JPS63263742A - Dicing scribe line - Google Patents

Abstract

PURPOSE:To enable the chipping as well as the photodetecting pitch difference at the connection part to be minimized by a method wherein the relative positions of a line of dicing blade passing target and protective films are restricted to decide the structure as dicing scribe line. CONSTITUTION:A line 101 as a passing target of dicing blade is made of an element forming material such as aluminium on a substrate 102 whereon a semiconductor element 103 etc., is provided and then exceeding respectively one layer of non-organic material and organic material as protective films are provided. At least one layer of protective films 104, 106 made of non-organic material is provided on the position exceeding 1 mum and not exceeding 20 mum from line on the side layer wherein no dicing blade passes through while at least one layer of protective film 105 made of organic material is not provided on the position exceeding 1mum and not exceeding 20 mum on the oppositive side of line as a passing target from the boundary line of non-organic material nearest to the substrate. Thus, the chipping size can be notably lowered to provide an element close to the dicing line. Through these procedures, the shift of photodetector pitch can be minimized at the connection part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a scribe line that is used as a dicing target for a substrate on which semiconductor elements and the like are fabricated.

[Conventional technology]

In the semiconductor manufacturing process, stable dicing has become increasingly important as devices become more highly integrated. Furthermore, substrate dicing technology becomes important when it is necessary to provide elements close to the cut surface. Particularly when manufacturing devices using a glass material such as quartz as a substrate, there is a so-called "second chip" on the surface of the device that occurs during dicing.
Chipping as shown at 201 in the figure is much larger and occurs in a larger amount than on a single crystal silicon substrate. In recent years, highly integrated devices have been manufactured on quartz substrates and the like, and chipping has become a major hindrance to device placement near the cut surface.

Conventionally, as a method to reduce the size and number of chips that occur when cutting a substrate, so-called dicing, a blade made of diamond particles (so-called diamond blade, hereinafter abbreviated as blade) is generally used. Possible methods include making the diamond grain size finer, slowing down the moving speed of the blade, and narrowing the blade width. However, there is a limit to how fine the particles can be, and the reduction in strength and clogging that occurs when the blades are made finer will significantly shorten the service life of the blades, leading to higher prices for the devices. Additionally, depending on the rotational speed of the blade, there is a limit to how much the size of chipping can be reduced by slowing down the blade's movement speed, so it cannot be an essential solution for the scope of this problem. . Roughly reducing the movement speed poses a serious problem in terms of ta-ability. The narrower the grade width, the better the results, but the strength limit for the width is about /10 of the substrate thickness.

[Problem that the invention seeks to solve]

As mentioned above, there is a limit to the reduction in the size of chipping with the conventional technology, and the method of reducing the grain size of the blade, which is considered to be the most effective, results in a significant decrease in the strength of the blade, resulting in repeated failures during cutting of the substrate. Replacing the blade becomes expensive.

Therefore, the present invention solves these problems, and by cutting the substrate without modifying the diamond blade for dicing, the size of chipping can be significantly reduced, and chipping can be made in the vicinity of the dicing line. An element is provided. Furthermore, when a photoelectric conversion element or the like is connected as a multi-chip device when mounted on a board, it provides a means for minimizing the difference in the pitch of the light-receiving element at the connection part.

[Means for solving problems]

The scribe line of the present invention is provided with semiconductor elements, etc.
In addition, in a substrate provided with one or more layers each of an inorganic material and an organic material as a protective film, the line through which the dicing blade passes is made of an element forming material such as aluminum, and the side where the dicing blade does not pass is 1 μm or more from the line with an air flow of 20 μm or more. At least one layer of protective film made of an inorganic material is not provided at the following locations, and at least 1 μm or more and less than 20 μm from the boundary line of the inorganic material that is closest to the substrate to the opposite side of the target line. It is characterized in that at least one layer of sublayer made of material is not provided.

〔Example〕

A cross-sectional view of an embodiment of the dicing scribe line of the present invention is shown in FIG. 1. The substrate may be made of any material as long as it is used for semiconductor film formation, but here #! A line 101 is marked on a quartz substrate (typically a quartz substrate (202) as a cutting object) as a target for the dicing blade to pass through.
Made of aluminum. Of course, polysilicon or the like may be used as a material for the element (105) other than aluminum as long as it is a landmark, but aluminum is used here. The blade passes through the aluminum side perpendicular to the plane of the paper with the reference fin as a boundary, so the element (1
03) The side remains. Inorganic film 1 (103) and inorganic film [2 (10
6) may be provided on the element, etc., using silicon oxide, silicon nitride, etc. The pressure between the inorganic film 1 and the target aluminum yBh passing through the blade is 1 μm, 20 μm from the door, and the inorganic film 2
The distance B between the aluminum and the aluminum can be any value as long as A is 1 μm to 20 μm, but if A is not satisfied, B
must be between 1μm and 20μm. Polyimide 105 is used as a representative organic material, but the distance C from the reference to the edge of the polyimide is 1μWL<0-A≦20
There is peace of mind that it satisfies μm. In any case, each of these sections may be formed by photoetching after film formation, and in this example, a protective film made of organic material may be formed.
Although an example is given in which two layers of protective films made of inorganic materials are used, any number of layers may be used, each having one or more layers.

Assuming that the blade and cutting speed used for dicing are optimal for the substrate material, A, (1!
, D is shown in Table 1. Of course, the smaller D is, the more
It has the advantage that it can be used up to the edge of the substrate, and the spacing between elements can be reduced when several element chips are lined up.

Table 1 The example shown in Table 1 is the example shown in FIG. 1 in which silicon oxide is used as the inorganic film, and D is the minimum value that does not cause damage to the element. As you can see from this table, A and O-A are 20p.
If rn is exceeded, D-0 becomes a value exceeding 15 μm, meaningless areas increase and D itself becomes larger. When the protective film structure is different or absent, the thickness is 9275 μm. A
, (:!-If both A and A are 1 μm to 20 μm, D-C is less than 1011rrL and can be ignored, and D is around 20 μm.Of course, the larger the person or C-A is, the smaller D-C is, but if you look at D, it is almost This value (1 μm to 20 μm) applies not only to this example but also to any substrate or low material used, provided the dicing conditions are appropriate.

〔Effect of the invention〕

In the present invention, element damage (chipping, etc.) that occurs during dicing can be minimized by restricting the positional relationship between the dicing blade passage target line and the abrasive film and determining the structure as the dicing scribe line.

Therefore, it is particularly useful for a light receiving device having a multi-chip mounting structure, and the difference in light receiving pitch at the connecting portion can be minimized.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing one embodiment of the present invention. FIG. 2 shows the number of times damage occurs to the substrate, and 201 shows chipping. Applicant Seiko Epson Co., Ltd. Agent Mogami Patent Attorney (and 1 other person),, r゛. First cause

Claims (2)

[Claims] (1) In a substrate on which at least one layer each of inorganic material and organic material is provided as a protective film for semiconductor elements, a line through which the dicing blade passes is provided using an element forming material such as aluminum or polysilicon, and the line through which the blade passes. At least one protective film made of an inorganic material is not provided 1 μm or more and 20 μm or less from the edge of the line on the side where the line is not present, and 1 μm from the boundary line of the film closest to the substrate among the inorganic materials on the side where the line is not present. A scribing line for dicing, characterized in that at least one layer of a protective film made of an organic material is not provided in a region of 20 μm or less. (2) The scribing line for dicing according to claim 1, characterized in that a quartz substrate is used as the substrate and polyimide is used as the organic material.