JPS6186087A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS6186087A
JPS6186087A JP59207956A JP20795684A JPS6186087A JP S6186087 A JPS6186087 A JP S6186087A JP 59207956 A JP59207956 A JP 59207956A JP 20795684 A JP20795684 A JP 20795684A JP S6186087 A JPS6186087 A JP S6186087A
Authority
JP
Japan
Prior art keywords
lens
distance
workpiece
light
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59207956A
Other languages
Japanese (ja)
Other versions
JPH037476B2 (en
Inventor
Kozaburo Shibayama
耕三郎 柴山
Takashi Ikeda
隆 池田
Hidehiko Nakao
英彦 中尾
Kazuo Takashima
和夫 高嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59207956A priority Critical patent/JPS6186087A/en
Publication of JPS6186087A publication Critical patent/JPS6186087A/en
Publication of JPH037476B2 publication Critical patent/JPH037476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Abstract

PURPOSE:To execute precise laser working such as laser cut, etc. by providing a distance control means for controlling so that a distance between a working work and a working lens is kept constant. CONSTITUTION:A radiant beam emitted from a light source 7 is focused by a projection lens 8, and irradiated as an optical spot at the same position as a laser beam 1 on a work surface of a working work W. A photodetecting lens 9 executes an image pickup of the optical spot on the work surface, and forms an image of the optical spot on a photodetecting surface of a photodetector 10. The photodetector 10 which has detected this optical spot image generated an electric signal corresponding to an image formed position of the optical spot image. A processing circuit 11 executes an operation and sends out a distance output. That is to say, an electric signal for controlling the position of a working use lens 2 is outputted so as to keep a distance l constant. Accordingly, the position of the lens 2 is adjusted, and the distance between the work surface of the working work W and the lens 2 of a working head 20 is controlled so that it always becomes constant.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は加工ワークV(レーザビームを照射してレー
ザ加工を行うレーザ加工装置、特に加工ヘッドに関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a processing workpiece V (a laser processing apparatus that performs laser processing by irradiating a laser beam, particularly a processing head).

〔従来の技術〕[Conventional technology]

第2図は従来のレーザ加工装置の加工ヘッドの断面図で
ある。図において、(1)はレーザ加工を行う上で主体
となるCOlのレーザビーム、(2)ハレーサヒーム金
細かく絞るための加工用レンズ、(3)ハ先端を細く成
型してアシストガスの流れを高速しする作用をもつ加工
ヘッド(20)のノズル、(4)はノズル(3)を所定
のノズル位fitVC固定させるためのロックナツト、
(5)は加工ワーク(ト)と加工ヘッド■のノズル(3
)との距離を一定に保つための接触式倣いセンサである
FIG. 2 is a sectional view of a processing head of a conventional laser processing device. In the figure, (1) is the CO1 laser beam that is the main component in laser processing, (2) is the processing lens for finely focusing the metal, and (3) is the tip formed to be thin to make the assist gas flow at high speed. (4) is a lock nut for fixing the nozzle (3) at a predetermined nozzle position,
(5) shows the machining workpiece (G) and the nozzle (3) of the machining head ■.
) is a contact-type scanning sensor that maintains a constant distance from the

従来のレーザ加工装置は、上記のようtこ構成され、た
とえばレーザ発振器(図示せず)から出射されたレーザ
ビーム(1)は複数枚のミラーで反射されなからカロエ
ヘッド部へ到達し、加工ヘッド翰の加工用レンズ(2)
で絞られて加工ワーク(ト)に照射され、レーザ切断や
レーザ溶接などの精密加工に供される。
A conventional laser processing device is configured as described above. For example, a laser beam (1) emitted from a laser oscillator (not shown) is reflected by a plurality of mirrors and then reaches the processing head. Lens for machining wire (2)
The beam is focused and irradiated onto the workpiece (g), where it is used for precision machining such as laser cutting and laser welding.

