JPS6185184U - - Google Patents
Info
- Publication number
- JPS6185184U JPS6185184U JP16978884U JP16978884U JPS6185184U JP S6185184 U JPS6185184 U JP S6185184U JP 16978884 U JP16978884 U JP 16978884U JP 16978884 U JP16978884 U JP 16978884U JP S6185184 U JPS6185184 U JP S6185184U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- utility
- conductive member
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16978884U JPS6185184U (zh) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16978884U JPS6185184U (zh) | 1984-11-08 | 1984-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185184U true JPS6185184U (zh) | 1986-06-04 |
Family
ID=30727504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16978884U Pending JPS6185184U (zh) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185184U (zh) |
-
1984
- 1984-11-08 JP JP16978884U patent/JPS6185184U/ja active Pending
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