JPS6184874U - - Google Patents

Info

Publication number
JPS6184874U
JPS6184874U JP17008284U JP17008284U JPS6184874U JP S6184874 U JPS6184874 U JP S6184874U JP 17008284 U JP17008284 U JP 17008284U JP 17008284 U JP17008284 U JP 17008284U JP S6184874 U JPS6184874 U JP S6184874U
Authority
JP
Japan
Prior art keywords
pin
contact
pins
sockets
under test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17008284U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17008284U priority Critical patent/JPS6184874U/ja
Publication of JPS6184874U publication Critical patent/JPS6184874U/ja
Pending legal-status Critical Current

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  • Tests Of Electronic Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す構成図、第2
図は従来のICコンタクト治具を示す構成図であ
る。 1…テストボード、2…被試験IC、3a〜3
n…ピン、5…ガイド、6a〜6n…スプリング
コンタクトピン。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is a configuration diagram showing a conventional IC contact jig. 1...Test board, 2...IC under test, 3a-3
n...Pin, 5...Guide, 6a-6n...Spring contact pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路試験装置に被試験ICのピンを接続す
るICコンタクト治具において、テストボードに
ガイドを装着し、該ガイドに大径の受け口を被試
験ICの各ピンに対応させて設け、被試験ICの
ピンの太さに対応した口径のスプリングコンタク
トピンを前記各受け口内に、被試験ICのピンと
端面同士を突き当てて接触させる姿勢に保持して
設けたことを特徴とするICコンタクト治具。
In an IC contact jig that connects the pins of an IC under test to an integrated circuit testing device, a guide is attached to the test board, and large diameter sockets are provided on the guide corresponding to each pin of the IC under test. An IC contact jig characterized in that a spring contact pin having a diameter corresponding to the thickness of the pin is provided in each of the sockets and held in a position such that the pins of the IC to be tested and their end surfaces abut and come into contact with each other.
JP17008284U 1984-11-09 1984-11-09 Pending JPS6184874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17008284U JPS6184874U (en) 1984-11-09 1984-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17008284U JPS6184874U (en) 1984-11-09 1984-11-09

Publications (1)

Publication Number Publication Date
JPS6184874U true JPS6184874U (en) 1986-06-04

Family

ID=30727789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17008284U Pending JPS6184874U (en) 1984-11-09 1984-11-09

Country Status (1)

Country Link
JP (1) JPS6184874U (en)

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