そして、加工ワーク(ト)が二次元平板でこれにレーザ
切断加工を行う場合、加工ワーク(4)に“そり“など
の多少の凹凸があっても、装備された接触式倣いセ/す
(5)によってレーザビーム(2)の焦点位置をいつも
一定に保っているので、良好な切断を得ている。
When the workpiece (G) is a two-dimensional flat plate and laser cutting is performed on it, even if the workpiece (4) has some irregularities such as "warpage", the equipped contact copying machine ( 5), the focal position of the laser beam (2) is always kept constant, resulting in good cutting.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、近年急激Vこ増加してきた三次元立体加工ワ
ークのレーザ切断加工を行う場合には、加工ヘッド−の
姿勢を制御してワーク面yc対し略垂直Vこノズル(3
1f、向は耽けれは良好な切断が得られない。また、ワ
ーク面とノズル(3〕或いは、加工用レンズ(2)との
距離を一定に保つ必要がある。
By the way, when laser cutting a three-dimensional three-dimensional processing workpiece, which has been rapidly increasing in V in recent years, the attitude of the processing head is controlled and the V nozzle (3
1f, if the direction is too low, a good cut cannot be obtained. Further, it is necessary to maintain a constant distance between the work surface and the nozzle (3) or the processing lens (2).

しかしなから上記のような従来のレーザ加工装置では、
レーザビーム(2)の焦点位置を一定に保つためvC1
接触式倣いセッサ(5)を使用しているが、接触式倣い
セッサ(5)ではそれほどの精度が出す、しかも立体面
の曲率の小きなコーナ部では接触式倣いセンサ(5)の
立体自体が大き過ぎて使用できないという問題点があっ
た1、 この発明は、かかる問題点を解決するためになされたも
ので、加工ワークが如何なる例えば三次元立体曲面を有
するものである場合でも、加工ワークと加工ヘッドの加
工用レンズとの距離を常に一定に保ち、良好な切断等の
レーザ加工を行うことができるレーザ加工装置を得るこ
と全目的とする。
However, with conventional laser processing equipment such as the one mentioned above,
vC1 to keep the focal position of the laser beam (2) constant.
A contact-type copying sensor (5) is used, but the contact-type copying sensor (5) can achieve a high degree of accuracy.Moreover, in the corners of the three-dimensional surface with small curvature, the contact-type copying sensor (5) is able to produce a high level of accuracy. There was a problem that the workpiece was too large to be used.1 This invention was made to solve this problem. The object of the present invention is to obtain a laser processing device that can perform laser processing such as cutting with good quality by always keeping the distance between the lens and the processing lens of the processing head constant.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

この発明に係るレーザ加工製置は、光源からの放射ビー
ムを集束し、加工ワーク1対して適当な大きさの光スポ
ットを照射する投光し/スと、加工ワーク上の光スポッ
トを撮像する受光レンズと受光レンズによって撮像され
た元スポット像の位置に対応した電気信号を送出する光
検出器と、光検出器の電気信号よシ加エワークと加工用
レンズ間の距離を演算し、該距離を一定に保つよう制御
する電気信号を出力する処理回路からなり、加工ワーク
と加工用レンズ間の距離を一定に保つよう制御する距離
制御手段を設けるように構成したものである。
The laser processing equipment according to the present invention includes a light projector that focuses a radiation beam from a light source and irradiates a light spot of an appropriate size onto a workpiece, and an image of the light spot on the workpiece. A light-receiving lens and a photodetector that sends an electric signal corresponding to the position of the original spot image imaged by the light-receiving lens; The apparatus is comprised of a processing circuit that outputs an electric signal to control the distance between the workpiece and the processing lens to be kept constant, and is provided with a distance control means to control the distance between the workpiece and the processing lens to be kept constant.

〔作用〕 ” この発明においては、光源と投光レンズとによって加工
ワークに照射された放射ビームのワーク表面上での光ス
ポットの像を受光レンズで撮像し、受光レンズによって
撮像された光スポット像を光検出器で検知し、光検出器
から送出された光スポットの結像位置に対応した電気信
号を受けた処理回路が加工ワークと加工用レノス間の距
離を演算し、該距離を一定に保つよう制御する電気信号
を出力し、その電気信号eこよって加工ワークと加工用
レンズ間の距離を常1’L一定に保つよう制御する。
[Operation] ” In the present invention, an image of a light spot on the surface of the workpiece of a radiation beam irradiated onto the workpiece by a light source and a light projecting lens is captured by a light receiving lens, and the light spot image captured by the light receiving lens is is detected by a photodetector, and a processing circuit that receives an electrical signal corresponding to the imaging position of the light spot sent out from the photodetector calculates the distance between the processing workpiece and the processing reno, and keeps the distance constant. An electrical signal is output to control the distance between the workpiece and the processing lens to be maintained at a constant value of 1'L.

