JPS6184017A - Mask conveying device - Google Patents
Mask conveying deviceInfo
- Publication number
- JPS6184017A JPS6184017A JP59204073A JP20407384A JPS6184017A JP S6184017 A JPS6184017 A JP S6184017A JP 59204073 A JP59204073 A JP 59204073A JP 20407384 A JP20407384 A JP 20407384A JP S6184017 A JPS6184017 A JP S6184017A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- light
- obverse
- conveying device
- reverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000032258 transport Effects 0.000 claims 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の分野)
本発明は半導体露光装置で用いられるマスク搬送装置に
関し、特にマスクカセット内、マスク搬送路の途中およ
びマスク装填位置のいずれかにマスクの表裏を検知する
手段を設けることによりマスクのミスセツティングを防
止したマスク搬送装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a mask transport device used in a semiconductor exposure apparatus, and in particular detects the front and back sides of a mask within a mask cassette, in the middle of a mask transport path, or at a mask loading position. The present invention relates to a mask conveying device that prevents mask missetting by providing means.
(発明の青票)
従来の半導体露光vt置においては、マスクの装着はマ
スクが手で持てる程度の大きさであったこと、マスクの
交換が繁雑でないこと等から手作業によって行なわれて
いた。(Blue slip of the invention) In conventional semiconductor exposure VT systems, the mask was attached manually because the mask was small enough to be held in the hand and because changing the mask was not complicated.
しかし、近年集積回路の高集積化や高密度化が急激に進
み、さらに1チツプ当たりのコスト低減を図るために歩
留りの向上が強く望まれるようになってきており、従来
の手作業ではマスクの装着の際に付着するゴミや汚れ等
により上記要望が満足されない場合がしばしば生ずる。However, in recent years, the integration and density of integrated circuits have rapidly increased, and there has been a strong desire to improve yields in order to further reduce the cost per chip. The above requirements are often not met due to dust, dirt, etc. that adhere during installation.
ざらに歩留り向上を目的としてウェハが大口径化し、こ
れに伴いマスクも大きくなり、手で持つことが困難にな
−りつつある。Wafer diameters are becoming larger in order to improve yields, and masks are also becoming larger, making it difficult to hold them in the hand.
そこで最近ではマスクを自動的に搬送できる装置がいく
つか提案されている。例えば、マスクか収納されたマス
クカレットを複数枚装填でき、このマスクカセットから
マスクを取り出し、マスクステージに設けられたマスク
チャックへ自動的に’m送する線面を有しているものが
知られている。Recently, several devices have been proposed that can automatically transport masks. For example, there is a known device that can load a plurality of mask cullets containing masks, and has a linear surface that takes out the mask from this mask cassette and automatically feeds it to a mask chuck provided on a mask stage. ing.
しかし、この装置においてもマスクをマスクカセットに
収納する作業は人の手を介して行なわれるため、作業者
が誤ってマスクを表裏逆に入れてしまった場合、裏返し
のままマスクがマスクチャックにy12送されそのまま
焼付けが行なわれてしまうという欠点があった。However, even with this device, the work of storing the mask in the mask cassette is done manually, so if the worker accidentally inserts the mask inside out, the mask will be placed inside out in the mask chuck. There was a drawback that printing was performed as it was sent.
(発明の目的および慨要)
本発明は、上記従来技術の欠点を除去するため、マスク
110送装置において、焼付けが行なわれる前の段階で
マスクの表裏を自UJ的に検知する手段を設【プるとい
う構想に基づき、マスクのミスセツティングを防止する
ことを目的とする。(Objective and Summary of the Invention) In order to eliminate the drawbacks of the prior art described above, the present invention provides a means for automatically detecting the front and back sides of the mask in the mask 110 feeding device at a stage before printing is performed. The purpose is to prevent missetting of masks based on the concept of "Pull".
(実施例の説明) 以下、図面に従って本発明の詳細な説明する。(Explanation of Examples) Hereinafter, the present invention will be described in detail with reference to the drawings.
第1図(a>はマスク搬送装置のマスクハンド部の斜視
図で、同図(b)は同図(a>の縦断面図である。同図
にJ5いて、1はマスク、2はマスクカセットの下蓋、
3はマスクカセットを1般送する)A−り、4は表裏検
知センサを喝えたアーム、5はマスク1を搬送するマス
クハンド、および6は表裏検知センIすである。Fig. 1 (a) is a perspective view of the mask hand section of the mask transport device, and Fig. 1 (b) is a vertical cross-sectional view of the same figure (a). cassette bottom cover,
Reference numeral 3 designates an arm (A) for transporting the mask cassette once, 4 an arm with a front/back detection sensor, 5 a mask hand for transporting the mask 1, and 6 a front/back detection sensor I.
