JPS6176459A - アセチレン基含有イミド - Google Patents
アセチレン基含有イミドInfo
- Publication number
- JPS6176459A JPS6176459A JP59196426A JP19642684A JPS6176459A JP S6176459 A JPS6176459 A JP S6176459A JP 59196426 A JP59196426 A JP 59196426A JP 19642684 A JP19642684 A JP 19642684A JP S6176459 A JPS6176459 A JP S6176459A
- Authority
- JP
- Japan
- Prior art keywords
- bis
- dicarboxyphenoxy
- anhydride
- acetylene
- ethynylphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Indole Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59196426A JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59196426A JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6176459A true JPS6176459A (ja) | 1986-04-18 |
JPH0522699B2 JPH0522699B2 (enrdf_load_stackoverflow) | 1993-03-30 |
Family
ID=16357645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59196426A Granted JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6176459A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005281428A (ja) * | 2004-03-29 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2009046622A (ja) * | 2007-08-22 | 2009-03-05 | Fujifilm Corp | 膜形成用組成物、膜及び電子デバイス |
JP2014051538A (ja) * | 2012-09-05 | 2014-03-20 | Mitsubishi Gas Chemical Co Inc | 芳香族ポリカーボネート樹脂組成物および成形品 |
WO2019039254A1 (ja) * | 2017-08-23 | 2019-02-28 | 宇部興産株式会社 | 電極用バインダー樹脂、電極合剤ペースト、電極、及び電極の製造方法 |
EP3725772A1 (en) * | 2019-04-16 | 2020-10-21 | Shin-Etsu Chemical Co., Ltd. | Compounds and materials for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process |
US20200348595A1 (en) * | 2018-01-23 | 2020-11-05 | Jsr Corporation | Composition, film, and production method of patterned substrate |
US11500292B2 (en) | 2019-04-16 | 2022-11-15 | Shin-Etsu Chemical Co., Ltd. | Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film |
-
1984
- 1984-09-19 JP JP59196426A patent/JPS6176459A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005281428A (ja) * | 2004-03-29 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2009046622A (ja) * | 2007-08-22 | 2009-03-05 | Fujifilm Corp | 膜形成用組成物、膜及び電子デバイス |
JP2014051538A (ja) * | 2012-09-05 | 2014-03-20 | Mitsubishi Gas Chemical Co Inc | 芳香族ポリカーボネート樹脂組成物および成形品 |
WO2019039254A1 (ja) * | 2017-08-23 | 2019-02-28 | 宇部興産株式会社 | 電極用バインダー樹脂、電極合剤ペースト、電極、及び電極の製造方法 |
US20200348595A1 (en) * | 2018-01-23 | 2020-11-05 | Jsr Corporation | Composition, film, and production method of patterned substrate |
EP3725772A1 (en) * | 2019-04-16 | 2020-10-21 | Shin-Etsu Chemical Co., Ltd. | Compounds and materials for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process |
KR20200121757A (ko) * | 2019-04-16 | 2020-10-26 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 유기막 형성용 재료, 반도체 장치 제조용 기판, 유기막의 형성 방법, 패턴 형성 방법, 및 유기막 형성용 화합물 |
JP2020177225A (ja) * | 2019-04-16 | 2020-10-29 | 信越化学工業株式会社 | 有機膜形成用材料、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び有機膜形成用化合物 |
US11500292B2 (en) | 2019-04-16 | 2022-11-15 | Shin-Etsu Chemical Co., Ltd. | Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film |
US11692066B2 (en) | 2019-04-16 | 2023-07-04 | Shin-Etsu Chemical Co., Ltd. | Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film |
Also Published As
Publication number | Publication date |
---|---|
JPH0522699B2 (enrdf_load_stackoverflow) | 1993-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5681967A (en) | Phenylethynyl phthalic anhydride | |
US4251418A (en) | Polyimide oligomers | |
US4299750A (en) | Novel partially acetylene end-capped polyimide oligomers | |
US4255313A (en) | Novel end-capped polyimide oligomers | |
US5689004A (en) | Diamines containing pendent phenylethynyl groups | |
US4276407A (en) | Acetylene terminated imide oligomers which melt at low temperatures | |
JPS63128025A (ja) | ポリイミド | |
US5061784A (en) | Polymers prepared from 4,4'-bis(3,4-dicarboxyphenyl) hexafluoroisopropyl) diphenyl dianhydride | |
JPH02284923A (ja) | 末端変性イミドオリゴマー組成物 | |
JPS6176459A (ja) | アセチレン基含有イミド | |
CN101608019B (zh) | 一种马来酰亚胺封端型聚酰亚胺树脂的制备方法 | |
US5003017A (en) | Heat-curable bismaleimide-alkenyl heterocyclic molding material | |
JPS62270623A (ja) | ビス(4−アミノフエニル)ピラジンおよびその製法、ならびにポリイミドおよびその製法 | |
JPH01129025A (ja) | ポリアミノビスイミド系樹脂組成物 | |
JPH0312105B2 (enrdf_load_stackoverflow) | ||
US4579782A (en) | Laminate comprising fibers embedded in cured amine terminated bis-imide | |
JPH03185066A (ja) | 熱硬化性樹脂組成物 | |
JP2910796B2 (ja) | ポリアミック酸共重合体及びそれからなるポリイミドフィルム並びにそれらの製造方法 | |
JP2957732B2 (ja) | 新規なポリイミド及びその製造法 | |
JPH0312592B2 (enrdf_load_stackoverflow) | ||
JPH0551455A (ja) | 熱硬化性樹脂組成物 | |
JPS63225629A (ja) | ポリイミド系樹脂 | |
JP3249854B2 (ja) | 耐熱積層材用化合物及び耐熱積層材の製造方法 | |
JPH03247623A (ja) | ポリイミド樹脂およびその製造方法 | |
US4889912A (en) | Acetylene terminated aspartimides and resins therefrom |