JPH02142534U - - Google Patents
Info
- Publication number
- JPH02142534U JPH02142534U JP1033589U JP1033589U JPH02142534U JP H02142534 U JPH02142534 U JP H02142534U JP 1033589 U JP1033589 U JP 1033589U JP 1033589 U JP1033589 U JP 1033589U JP H02142534 U JPH02142534 U JP H02142534U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wafer
- heater rail
- rail
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989010335U JPH0729635Y2 (ja) | 1989-01-30 | 1989-01-30 | ダイボンダ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989010335U JPH0729635Y2 (ja) | 1989-01-30 | 1989-01-30 | ダイボンダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02142534U true JPH02142534U (enrdf_load_stackoverflow) | 1990-12-04 |
JPH0729635Y2 JPH0729635Y2 (ja) | 1995-07-05 |
Family
ID=31513908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989010335U Expired - Lifetime JPH0729635Y2 (ja) | 1989-01-30 | 1989-01-30 | ダイボンダ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729635Y2 (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512746A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Semiconductor base plate joining device |
JPS60211853A (ja) * | 1984-04-05 | 1985-10-24 | Nec Kansai Ltd | 半導体ペレツトマウント装置 |
-
1989
- 1989-01-30 JP JP1989010335U patent/JPH0729635Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512746A (en) * | 1978-07-12 | 1980-01-29 | Matsushita Electronics Corp | Semiconductor base plate joining device |
JPS60211853A (ja) * | 1984-04-05 | 1985-10-24 | Nec Kansai Ltd | 半導体ペレツトマウント装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0729635Y2 (ja) | 1995-07-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |