JPS6183038U - - Google Patents

Info

Publication number
JPS6183038U
JPS6183038U JP16727384U JP16727384U JPS6183038U JP S6183038 U JPS6183038 U JP S6183038U JP 16727384 U JP16727384 U JP 16727384U JP 16727384 U JP16727384 U JP 16727384U JP S6183038 U JPS6183038 U JP S6183038U
Authority
JP
Japan
Prior art keywords
substrate
moving
pellet
mounting area
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16727384U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0217481Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984167273U priority Critical patent/JPH0217481Y2/ja
Publication of JPS6183038U publication Critical patent/JPS6183038U/ja
Application granted granted Critical
Publication of JPH0217481Y2 publication Critical patent/JPH0217481Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1984167273U 1984-11-02 1984-11-02 Expired JPH0217481Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984167273U JPH0217481Y2 (enrdf_load_stackoverflow) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984167273U JPH0217481Y2 (enrdf_load_stackoverflow) 1984-11-02 1984-11-02

Publications (2)

Publication Number Publication Date
JPS6183038U true JPS6183038U (enrdf_load_stackoverflow) 1986-06-02
JPH0217481Y2 JPH0217481Y2 (enrdf_load_stackoverflow) 1990-05-16

Family

ID=30725074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984167273U Expired JPH0217481Y2 (enrdf_load_stackoverflow) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPH0217481Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5715429A (en) * 1980-07-02 1982-01-26 Hitachi Ltd Apparatus for mounting pellet
JPS57173339U (enrdf_load_stackoverflow) * 1981-04-28 1982-11-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5715429A (en) * 1980-07-02 1982-01-26 Hitachi Ltd Apparatus for mounting pellet
JPS57173339U (enrdf_load_stackoverflow) * 1981-04-28 1982-11-01

Also Published As

Publication number Publication date
JPH0217481Y2 (enrdf_load_stackoverflow) 1990-05-16

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