JPS6186940U - - Google Patents

Info

Publication number
JPS6186940U
JPS6186940U JP17181484U JP17181484U JPS6186940U JP S6186940 U JPS6186940 U JP S6186940U JP 17181484 U JP17181484 U JP 17181484U JP 17181484 U JP17181484 U JP 17181484U JP S6186940 U JPS6186940 U JP S6186940U
Authority
JP
Japan
Prior art keywords
spacer member
component according
electronic component
die bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17181484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17181484U priority Critical patent/JPS6186940U/ja
Publication of JPS6186940U publication Critical patent/JPS6186940U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の実施例の縦断面図、第２図
は、ボンデイングに用いる薄板状半田を示す斜視
図、第３図は、従来例の縦断面図である。 図中、符号１は素子ペレツト、２は基板、６は
スペーサ部材。 FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a perspective view showing a thin plate-shaped solder used for bonding, and FIG. 3 is a longitudinal sectional view of a conventional example. In the figure, reference numeral 1 is an element pellet, 2 is a substrate, and 6 is a spacer member.

Claims (1)

【実用新案登録請求の範囲】 (1) 溶融温度が高いスペーサ部材６を半田層３
内に混入した状態で素子ペレツト１を基板２の表
面に結合し、前記スペーサ部材６によつて素子ペ
レツトと基板２とを、スペーサ部材６の寸法間隔
をもつて平行に維持させてあるダイボンデイング
電子部品。 (2) 前記スペーサ部材６が球状である実用新案
登録請求の範囲第１項に記載のダンボンデイング
電子部品。 (3) 前記スペーサ部材６が短円柱状である実用
新案登録請求の範囲第１項に記載のダイボンデイ
ング電子部品。 (4) 前記スペーサ部材６が金属材で構成されて
いる実用新案登録請求の範囲第１項ないし第３項
のうちのいずれかに記載のダイボンデイング電子
部品。[Claims for Utility Model Registration] (1) The spacer member 6 with a high melting temperature is connected to the solder layer 3.
die bonding, in which the element pellets 1 are bonded to the surface of the substrate 2 with the element pellets mixed therein, and the element pellets and the substrate 2 are maintained parallel to each other by the spacer member 6 with a dimensional interval of the spacer member 6. electronic components. (2) The Dan bonding electronic component according to claim 1, wherein the spacer member 6 is spherical. (3) The die bonding electronic component according to claim 1, wherein the spacer member 6 has a short cylindrical shape. (4) The die bonding electronic component according to any one of claims 1 to 3, wherein the spacer member 6 is made of a metal material.
JP17181484U 1984-11-12 1984-11-12 Pending JPS6186940U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17181484U JPS6186940U (en) 1984-11-12 1984-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17181484U JPS6186940U (en) 1984-11-12 1984-11-12

Publications (1)

Publication Number Publication Date
JPS6186940U true JPS6186940U (en) 1986-06-07

Family

ID=30729493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17181484U Pending JPS6186940U (en) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPS6186940U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005129886A (en) * 2003-10-03 2005-05-19 Fuji Electric Holdings Co Ltd Semiconductor device and its manufacturing method
JP2009054893A (en) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd Light emitting device
US8841342B2 (en) 2002-08-09 2014-09-23 Vital Health Sciences Pty. Ltd. Carrier
US9168216B2 (en) 2005-06-17 2015-10-27 Vital Health Sciences Pty. Ltd. Carrier comprising one or more di and/or mono-(electron transfer agent) phosphate derivatives or complexes thereof
US9314527B2 (en) 2010-03-30 2016-04-19 Phosphagenics Limited Transdermal delivery patch
US9561243B2 (en) 2011-03-15 2017-02-07 Phosphagenics Limited Composition comprising non-neutralised tocol phosphate and a vitamin A compound

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8841342B2 (en) 2002-08-09 2014-09-23 Vital Health Sciences Pty. Ltd. Carrier
JP2005129886A (en) * 2003-10-03 2005-05-19 Fuji Electric Holdings Co Ltd Semiconductor device and its manufacturing method
US9168216B2 (en) 2005-06-17 2015-10-27 Vital Health Sciences Pty. Ltd. Carrier comprising one or more di and/or mono-(electron transfer agent) phosphate derivatives or complexes thereof
JP2009054893A (en) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd Light emitting device
US9314527B2 (en) 2010-03-30 2016-04-19 Phosphagenics Limited Transdermal delivery patch
US9561243B2 (en) 2011-03-15 2017-02-07 Phosphagenics Limited Composition comprising non-neutralised tocol phosphate and a vitamin A compound

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