JPS6181153U - - Google Patents
Info
- Publication number
- JPS6181153U JPS6181153U JP16522084U JP16522084U JPS6181153U JP S6181153 U JPS6181153 U JP S6181153U JP 16522084 U JP16522084 U JP 16522084U JP 16522084 U JP16522084 U JP 16522084U JP S6181153 U JPS6181153 U JP S6181153U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- utility
- lead wire
- model registration
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は従来装置の構造図、第２図、第３図は
本考案の一実施例を示す断面図及び組立説明図、
第４図、第５図は本考案に使用するリード線の構
造図、第６図は本考案の他の実施例構造図である
。図において１は半導体チツプ、２，７は半田、
３，３′は接続子（金属片）、４，４′はリード
線、４ａ，４ａ′は凹部、５，８は封止樹脂、６
はケースである。
FIG. 1 is a structural diagram of a conventional device, FIGS. 2 and 3 are sectional views and assembly illustrations showing an embodiment of the present invention,
4 and 5 are structural diagrams of lead wires used in the present invention, and FIG. 6 is a structural diagram of another embodiment of the present invention. In the figure, 1 is a semiconductor chip, 2 and 7 are solder,
3, 3' are connectors (metal pieces), 4, 4' are lead wires, 4a, 4a' are recesses, 5, 8 are sealing resin, 6
is the case.
Claims (1)
リード線に直接もしくは接続子を介して半導体チ
ツプを接合し、該接合部を含む半導体チツプを樹
脂封止したことを特徴とする樹脂モールド型半導
体装置。 (2) 封止樹脂外に延在するリード線の凹部に半
田を充填せしめたことを特徴とする実用新案登録
請求の範囲第(1)項記載の樹脂モールド型半導体
装置。[Claims for Utility Model Registration] (1) A semiconductor chip is bonded directly or via a connector to a lead wire having a circular cross section with a recess formed along the axis, and the semiconductor chip including the bonded portion is sealed with resin. A resin molded semiconductor device characterized by: (2) The resin-molded semiconductor device according to claim 1 of the utility model registration, characterized in that the recessed portion of the lead wire extending outside the sealing resin is filled with solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16522084U JPS6181153U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16522084U JPS6181153U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181153U true JPS6181153U (en) | 1986-05-29 |
Family
ID=30723075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16522084U Pending JPS6181153U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181153U (en) |
-
1984
- 1984-10-31 JP JP16522084U patent/JPS6181153U/ja active Pending
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