JPS6186940U - - Google Patents
Info
- Publication number
- JPS6186940U JPS6186940U JP17181484U JP17181484U JPS6186940U JP S6186940 U JPS6186940 U JP S6186940U JP 17181484 U JP17181484 U JP 17181484U JP 17181484 U JP17181484 U JP 17181484U JP S6186940 U JPS6186940 U JP S6186940U
- Authority
- JP
- Japan
- Prior art keywords
- spacer member
- component according
- electronic component
- die bonding
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第1図は、本考案の実施例の縦断面図、第2図
は、ボンデイングに用いる薄板状半田を示す斜視
図、第3図は、従来例の縦断面図である。
図中、符号1は素子ペレツト、2は基板、6は
スペーサ部材。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a perspective view showing a thin plate-shaped solder used for bonding, and FIG. 3 is a longitudinal sectional view of a conventional example. In the figure, reference numeral 1 is an element pellet, 2 is a substrate, and 6 is a spacer member.
Claims (1)
内に混入した状態で素子ペレツト1を基板2の表
面に結合し、前記スペーサ部材6によつて素子ペ
レツトと基板2とを、スペーサ部材6の寸法間隔
をもつて平行に維持させてあるダイボンデイング
電子部品。 (2) 前記スペーサ部材6が球状である実用新案
登録請求の範囲第1項に記載のダンボンデイング
電子部品。 (3) 前記スペーサ部材6が短円柱状である実用
新案登録請求の範囲第1項に記載のダイボンデイ
ング電子部品。 (4) 前記スペーサ部材6が金属材で構成されて
いる実用新案登録請求の範囲第1項ないし第3項
のうちのいずれかに記載のダイボンデイング電子
部品。[Claims for Utility Model Registration] (1) The spacer member 6 with a high melting temperature is connected to the solder layer 3.
die bonding, in which the element pellets 1 are bonded to the surface of the substrate 2 with the element pellets mixed therein, and the element pellets and the substrate 2 are maintained parallel to each other by the spacer member 6 with a dimensional interval of the spacer member 6. electronic components. (2) The Dan bonding electronic component according to claim 1, wherein the spacer member 6 is spherical. (3) The die bonding electronic component according to claim 1, wherein the spacer member 6 has a short cylindrical shape. (4) The die bonding electronic component according to any one of claims 1 to 3, wherein the spacer member 6 is made of a metal material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17181484U JPS6186940U (en) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17181484U JPS6186940U (en) | 1984-11-12 | 1984-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6186940U true JPS6186940U (en) | 1986-06-07 |
Family
ID=30729493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17181484U Pending JPS6186940U (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6186940U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005129886A (en) * | 2003-10-03 | 2005-05-19 | Fuji Electric Holdings Co Ltd | Semiconductor device and its manufacturing method |
JP2009054893A (en) * | 2007-08-28 | 2009-03-12 | Panasonic Electric Works Co Ltd | Light emitting device |
US8841342B2 (en) | 2002-08-09 | 2014-09-23 | Vital Health Sciences Pty. Ltd. | Carrier |
US9168216B2 (en) | 2005-06-17 | 2015-10-27 | Vital Health Sciences Pty. Ltd. | Carrier comprising one or more di and/or mono-(electron transfer agent) phosphate derivatives or complexes thereof |
US9314527B2 (en) | 2010-03-30 | 2016-04-19 | Phosphagenics Limited | Transdermal delivery patch |
US9561243B2 (en) | 2011-03-15 | 2017-02-07 | Phosphagenics Limited | Composition comprising non-neutralised tocol phosphate and a vitamin A compound |
-
1984
- 1984-11-12 JP JP17181484U patent/JPS6186940U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8841342B2 (en) | 2002-08-09 | 2014-09-23 | Vital Health Sciences Pty. Ltd. | Carrier |
JP2005129886A (en) * | 2003-10-03 | 2005-05-19 | Fuji Electric Holdings Co Ltd | Semiconductor device and its manufacturing method |
US9168216B2 (en) | 2005-06-17 | 2015-10-27 | Vital Health Sciences Pty. Ltd. | Carrier comprising one or more di and/or mono-(electron transfer agent) phosphate derivatives or complexes thereof |
JP2009054893A (en) * | 2007-08-28 | 2009-03-12 | Panasonic Electric Works Co Ltd | Light emitting device |
US9314527B2 (en) | 2010-03-30 | 2016-04-19 | Phosphagenics Limited | Transdermal delivery patch |
US9561243B2 (en) | 2011-03-15 | 2017-02-07 | Phosphagenics Limited | Composition comprising non-neutralised tocol phosphate and a vitamin A compound |
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