〔実施例〕〔Example〕

第1図祉この発明の一実施例を示す断面図である。図に
おいて、(1)はレーザ加工を行う上で主体となるCO
7のレーザビーム、(2)は先端を細く成型してアシス
トガスの流れを高速tCする作用をもつ加工ヘッド翰の
ノズルでおる。
FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, (1) indicates CO, which is the main ingredient in laser processing.
Laser beam 7 (2) is emitted by a nozzle of the processing head whose tip is formed into a thin shape and has the effect of increasing the flow of assist gas at high speed tC.

(7)は放射ビームを発する光源で、ノズル(3)の上
部に@接した位置Vこ設けられている。(8)は光源(
6)よシ発せられた放射ビームを集束する投光レンズ、
(9)は加工ワーク(ト)rこ照射された放射ビームの
ワーク表面での放射ビーム像でおる光スポット像を撮(
Lする受光レンズで、ノズル(3)の上部に隣接し、ノ
ズル(3)全中心とした投光レンズ(8)の略対称位置
に設けられている。Qoは光スポット像の結像位置に対
応する電気信号を発生する非接触式の光センサでめる光
検出器で、その受光面は受光レンズ(9)の結像面ンこ
配置させられている。(11)は光検出器図の出力信号
を処理して加工用レンズ(2)の位置を制御する電気信
号を出力する処理回路である。
Reference numeral (7) denotes a light source that emits a radiation beam, and is provided at a position V in contact with the upper part of the nozzle (3). (8) is the light source (
6) a projection lens that focuses the emitted radiation beam;
(9) Photographs the light spot image of the radiation beam on the surface of the workpiece irradiated with the radiation beam.
This is a light-receiving lens that is L-shaped, and is provided adjacent to the upper part of the nozzle (3) at a position substantially symmetrical to the light-emitting lens (8) with the entire center of the nozzle (3). Qo is a photodetector comprised of a non-contact optical sensor that generates an electrical signal corresponding to the imaging position of a light spot image, and its light-receiving surface is placed on the imaging surface of the light-receiving lens (9). There is. (11) is a processing circuit that processes the output signal of the photodetector diagram and outputs an electric signal for controlling the position of the processing lens (2).

このよりに、加工ワーク(ト)と加工ヘッド(7)の加
工用レンズ(2)との間の距離を一定に保つように制御
する距離制御手段は光源(7)、投光し/ズ(8)、受
光レンズ(9)、光検出器叫及び処理回路(11)で構
成されている。
As a result, the distance control means for controlling the distance between the workpiece (g) and the machining lens (2) of the machining head (7) to be kept constant is the light source (7), the light emitting/zoom ( 8), a light receiving lens (9), a photodetector and a processing circuit (11).

上記のように構成されたレーザ加工装置では、光源(7
)より発せられた放射ビームは投光レンズ(8)で& 
束され、万ロエワークへMのワーク表1111′](ご
レーザビーム(1)と同一位置で元スポットとなって照
射ぢれる。
In the laser processing apparatus configured as described above, the light source (7
) is emitted by a projection lens (8).
The laser beam (1) is bundled and irradiated onto the workpiece M as the original spot at the same position as the laser beam (1).

