JPS58129641U - Wafer adhesive structure - Google Patents
Wafer adhesive structureInfo
- Publication number
- JPS58129641U JPS58129641U JP2681282U JP2681282U JPS58129641U JP S58129641 U JPS58129641 U JP S58129641U JP 2681282 U JP2681282 U JP 2681282U JP 2681282 U JP2681282 U JP 2681282U JP S58129641 U JPS58129641 U JP S58129641U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive structure
- wafer adhesive
- dividing
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来のウェーハ接着構体の斜視図、第２図は
、そのウェーハ分割状態を示す部分斜視図、第３図は、
この考案の一実施例を示すウェーハ接着構体の斜視図、
第４図及び第５図はその断面図、第６図は第５図円Ａ部
の拡大断面図である。
２・・・・・・ウェーハ、３’ ＋ ３’ ＋ ・・
・・・・スクライブ溝、８・・・・・・金属板、１０・
・・・・・接着層、１３．１３゜・・・・・・ペレット
。
第３図
第４図FIG. 1 is a perspective view of a conventional wafer bonding structure, FIG. 2 is a partial perspective view showing the state of dividing the wafer, and FIG. 3 is a perspective view of a conventional wafer bonding structure.
A perspective view of a wafer bonding structure showing an embodiment of this invention,
FIGS. 4 and 5 are sectional views thereof, and FIG. 6 is an enlarged sectional view of circle A section in FIG. 2...Wafer, 3' + 3' +...
...Scribe groove, 8...Metal plate, 10.
...adhesive layer, 13.13° ...pellet. Figure 3 Figure 4
Claims (1)
を形成して、ペレットに分割するウェーハが熱膨張係数
が極めて大きな金属板に接着層を介して貼着されたこと
を特徴とするウェーハ接着構体。Wafer adhesion characterized by forming scribe grooves along the partition boundaries of a large number of elements and dividing the wafer into pellets by adhering the wafer to a metal plate with an extremely large coefficient of thermal expansion via an adhesive layer. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2681282U JPS58129641U (en) | 1982-02-25 | 1982-02-25 | Wafer adhesive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2681282U JPS58129641U (en) | 1982-02-25 | 1982-02-25 | Wafer adhesive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58129641U true JPS58129641U (en) | 1983-09-02 |
Family
ID=30038745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2681282U Pending JPS58129641U (en) | 1982-02-25 | 1982-02-25 | Wafer adhesive structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58129641U (en) |
-
1982
- 1982-02-25 JP JP2681282U patent/JPS58129641U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58129641U (en) | Wafer adhesive structure | |
| JPS58124444U (en) | conductive adhesive tape | |
| JPS5913512U (en) | Lightweight cellular concrete panel with hollow parts | |
| JPS5944750U (en) | Adhesive film for surface protection | |
| JPS5944748U (en) | adhesive tape | |
| JPS5818934U (en) | adhesive tape | |
| JPS602858U (en) | heat sink electrode | |
| JPS58144843U (en) | Wafer adhesive sheet | |
| JPS5895432U (en) | Insulating exterior base material | |
| JPS59176678U (en) | masking tape | |
| JPS58151993U (en) | magnetic tape cassette | |
| JPS60175318U (en) | magnetic head | |
| JPS5947631U (en) | double glazed glass | |
| JPS59149275U (en) | floppy disc | |
| JPS6133373U (en) | nickel cadmium storage battery | |
| JPS60182134U (en) | Surface material | |
| JPS59104178U (en) | display device | |
| JPS587340U (en) | Tape for dividing semiconductor pellets | |
| JPS5868042U (en) | Isolated semiconductor device | |
| JPS60153534U (en) | Beam lead type semiconductor device | |
| JPS58194045U (en) | thermal head | |
| JPS60125743U (en) | diode | |
| JPS58120655U (en) | Adhesive sheet for wafer dicing | |
| JPS58116234U (en) | Thick film module heat sink | |
| JPS58192066U (en) | heat sensitive recording material |