同図(a)において、マスク1はマスクカセットの下蓋
2に収納された状態でフォーク3により、マスクハンド
5の下に搬送される。ここで、マスク1はマスクハンド
5に備えられたマスク位置決め礪構により自動的に位胃
決めされる。この際、同図(b)に示すようにマスク1
下面にアーム4によって表裏検知センサ6が配置されマ
スク1の表裏が正常か否か判定し、正常でなければ警報
を発する。In FIG. 3A, the mask 1 is conveyed under the mask hand 5 by the fork 3 while being stored in the lower lid 2 of the mask cassette. Here, the mask 1 is automatically positioned by a mask positioning mechanism provided in the mask hand 5. At this time, as shown in the same figure (b), the mask 1
A front and back detection sensor 6 is arranged on the lower surface by an arm 4 to determine whether the front and back sides of the mask 1 are normal or not, and if not normal, an alarm is issued.
次に、本発明の表裏検知メカニズムの詳細を説明する。Next, details of the front/back detection mechanism of the present invention will be explained.
第2図(a)および(b)は、表裏検知センサとして光
学的センサを用いた場合の表裏検知メカニズムを説明す
る図である。FIGS. 2(a) and 2(b) are diagrams for explaining the front/back detection mechanism when an optical sensor is used as the front/back detection sensor.
同図において、マスク1の下面(表面)には、金属+1
!J 7がコーティングされており、表裏が正常である
場合は、同図(a>に示すように発光素子6aから出た
光は、金属膜7で反則し受光素子6bのと=ろに戻って
くる。しかし、同図(b)に示すように、マスクの表裏
が逆であった場合は発光素子6aから出た光は、受光素
子6bには戻ってこ4丁いため表裏が逆であることが認
識される。In the same figure, the lower surface (surface) of the mask 1 has metal +1
! If J7 is coated and the front and back sides are normal, the light emitted from the light emitting element 6a is reflected by the metal film 7 and returns to the light receiving element 6b as shown in the figure (a>). However, as shown in Figure (b), if the front and back sides of the mask are reversed, the light emitted from the light emitting element 6a will return to the light receiving element 6b, so the front and back sides will not be reversed. Recognized.
また同様に表裏検知センサとして光学的センサを用いた
例として第3図のような配置をとることら可能である。Similarly, an arrangement as shown in FIG. 3 can be used as an example of using an optical sensor as the front/back detection sensor.
すなわち、同図(a)に示すように表裏が1児である場
合は発光素子6aから′出た)には、金属膜7で反射し
受光素子6bに達しないが、同図(b)に示すようにマ
スクの表裏が逆であった場合は発光諧子6aから出た光
は受光素子6bにjヱするため表裏が逆であることが認
識されるっ
第4図(a ) A3よび(b)は、表裏検知センサと
して電気的センサを用いた場合の表裏検知メカニズムを
説明する図である。In other words, as shown in Figure (a), when the front and back sides are single, the light emitted from the light emitting element 6a is reflected by the metal film 7 and does not reach the light receiving element 6b, but as shown in Figure (b). If the front and back of the mask are reversed as shown in FIG. b) is a diagram illustrating a front/back detection mechanism when an electric sensor is used as the front/back detection sensor.
同図において、静電容量センサ8はマスク1の下面に配
置された時、金属膜7との間隔の差によって静°取容呈
に差が生ずるため表装を判定することが可能となる。ま
た、金属膜部7に電極を接触させて導通の有無を調べる
方式も適用できる。In the figure, when the capacitance sensor 8 is disposed on the lower surface of the mask 1, the difference in the distance between the capacitance sensor 8 and the metal film 7 causes a difference in static absorption, making it possible to determine whether the capacitance sensor 8 is covered or not. Furthermore, a method of testing whether there is continuity by bringing an electrode into contact with the metal film portion 7 can also be applied.