そうすると、受光レンズ(9)はワーク表面上での元ス
ポットの像を撮像し、元検出器叫の受光面上医光スポッ
トの像を結像する。この光スポット像を検知した光検出
器明は例えば元位置検出器とも称されるもので、元スポ
ット像の結像位置に応じfc電気信号を発生する。即ち
、光検出器αqの2つの電極回生じる電流iA、1Bの
値により、光スポット像の結像位置Pは、次VC,示す
式(1)で表わされる。
Then, the light receiving lens (9) captures an image of the original spot on the workpiece surface, and forms an image of the medical light spot on the light receiving surface of the original detector. The photodetector that detects this light spot image is also called, for example, an original position detector, and generates an fc electric signal depending on the imaging position of the original spot image. That is, based on the values of currents iA and 1B generated by the two electrodes of the photodetector αq, the imaging position P of the light spot image is expressed by the following equation (1) VC.

光検出器αOの出力は、光スポット像の位置と強度に比
例して出力を発生するため、上記式(1)では光スポッ
ト像の強度変化に札当する(iA+jB)で割り算を行
ない、光スポット像の位置のみに比例する出刃を侍でい
る。
Since the output of the photodetector αO is proportional to the position and intensity of the light spot image, in equation (1) above, the intensity change of the light spot image is divided by (iA+jB), and the light The samurai has a blade that is proportional only to the position of the spot image.

一方〜投°父光し/ズ(8J、(9)の光点(Pll、
(P21より加工ワーク<VV>のワーク表面までの距
離Aは次V(示す式(2)で表わされる。
On the other hand, the light point of (9) (Pll,
(From P21, the distance A to the workpiece surface of the processed workpiece <VV> is expressed by the following equation (2).

この式(2)で、Lに投光レンズ(8)の光点(Pl)
と受光レンズ(9)の光点(P2)との距離でちゃ、ψ
はワーク表面に照射されるレーザビームの光軸と投光し
/ス(8)によりワーク表面rこ照射される放射ビーム
の投光光軸間の角匿でちり、θは同じくレーザビームの
元軸と受光レンズ(9)に入射する放射ビームの受光光
軸間の角度でおる。この中で、L、ψは装置の構成のみ
で決まる固定値である。また、θは上述した元スポット
像の位ItPと、受光レンズ(9)の焦点距離や設置位
置によシ求するが、P以外の値はやはり固定値となる。
In this equation (2), L is the light point (Pl) of the projection lens (8)
The distance between and the light point (P2) of the light receiving lens (9) is ψ
is the angle between the optical axis of the laser beam irradiated onto the workpiece surface and the projection optical axis of the radiation beam irradiated onto the workpiece surface by the projector (8), and θ is the origin of the laser beam. This is the angle between the axis and the receiving optical axis of the radiation beam incident on the receiving lens (9). Among these, L and ψ are fixed values determined only by the configuration of the device. Further, θ is determined by the above-mentioned position ItP of the original spot image and the focal length and installation position of the light receiving lens (9), but the values other than P are fixed values.

つまり、投・受光レンズ(87、(9)の光点CP、 
l、 (P、 )  よシ加エワーク(5)のワーク表
面までの距離Aは、ワーク表面の変位に対応する光スポ
ット像の結像位置Pのみ、即ち光検出器αno′NL気
出力である電流iA、iBを変数として求めることがで
きる。
In other words, the light point CP of the light emitting/receiving lens (87, (9))
l, (P, ) The distance A to the workpiece surface of the recessed workpiece (5) is only the imaging position P of the light spot image corresponding to the displacement of the workpiece surface, that is, the output of the photodetector αno'NL. The currents iA and iB can be determined as variables.

Iた、加工ワーク(4)のワーク表面と加工ヘッド翰の
加工用レンズ(2)間の距離lも、レンズ(8)、(9
)の光点(PHI、 (Pt)よりワーク表面までの距
離Aに一定の定数を加えればよいから、ワーク表面と加
工用レンズ(2)間の距離lは、次に示す式(3)とし
て算出できる。   t = K−P  ・・・・・・
曲・・(3)ここで、Kは設置定数であり、固定値で事
前の計算または実測により決定される。
In addition, the distance l between the workpiece surface of the processed workpiece (4) and the processing lens (2) of the processing head is also
) can be calculated by adding a certain constant to the distance A from the light point (PHI, (Pt)) to the workpiece surface, so the distance l between the workpiece surface and the processing lens (2) can be expressed as the following equation (3): It can be calculated. t = KP ・・・・・・
Song...(3) Here, K is an installation constant, which is a fixed value and is determined by prior calculation or actual measurement.

