JPS6186938U - - Google Patents

Info

Publication number
JPS6186938U
JPS6186938U JP17144784U JP17144784U JPS6186938U JP S6186938 U JPS6186938 U JP S6186938U JP 17144784 U JP17144784 U JP 17144784U JP 17144784 U JP17144784 U JP 17144784U JP S6186938 U JPS6186938 U JP S6186938U
Authority
JP
Japan
Prior art keywords
transfer passage
mold
molds
sliding member
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17144784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238447Y2 (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984171447U priority Critical patent/JPH0238447Y2/ja
Priority to US06/796,814 priority patent/US4723899A/en
Publication of JPS6186938U publication Critical patent/JPS6186938U/ja
Application granted granted Critical
Publication of JPH0238447Y2 publication Critical patent/JPH0238447Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1984171447U 1984-11-12 1984-11-12 Expired JPH0238447Y2 (enEXAMPLES)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984171447U JPH0238447Y2 (enEXAMPLES) 1984-11-12 1984-11-12
US06/796,814 US4723899A (en) 1984-11-12 1985-11-12 Molding apparatus for enclosing semiconductor chips with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984171447U JPH0238447Y2 (enEXAMPLES) 1984-11-12 1984-11-12

Publications (2)

Publication Number Publication Date
JPS6186938U true JPS6186938U (enEXAMPLES) 1986-06-07
JPH0238447Y2 JPH0238447Y2 (enEXAMPLES) 1990-10-17

Family

ID=30729134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984171447U Expired JPH0238447Y2 (enEXAMPLES) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPH0238447Y2 (enEXAMPLES)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592326A (ja) * 1982-06-28 1984-01-07 Toshiba Corp 半導体素子の樹脂成形方法およびその装置
JPS5959428A (ja) * 1982-09-30 1984-04-05 Toshiba Corp 樹脂モ−ルド封止装置
JPS59149027A (ja) * 1983-02-16 1984-08-25 Hitachi Ltd モ−ルド装置
JPS60149423A (ja) * 1984-01-13 1985-08-06 Matsushita Electric Works Ltd 封止成形金型
JPS60214916A (ja) * 1984-04-10 1985-10-28 Matsushita Electric Works Ltd 封止成形金型の成形圧力調整機構

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592326A (ja) * 1982-06-28 1984-01-07 Toshiba Corp 半導体素子の樹脂成形方法およびその装置
JPS5959428A (ja) * 1982-09-30 1984-04-05 Toshiba Corp 樹脂モ−ルド封止装置
JPS59149027A (ja) * 1983-02-16 1984-08-25 Hitachi Ltd モ−ルド装置
JPS60149423A (ja) * 1984-01-13 1985-08-06 Matsushita Electric Works Ltd 封止成形金型
JPS60214916A (ja) * 1984-04-10 1985-10-28 Matsushita Electric Works Ltd 封止成形金型の成形圧力調整機構

Also Published As

Publication number Publication date
JPH0238447Y2 (enEXAMPLES) 1990-10-17

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