JPS6186087A - レ−ザ加工装置 - Google Patents
レ−ザ加工装置Info
- Publication number
- JPS6186087A JPS6186087A JP59207956A JP20795684A JPS6186087A JP S6186087 A JPS6186087 A JP S6186087A JP 59207956 A JP59207956 A JP 59207956A JP 20795684 A JP20795684 A JP 20795684A JP S6186087 A JPS6186087 A JP S6186087A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- distance
- workpiece
- light
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims description 12
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000003754 machining Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Measurement Of Optical Distance (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59207956A JPS6186087A (ja) | 1984-10-05 | 1984-10-05 | レ−ザ加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59207956A JPS6186087A (ja) | 1984-10-05 | 1984-10-05 | レ−ザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6186087A true JPS6186087A (ja) | 1986-05-01 |
JPH037476B2 JPH037476B2 (enrdf_load_stackoverflow) | 1991-02-01 |
Family
ID=16548315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59207956A Granted JPS6186087A (ja) | 1984-10-05 | 1984-10-05 | レ−ザ加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6186087A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62259011A (ja) * | 1986-05-02 | 1987-11-11 | Toshiba Corp | 距離検出器 |
US8710403B2 (en) * | 2008-02-19 | 2014-04-29 | M-Solv Ltd. | Laser processing a multi-device panel |
WO2024241638A1 (ja) * | 2023-05-19 | 2024-11-28 | 株式会社荏原製作所 | ビーム加工装置の観察装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5525125A (en) * | 1978-08-11 | 1980-02-22 | Toshiba Corp | Positioning unit |
-
1984
- 1984-10-05 JP JP59207956A patent/JPS6186087A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5525125A (en) * | 1978-08-11 | 1980-02-22 | Toshiba Corp | Positioning unit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62259011A (ja) * | 1986-05-02 | 1987-11-11 | Toshiba Corp | 距離検出器 |
US8710403B2 (en) * | 2008-02-19 | 2014-04-29 | M-Solv Ltd. | Laser processing a multi-device panel |
WO2024241638A1 (ja) * | 2023-05-19 | 2024-11-28 | 株式会社荏原製作所 | ビーム加工装置の観察装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH037476B2 (enrdf_load_stackoverflow) | 1991-02-01 |
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