処理回路CIQは以上の演算を実行し、距離出力を送出
する、即ち距離lを一定V(保つよう加工用レンズ(2
)の位置を制御する電気信号を出力する。従って、その
電気信号によって図示しない加工ヘッド駆動装置が駆動
されて加工用レンズ(2)の位置が調整もれて加工ワー
ク(5)のワーク表面と加工ヘッド(7)の加工用し/
ズ(2)との間の距離は常に一定となるように&lI 
m 嘔れ、レーザビーム(1)のビームウェストが常に
ワーク表面の位置にあることとなり、最適加工状態が維
持される。
The processing circuit CIQ executes the above calculation and sends out the distance output, that is, the processing lens (2
) outputs an electrical signal that controls the position of the Therefore, the processing head driving device (not shown) is driven by the electric signal, and the position of the processing lens (2) is adjusted, and the workpiece surface of the processing workpiece (5) and the processing head (7) are aligned.
&lI so that the distance between the
The beam waist of the laser beam (1) is always located at the surface of the workpiece, and the optimum processing condition is maintained.

カお、上記実施例では光検出器−として光位置検出器が
用いられている例を示したが、光検出器αqとしてCC
D等のリニヤ七ンサアレイを用いてもよく、この場合も
同等の効果が得られる。
However, in the above embodiment, an optical position detector is used as the photodetector, but CC is used as the photodetector αq.
A linear seven-sensor array such as D may also be used, and the same effect can be obtained in this case as well.

また、放射ビームの投・受光光学系に加エワー・り■の
ワーク表面よシ異物を除去するウィンドウや、レーザ加
工中の光ノイズの影響を除去する光学フィルタを挿入し
ても良い。
Furthermore, a window for removing foreign matter from the surface of the workpiece during laser processing or an optical filter for removing the influence of optical noise during laser processing may be inserted into the radiation beam projection/receiving optical system.

更に、光源(6)に強度変調を施し、受光側でこの変調
周波数のみ選択処理等しても良いことは勿論である。
Furthermore, it goes without saying that the light source (6) may be subjected to intensity modulation, and only this modulation frequency may be selected and processed on the light receiving side.

〔発明の効果〕〔Effect of the invention〕

この発明は、以上説明したとおり、光源と投光レンズと
V〔よって加工ワークに照射された放射ビームのワーク
表面上での像を受光レンズで撮像し、受光レンズVCよ
って撮像された光スポット像を光検出器で検知し、光検
出器から送出された光スポット悸の結像位置に対応した
電気信号を受けた処理回路が加工ワークと加工用レンズ
間の距離を演算し、該距離を一足t(保つよう制御する
電気信号を出力するようr(構成された距離制御手段e
こよって加工ワークと加工ヘッドの加工用〕/ズとの間
の距離を一足に保つよう制御できるようにしたので、加
工ワークが複雑な凹凸を有する三次元立体物であっても
、加工ワークのワーク表面と加工ヘッドの加工用レンズ
との距離は常に一定となり、レーザ切断等の精密なレー
ザ加工が行えるという効果がある。
As explained above, the present invention includes a light source, a light projecting lens, V [therefore, an image of the radiation beam irradiated onto the workpiece on the workpiece surface is captured by the light receiving lens, and a light spot image captured by the light receiving lens VC]. is detected by a photodetector, and a processing circuit that receives an electrical signal corresponding to the imaging position of the light spot sent out from the photodetector calculates the distance between the processing workpiece and the processing lens, and calculates the distance between the processing workpiece and the processing lens. distance control means e configured to output an electrical signal for controlling to maintain t
This makes it possible to control the distance between the workpiece and the machining head of the machining head to keep it at one foot, so even if the workpiece is a three-dimensional object with complex unevenness, the distance between the workpiece and the The distance between the workpiece surface and the processing lens of the processing head is always constant, which has the effect of allowing precise laser processing such as laser cutting.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す断面図、第2図は従
来のレーザ加工装置の加工ヘッドの断面図である。 図において、(1)はレーザビーム、(2)は加工用レ
ンズ%(3)はノズル、(7)は光源、(8)は投光レ
ンズ、(9)は受光レンズ、(IQは光検出器、opは
処理回路、(4)は加工ワークである。 なお、各図中同一符号は四−又は相当部分を示第1図 1 ; レー寸゛シ゛ル 2ニブ吋旧し〉1゛ 9 :・艶尤しン1゛ 10・九氏−th 11;足埋回沁 W・no5−フー7
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a processing head of a conventional laser processing apparatus. In the figure, (1) is the laser beam, (2) is the processing lens, (3) is the nozzle, (7) is the light source, (8) is the light projecting lens, (9) is the light receiving lens, (IQ is the light detection 1, OP is a processing circuit, and (4) is a processed workpiece.The same reference numerals in each figure indicate 4 or equivalent parts.・Essence 1゛10・Mr. 9-th 11; Foot-embedding cycle W・no5-Fu 7

