JPS6185151U - - Google Patents
Info
- Publication number
- JPS6185151U JPS6185151U JP16869484U JP16869484U JPS6185151U JP S6185151 U JPS6185151 U JP S6185151U JP 16869484 U JP16869484 U JP 16869484U JP 16869484 U JP16869484 U JP 16869484U JP S6185151 U JPS6185151 U JP S6185151U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- flexible sheet
- separation device
- sliding
- elevating stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16869484U JPS6185151U (enExample) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16869484U JPS6185151U (enExample) | 1984-11-08 | 1984-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185151U true JPS6185151U (enExample) | 1986-06-04 |
Family
ID=30726455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16869484U Pending JPS6185151U (enExample) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185151U (enExample) |
-
1984
- 1984-11-08 JP JP16869484U patent/JPS6185151U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR970063678A (ko) | 반도체 웨이퍼를 테이프로 보호하면서 다이싱하는 공정을 포함하는 반도체장치의 제조방법 | |
| EP0289045A3 (en) | Apparatus for fabricating semiconductor devices | |
| JPS6185151U (enExample) | ||
| JPH0328028Y2 (enExample) | ||
| JPS6420734U (enExample) | ||
| JPH05326Y2 (enExample) | ||
| JPS594638U (ja) | 半導体ウエハ固定用接着薄板 | |
| JPS6316669Y2 (enExample) | ||
| JPH0244332U (enExample) | ||
| JPH0450300Y2 (enExample) | ||
| JPS608348Y2 (ja) | 押釦スイツチ装置 | |
| JPS5921158U (ja) | 回転伝達機構の接離装置 | |
| JPS6377041U (en) | Sole pressurizing tool | |
| JPS5869939U (ja) | 保持装置 | |
| JPS58131631U (ja) | 半導体ウエハ固定用軟質接着性薄板 | |
| JPS6226836A (ja) | 半導体素子のピツクアツプ装置 | |
| JPS59185036U (ja) | シ−ト材搬送装置 | |
| JPS60106714U (ja) | シ−ル材の取付け装置 | |
| JPS636808U (enExample) | ||
| JPH01122539U (enExample) | ||
| JPS5494577A (en) | Device for adhering wafer | |
| JPS5865340U (ja) | 減圧式接着装置 | |
| JPS6367065U (enExample) | ||
| JPS5912159U (ja) | 転写紙の剥離ロ−ラ | |
| GB2205268A (en) | Laminate stripping device |