JPS6172851U - - Google Patents
Info
- Publication number
- JPS6172851U JPS6172851U JP15817384U JP15817384U JPS6172851U JP S6172851 U JPS6172851 U JP S6172851U JP 15817384 U JP15817384 U JP 15817384U JP 15817384 U JP15817384 U JP 15817384U JP S6172851 U JPS6172851 U JP S6172851U
- Authority
- JP
- Japan
- Prior art keywords
- metal cap
- chip
- bump
- flip
- sealing body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案のチツプキヤリヤの一実施例を
示すもので、運搬、試験の取扱いの態様を示す断
面図、第２図は実装の取扱いの態様を示す側面図
である。
図中、１はフリツプチツプ、２はバンプ、３は
金属キヤツプ、４，８は接着材、５は封止体、７
は外部端子、９は基板、１０は導体、をそれぞれ
示す。
FIG. 1 shows an embodiment of the chip carrier of the present invention, and is a cross-sectional view showing how it is handled during transportation and testing, and FIG. 2 is a side view showing how it is handled during mounting. In the figure, 1 is a flip chip, 2 is a bump, 3 is a metal cap, 4 and 8 are adhesives, 5 is a sealing body, and 7
9 represents an external terminal, 9 represents a substrate, and 10 represents a conductor.
Claims (1)
る板状の金属キヤツプと、該金属キヤツプを上方
開口部に被せることで上記フリツプチツプを内部
に収容し、且つこのとき上記バンプと接続する外
部端子を備える箱形の封止体とを有し、これらの
金属キヤツプと封止体を分離可能に接着して組合
せたことを特徴とするフリツプチツプのチツプキ
ヤリヤ。 A box-shaped box that includes a plate-shaped metal cap that is integrally connected to the side opposite to the bump of the flip chip, and an external terminal that accommodates the flip chip inside by covering the upper opening with the metal cap and connects to the bump at this time. 1. A flip-chip chip carrier comprising a metal cap and a sealing body, the metal cap and the sealing body being separably bonded and combined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15817384U JPS6172851U (en) | 1984-10-19 | 1984-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15817384U JPS6172851U (en) | 1984-10-19 | 1984-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172851U true JPS6172851U (en) | 1986-05-17 |
Family
ID=30716156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15817384U Pending JPS6172851U (en) | 1984-10-19 | 1984-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172851U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06203926A (en) * | 1992-12-25 | 1994-07-22 | Yamaichi Electron Co Ltd | Ic socket |
| JP2002231401A (en) * | 2001-01-31 | 2002-08-16 | Molex Inc | Socket connector |
-
1984
- 1984-10-19 JP JP15817384U patent/JPS6172851U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06203926A (en) * | 1992-12-25 | 1994-07-22 | Yamaichi Electron Co Ltd | Ic socket |
| JP2002231401A (en) * | 2001-01-31 | 2002-08-16 | Molex Inc | Socket connector |
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