 5 is much smaller than the substrate thickness, it is also possible to use a dicing blade that is much narrower than the one used for cutting, depending on the W constraints. . This is because the magnitude of chipping that occurs in this case is much smaller than that which occurs during cutting due to the narrow width of the blade.

The thickness of the board is 101 (201).
When the width of is set to 11 and the groove is created using the latter method,
, t, A and chipping (
Table 1 shows the effects of cutting.

The symbols used for influence are ○, ×, and Δ, which in order are: no influence,
Yes, but uncertain. Naturally, the smaller the impact on the 105 area, the better (i.e. chipping
(The mark ○ in the table is good because it does not enter the region of 5), and "uncertain" means that chipping may occur in the element arrangement region (1os). When cutting without providing grooves under the conditions of this example, the chipping is as large as 100 μm. In this example, a dicing blade was used to create the grooves, so chips occurred around the grooves.
Even considering the size of the ping, about 10 to 20μ grooves (depending on the blade width and grain size), according to w+t in Table 1, the element placement area (103) is 5.5 mm from the scribe line (101).
0 μ? All you have to do is Km. In Table 1, it is difficult to obtain blade strength when W is small, so to reduce W, t is set to a negative number, and a blade with a blade width wider than w+t is used to create a groove that overlaps the scribe line (101). is also possible (of course t becomes 0). In this case, grooves are also provided at the ends of the scribe line, but Table 1 shows the distance from the ends, and t is not shown as a negative number, but - or w+t is shown as the mouth. The smaller w+t is, the wider the element arrangement area is, but if it is too small, chipping may not be prevented completely, or the grooves may act as guides for the blade during cutting, resulting in poor cutting accuracy.

Furthermore, by providing grooves by etching, accuracy is achieved and chipping at the groove ends is eliminated, and by considering only w+t in the above example, the element placement area is 30 μm from the scribe line end.
This results in the result that it is only necessary to separate the

In any case, the area where elements cannot be placed is less than 1/2 of the area without grooves.

〔Effect of the invention〕

In the present invention, by providing a groove that is in contact with or a certain length apart from the scribe line that is the target of cutting the substrate, it is possible to cut the substrate. Since the groove prevents chipping during Ji and easily expands the area in which the element can be placed, it is possible to reduce the element otherness. Furthermore, it becomes possible to arrange elements near the cut ends, and it becomes possible to connect elements in sensors and the like that require a large area.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an example of the present invention, in which (a) is a plan view;
(b) is a sectional view. FIG. 2 is a diagram showing a cut surface, and 501 shows chipping. that's all

Claims (4)

[Claims] (1) Cut the board to be cut so that it overlaps the boundary line between the part to be cut and the part that will exist after cutting, or be in contact with the boundary line on the side of the part that will exist after cutting, or be cut by a certain length. A substrate cutting method characterized by providing a groove at the front. (2) The substrate cutting method according to claim 1, wherein the depth of the groove is ⅕ or less of the thickness of the substrate. (3) The substrate cutting method according to claim 1, wherein the groove is created by etching or using a cutting blade. (4) Using quartz as the substrate that requires cutting, the depth is 1/50 to 1/5 of the substrate thickness, and the width is 1/500 to 1/1.
2. The substrate cutting method according to claim 1, wherein a groove of 0 is provided.