なお、上述の実施例においては、マスク搬送路の途中に
表裏検知センサを配置するようにしているが、マスクの
表裏検知手段は焼付けが行なわれる前の段階であればマ
スクカセット内およびマスク装填装置のいずれに設けて
もよい。In the above-mentioned embodiment, the front/back detection sensor is arranged in the middle of the mask conveyance path, but the front/back detection means for the mask can be installed inside the mask cassette or in the mask loading device before printing is performed. It may be provided in either.
(発明の効宋)
以上説明したように、本発明によれば焼付けを行なう館
の段階でマスクの表裏を検知することができるため、マ
スクの表裏のミスセツティングを未然に防止しマスクが
裏返しにセットされたまま焼付けが行なわれることを防
止できる。(Effects of the Invention) As explained above, according to the present invention, since it is possible to detect the front and back sides of the mask at the stage of printing, it is possible to prevent missetting of the front and back sides of the mask and prevent the mask from turning over. This prevents the printer from being burned while the printer is still set.
第1図(a)はマスク搬送装置のマスクハンド部の斜視
図、
同図< b’ >は同図(a)の縦断面図、第2図およ
び第3図は表裏検知センサとして尤学的センサを用いl
;場合の表廖検知メカニズムを説明する図、並びに、
第4図は表裏検λ0レンサとして電気的センサを用いた
場合の表裏検知メカニズムを説明する図である。
1・・・マスク、2・・・マスクカセットの下蓋、3・
・・フォーク、4・・・アーム、5・・・マスクハンド
、6・・・表災i尖知センサ、6a・・・発光素子、6
b・・・受光索子、7・・・金属膜、8・・・静電容量
センサ。Figure 1(a) is a perspective view of the mask hand section of the mask transport device, Figure <b'> is a vertical sectional view of Figure 1(a), and Figures 2 and 3 are the front and back detection sensors. using a sensor
FIG. 4 is a diagram illustrating the front/back detection mechanism in the case where an electric sensor is used as the front/back detection λ0 sensor. 1... Mask, 2... Lower lid of mask cassette, 3.
...Fork, 4... Arm, 5... Mask hand, 6... Tableware i-sensor, 6a... Light emitting element, 6
b... Light-receiving cable, 7... Metal film, 8... Capacitance sensor.
Claims (1)
このマスクカセットからマスクを取り出してマスクステ
ージに設けられたマスクチャツクへ自動的に搬送する装
置であって、マスクカセット内、マスク搬送路の途中お
よびマスク装填装置のいずれかにマスクの表裏を検知す
る手段を設けたことを特徴とするマスク搬送装置。 2、前記表裏検知手段が光学的センサである特許請求の
範囲第1項記載のマスク搬送装置。 3、前記表裏検知手段として電気的センサを用いること
を特徴とする特許請求の範囲第1項記載のマスク搬送装
置。[Claims] 1. A plurality of mask cassettes each containing a mask;
A device that automatically takes out a mask from this mask cassette and transports it to a mask chuck provided on a mask stage, and means for detecting the front and back sides of the mask either in the mask cassette, on the mask transport path, or in the mask loading device. A mask conveying device characterized by being provided with. 2. The mask conveying device according to claim 1, wherein the front/back detection means is an optical sensor. 3. The mask conveying apparatus according to claim 1, wherein an electric sensor is used as the front/back detection means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59204073A JPS6184017A (en) | 1984-10-01 | 1984-10-01 | Mask conveying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59204073A JPS6184017A (en) | 1984-10-01 | 1984-10-01 | Mask conveying device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6184017A true JPS6184017A (en) | 1986-04-28 |
Family
ID=16484317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59204073A Pending JPS6184017A (en) | 1984-10-01 | 1984-10-01 | Mask conveying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6184017A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190003354A (en) * | 2017-06-30 | 2019-01-09 | 캐논 가부시끼가이샤 | Imprint apparatus and method of manufacturing article |
JP2019062150A (en) * | 2017-09-28 | 2019-04-18 | キヤノン株式会社 | Imprint device, imprint method, and article manufacturing method |
-
1984
- 1984-10-01 JP JP59204073A patent/JPS6184017A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190003354A (en) * | 2017-06-30 | 2019-01-09 | 캐논 가부시끼가이샤 | Imprint apparatus and method of manufacturing article |
JP2019012792A (en) * | 2017-06-30 | 2019-01-24 | キヤノン株式会社 | Imprint device and article manufacturing method |
JP2019062150A (en) * | 2017-09-28 | 2019-04-18 | キヤノン株式会社 | Imprint device, imprint method, and article manufacturing method |
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