JPS6182453A - エツチング加工用素材 - Google Patents

エツチング加工用素材

Info

Publication number
JPS6182453A
JPS6182453A JP20477684A JP20477684A JPS6182453A JP S6182453 A JPS6182453 A JP S6182453A JP 20477684 A JP20477684 A JP 20477684A JP 20477684 A JP20477684 A JP 20477684A JP S6182453 A JPS6182453 A JP S6182453A
Authority
JP
Japan
Prior art keywords
etching
carbon content
etching processing
nickel
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20477684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587585B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tsunenori Katou
加藤　凡典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP20477684A priority Critical patent/JPS6182453A/ja
Publication of JPS6182453A publication Critical patent/JPS6182453A/ja
Publication of JPH0587585B2 publication Critical patent/JPH0587585B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP20477684A 1984-09-29 1984-09-29 エツチング加工用素材 Granted JPS6182453A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20477684A JPS6182453A (ja) 1984-09-29 1984-09-29 エツチング加工用素材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20477684A JPS6182453A (ja) 1984-09-29 1984-09-29 エツチング加工用素材

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP28414594A Division JPH07180072A (ja) 1994-10-25 1994-10-25 エッチング加工部品の製造方法
JP23808196A Division JPH09118959A (ja) 1996-09-09 1996-09-09 エッチング加工用素材

Publications (2)

Publication Number Publication Date
JPS6182453A true JPS6182453A (ja) 1986-04-26
JPH0587585B2 JPH0587585B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-17

Family

ID=16496157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20477684A Granted JPS6182453A (ja) 1984-09-29 1984-09-29 エツチング加工用素材

Country Status (1)

Country Link
JP (1) JPS6182453A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188657A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法
JPH03188658A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法
JPH03188656A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210818A (en) * 1976-07-16 1977-01-27 Nisshin Steel Co Ltd High ni-fe alloy of good productivity
JPS5845353A (ja) * 1982-08-18 1983-03-16 Sumitomo Special Metals Co Ltd 耐応力腐食割れ性のすぐれた封着用又は集積回路リードフレーム用Ｆｅ―Ｎｉ合金
JPS6144157A (ja) * 1984-08-09 1986-03-03 Nippon Mining Co Ltd プレス打抜き性に優れたＦｅ−Ｎｉ系合金

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210818A (en) * 1976-07-16 1977-01-27 Nisshin Steel Co Ltd High ni-fe alloy of good productivity
JPS5845353A (ja) * 1982-08-18 1983-03-16 Sumitomo Special Metals Co Ltd 耐応力腐食割れ性のすぐれた封着用又は集積回路リードフレーム用Ｆｅ―Ｎｉ合金
JPS6144157A (ja) * 1984-08-09 1986-03-03 Nippon Mining Co Ltd プレス打抜き性に優れたＦｅ−Ｎｉ系合金

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188657A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法
JPH03188658A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法
JPH03188656A (ja) * 1989-12-19 1991-08-16 Toppan Printing Co Ltd 半導体装置用リードフレーム用材及び半導体装置用リードフレームの製造方法

Also Published As

Publication number Publication date
JPH0587585B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-17

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term