JPS618596B2 - - Google Patents

Info

Publication number
JPS618596B2
JPS618596B2 JP52152324A JP15232477A JPS618596B2 JP S618596 B2 JPS618596 B2 JP S618596B2 JP 52152324 A JP52152324 A JP 52152324A JP 15232477 A JP15232477 A JP 15232477A JP S618596 B2 JPS618596 B2 JP S618596B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52152324A
Other languages
Japanese (ja)
Other versions
JPS5430470A (en
Inventor
Peiji Baa Robaato
Morino Ronarudo
Jei Keo Reimondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS5430470A publication Critical patent/JPS5430470A/ja
Publication of JPS618596B2 publication Critical patent/JPS618596B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP15232477A 1977-08-09 1977-12-16 Method of forming electrical circuit board and device for performing method thereof Granted JPS5430470A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (2)

Publication Number Publication Date
JPS5430470A JPS5430470A (en) 1979-03-06
JPS618596B2 true JPS618596B2 (enrdf_load_stackoverflow) 1986-03-15

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15232477A Granted JPS5430470A (en) 1977-08-09 1977-12-16 Method of forming electrical circuit board and device for performing method thereof

Country Status (14)

Country Link
JP (1) JPS5430470A (enrdf_load_stackoverflow)
AT (1) AT377890B (enrdf_load_stackoverflow)
AU (1) AU508357B2 (enrdf_load_stackoverflow)
BR (1) BR7707302A (enrdf_load_stackoverflow)
CA (1) CA1102924A (enrdf_load_stackoverflow)
CH (1) CH629058A5 (enrdf_load_stackoverflow)
DE (1) DE2811458C2 (enrdf_load_stackoverflow)
FR (1) FR2400304A1 (enrdf_load_stackoverflow)
GB (1) GB1593235A (enrdf_load_stackoverflow)
IL (1) IL54283A (enrdf_load_stackoverflow)
IT (1) IT1155890B (enrdf_load_stackoverflow)
NL (1) NL7806258A (enrdf_load_stackoverflow)
SE (1) SE429702B (enrdf_load_stackoverflow)
ZA (1) ZA775455B (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (fr) * 1981-06-11 1982-12-17 Kurganov Vladimir Tete de distribution d'une machine de cablage automatique
FR2509950A1 (fr) * 1981-07-16 1983-01-21 Egorenkov Arvit Dispositif pour le montage d'un cable sur une plaque
JPS59186851A (ja) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk シ−ト巻取り準備装置
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (ja) * 1988-06-22 1997-05-21 大日本印刷株式会社 小巻き用ボビンへのフイルム接着装置
JP2672925B2 (ja) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 テープ状体の自動巻取機
EP2039460A3 (de) 2004-11-02 2014-07-02 HID Global GmbH Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
DE602007010634D1 (de) 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
EP2704186A1 (en) * 2012-08-27 2014-03-05 Garreth Finlay Method for laying a wire conductor onto a substrate and for connecting it to a chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (enrdf_load_stackoverflow) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (enrdf_load_stackoverflow) * 1970-03-05 1980-12-17
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques

Also Published As

Publication number Publication date
CH629058A5 (en) 1982-03-31
IL54283A (en) 1980-07-31
SE7802720L (sv) 1979-02-10
ZA775455B (en) 1978-07-26
DE2811458C2 (de) 1983-12-29
FR2400304B1 (enrdf_load_stackoverflow) 1982-02-12
FR2400304A1 (fr) 1979-03-09
BR7707302A (pt) 1979-05-29
AU508357B2 (en) 1980-03-20
IL54283A0 (en) 1978-06-15
JPS5430470A (en) 1979-03-06
AT377890B (de) 1985-05-10
SE429702B (sv) 1983-09-19
GB1593235A (en) 1981-07-15
CA1102924A (en) 1981-06-09
DE2811458A1 (de) 1979-02-15
ATA183578A (de) 1984-09-15
AU3026177A (en) 1979-05-10
IT7848473A0 (it) 1978-03-17
NL7806258A (nl) 1979-02-13
IT1155890B (it) 1987-01-28

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