Claims (2)

【特許請求の範囲】[Claims] (1)レーザビームを加工ワークに照射してレーザ加工
を行うレーザ加工装置において、加工ワークとレーザビ
ームを集束する加工用レンズとの間の距離を一定に保つ
よう制御する距離制御手段を設け、該距離制御手段は、
放射ビームを発する光源と、該光源からの放射ビームを
集束し、加工ワークに対してレーザビームが照射される
のと同じ位置に適当な大きさの光スポットを照射する投
光レンズと、加工ワーク上の光スポットを撮像する受光
レンズと、該受光レンズの結像面に受光面を配置し、受
光レンズによつて結像された光スポット像の位置に対応
した電気信号を送出する光検出器と、該光検出器の電気
信号により加工ワークと加工用レンズ間の距離を演算し
、該距離を一定に保つよう制御する電気信号を出力する
処理回路とからなることを特徴とするレーザ加工装置。
(1) In a laser processing device that performs laser processing by irradiating a laser beam onto a workpiece, a distance control means is provided to control the distance between the workpiece and a processing lens that focuses the laser beam to be kept constant; The distance control means is
A light source that emits a radiation beam, a projection lens that focuses the radiation beam from the light source and irradiates a light spot of an appropriate size at the same position where the laser beam is irradiated onto the workpiece, and the workpiece. a light-receiving lens that images the light spot above, and a photodetector that has a light-receiving surface placed on the imaging surface of the light-receiving lens and sends out an electrical signal corresponding to the position of the light spot image formed by the light-receiving lens. and a processing circuit that calculates the distance between the workpiece and the processing lens based on the electrical signal from the photodetector and outputs an electrical signal that controls the distance to be kept constant. .
(2)前記光検出器は光位置検出器であることを特徴と
する特許請求の範囲第1項記載のレーザ加工装置。
(2) The laser processing apparatus according to claim 1, wherein the photodetector is an optical position detector.
JP59207956A 1984-10-05 1984-10-05 Laser working device Granted JPS6186087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59207956A JPS6186087A (en) 1984-10-05 1984-10-05 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59207956A JPS6186087A (en) 1984-10-05 1984-10-05 Laser working device

Publications (2)

Publication Number Publication Date
JPS6186087A true JPS6186087A (en) 1986-05-01
JPH037476B2 JPH037476B2 (en) 1991-02-01

Family

ID=16548315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59207956A Granted JPS6186087A (en) 1984-10-05 1984-10-05 Laser working device

Country Status (1)

Country Link
JP (1) JPS6186087A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259011A (en) * 1986-05-02 1987-11-11 Toshiba Corp Distance detector
US8710403B2 (en) * 2008-02-19 2014-04-29 M-Solv Ltd. Laser processing a multi-device panel

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525125A (en) * 1978-08-11 1980-02-22 Toshiba Corp Positioning unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525125A (en) * 1978-08-11 1980-02-22 Toshiba Corp Positioning unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259011A (en) * 1986-05-02 1987-11-11 Toshiba Corp Distance detector
US8710403B2 (en) * 2008-02-19 2014-04-29 M-Solv Ltd. Laser processing a multi-device panel

Also Published As

Publication number Publication date
JPH037476B2 (en) 1991-02-01

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