JPS6188252U - - Google Patents
Info
- Publication number
- JPS6188252U JPS6188252U JP1984173870U JP17387084U JPS6188252U JP S6188252 U JPS6188252 U JP S6188252U JP 1984173870 U JP1984173870 U JP 1984173870U JP 17387084 U JP17387084 U JP 17387084U JP S6188252 U JPS6188252 U JP S6188252U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- resin
- semiconductor device
- mounting hole
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の半導体装置の断面図である。 １……金属ベース、２……半導体チツプ、３…
…封止樹脂、３ａ……ブツシング部。
従来の半導体装置の断面図である。 １……金属ベース、２……半導体チツプ、３…
…封止樹脂、３ａ……ブツシング部。
Claims (1)
- 金属ベースを有する樹脂封止半導体装置におい
て、前記金属ベースに設けられている取付穴の内
壁を絶縁する筒形のブツシングが前記封止樹脂と
一体に形成されていることを特徴とする半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984173870U JPS6188252U (ja) | 1984-11-16 | 1984-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984173870U JPS6188252U (ja) | 1984-11-16 | 1984-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188252U true JPS6188252U (ja) | 1986-06-09 |
Family
ID=30731507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984173870U Pending JPS6188252U (ja) | 1984-11-16 | 1984-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188252U (ja) |
-
1984
- 1984-11-16 JP JP1984173870U patent/JPS6188252U/ja active Pending